• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.420-420
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• 2011

결정질 태양전지에서 고효율 달성을 위한 LBC(Local Back Contact) 구조의 중요성이 강조되고 있다. LBC 구조에서 후면 passivation 형성을 위한 SiNX layer를 PECVD로 형성 시, 실리콘 bulk 내로 H+ 원자가 침투하여 Boron과 결합하게 되면 Boron이 bulk 내에서 dopant로 작용을 하지 못하게 되어, 후면에서 p-층을 형성하고, 이는 VOC의 저하를 야기 시킨다. 본 연구에서는 LBC 구조에서 후면 passivation 시 bluk 내 B-H결합으로 인한 태양전지 특성 저하 문제를 해결하기 위해, SiNX를 증착하기 전에 얇은 산화막 barrier를 성장시켜 Bulk 내에 H+ 침투를 최소화 하였다. PECVD를 이용한 N2O 플라즈마 처리, HNO3 Wet Chemical Oxidation의 방법을 통해 substrate와 SiNX 사이에 얇은 oxide 층을 형성하였으며, 각각의 조건에 대해 lifetime 측정을 실시하였다. 그 결과 SiON/SiNx를 이용한 막의 lifetime이 $94.5{\mu}s$로 가장 우수하였고, Reference에 비해 25.4% 증가함을 확인할 수 있었다. 그러나 HNO3/SiNx에서는 30.6%, SiON에서는 84.3% 감소함을 확인하였다. Voc 측정 결과 또한 SiON/SiNx를 이용한 막이 670mV로 가장 우수함을 확인할 수 있었다. 본 연구를 통해 LBC구조에서 후면에 얇게 SiON/SiNx막을 형성함으로서 H+이온의 침투를 저지하여 후면 B-H결합을 막아 태양전지 특성 저하를 감소시키는 것을 확인할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.319-319
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• 2012

현재 폭넓게 이용되고 있는 STI (Shallow Trench Isolation) 공정에서 active edge 부분에 발생하는 기생 transistor의 subthreshold hump 특성을 제어하는 연구가 활발히 이루어지고 있다. 일반적으로 STI 공정을 이용하는 MOSFET에서 active edge 부분의 얇게 형성된 gate oxide, sharp한 active edge 형성, STI gap-fill 공정 중에 생기는 channel dopant out-diffusion은 subthreshold hump 특성의 주된 요인이다. 이와 같은 문제점을 해결하기 위해 active edge rounding process와 channel dopant compensation의 implantation을 이용하여 subthresold hump 특성 개선을 연구하였다. 본 연구는 STI 공정에 필요한 wafer와 phosphorus를 함유한 wafer를 한 chamber 안에서 auto-doping하는 방법을 이용하여 subthresold hump 특성을 구현하였다. phosphorus를 함유한 wafer에서 빠져나온 phosphorus가 STI 공정중인 wafer로 침투하여, active edge 부분의 channel dopant인 boron 농도를 상대적으로 낮춰 active edge 부분의 가 감소하고 leakage current를 증가시킨다. transistor의 channel length, gate width이고, wafer#No가 클수록 phosphorous를 함유한 wafer까지의 거리는 가까워진다. wafer #01은 hump 특성이 없고, wafer#20은 에서 심한 subthreshold hump 특성을 보였다. channel length 고정, gate width를 ~으로 가변하여 width에 따른 영향을 실험하였다. active 부분에 대한 SCM image로 확인된 phosphorus에 의한 active edge 부분의 boron 농도 감소와 gate width vs curve에서 확인된 phosphorus에 의한 감소가 narrow width로 갈수록 커짐을 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.5-6
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• 2005

High performance SiGe heterostructure metal-oxide-semiconductor field effect transistors(MOSFETs) were fabricated using well-controlled delta-doping of boron and SiGe/Si heterostructure epitaxal layers grown by reduced pressure chemical vapor deposition. In this paper, we report 1/f noise characteristics of the SiGe MOSFETs measured under various bias conditions of the gate and drain voltages changing in linear operation regions. From the noise spectral density, we found that the gate and drain voltage dependence of the noise represented same features, as usually scaled with $f^1$. However, 1/f noise was found to be much lower in the device with boron delta-doped layer, by a factor of $10^{-1}\sim10^{-2}$ in comparion with the device fabricated without delta-doped layer. 1/f noise property of delta-doped device looks important because the device may replace bipolar transistors most commonly embedded in high-frequency oscillator circuits.

• Journal of the Korean institute of surface engineering
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• v.32 no.1
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• pp.67-77
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• 1999

The Ni base superalloy Mar-M247 substrate was aluminized or aluminized after boronizing by the pack cementation under Ar atmosphere. The hot corrosion resistance and after-heat-treatment effect of aluminized specimens were studied by the cyclic hot corrosion test in $Na_2SO_4$-NaCl molten salt. XRD analysis showed that the $Ni_2Al_3$ phase was formed between the coated layer and substrate below 1273K but the NiAl phase above 1273K. The peak of the NiAl phase was developed after heat treatment. Corrosion test showed that corrosion resistance of the specimen with the NiAl phase was better than that with the $Ni_2Al_3$ phase. Corrosion resistance could be improved by heat treatment to form ductile NiAl phase, where cracks were not formed by thermal shock on coating layer. Moreover, it appeared that heat treatment played a role to improve corrosion resistance of Al diffusion coating above 1273K. The existence of boron in the Al diffusion coating layer obstructed outwared diffusion of Cr from the substrate, and it influenced on corrosion resistance of the coating layer by weakening adherence of the oxide scale.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.16-22
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• 2019

Indirect oxidation using chlorine species oxidizing agents is often effective in wastewater treatment using an electrochemical oxidation process. When chlorine ions are contained in the wastewater, oxidizing agents of various chlorine species are produced during electrolysis. In a ballast water management system, it is also used to treat ballast water by electrolyzing seawater to produce a chlorine species oxidizer. However, ballast water in the brackish zone and some wastewater has a low chlorine ion concentration. Therefore, it is necessary to study the chlorine generation current efficiency at various chlorine concentration conditions. In this study, the chlorine generating current efficiency of a boron-doped diamond(BDD) electrode and insoluble electrodes are compared with various chloride ion concentrations. The results of this study show that the current efficiency of the BDD electrode is better than that of the insoluble electrodes. The chlorine generation current efficiency is better in the order of BDD, MMO(mixed metal oxide), $Ti/RuO_2$, and $Ti/IrO_2$ electrodes. In particular, when the concentration of sodium chloride is 10 g/L or less, the current efficiency of the BDD electrode is excellent.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.05a
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• pp.221-226
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• 2008

Novel synthetic routes were proposed for hydroxy-terminated Poly(EO-co-THF) by Cationic ring-opening copolymerization of Tetrahydrofuran(THF) and Ethylene oxide(EO). It was carried out using Boron trfluoride tetrahydrofuranate($BF_3$ THF complex) as catalyst in the presence of 1,4-butandiol. The resultant products are well-defined linear polyetherpolyol. Polyurethane(TPU) were prepared using resultant polyetherpolyol with IPDI/N-100 as curing agent and TPB(Triphenylbismuth) /MA(Maleic anhydride) mixture as cure catalyst. Mechanical properties of TPU prepared from poly(EO-co-THF) polyol were investigated and compared with polyurethane using ATK HTPE.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.134.2-134.2
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• 2017

최근 고성능, 저 전력 반도체 소자를 위한 미세 공정 기술이 발전함에 따라, gate oxide의 두께 및 선폭이 감소하고, aspect ratio가 증가하고 있는 추세이다. 따라서 얇아진 gate oxide를 통한 채널 물질로의 boron 확산을 막기 위한 고농도 질화 막 증착의 필요성이 높아지고 있으며, high aspect ratio의 gate oxide에 적용 가능한 우수한 step coverage의 질화막 또한 요구되고 있다. 이러한 요구조건을 만족시키기 위해 일반적인 13.56MHz의 플라즈마 소스를 이용한 질화연구들이 선행되어져 왔으나, 높은 binding energy(~24 eV)를 가지고 있는 N2 molecule gas를 효과적으로 dissociation 하지 못해 충분한 질화공정이 수행되어질 수 없었을 뿐만 아니라 높은 공정온도($>200^{\circ}C$에서 진행되어 반도체소자에 손상을 줄 수 있다. 본 연구에서는 이러한 문제들을 해결하기 위해 VHF (162MHz)를 이용한 플라즈마를 통해 고밀도에서 낮은 전자온도와 높은 진동온도의 플라즈마를 구현하여 20%이상의 높은 질화율을 얻을 수 있었고, multi-tile push-pull 플라즈마 소스를 통해 VHF 사용 시 나타나는 standing wave effect를 제어하여 high aspect ratio의 gate sidewall spacer에 우수한 step coverage의 질화막을 형성시킬 수 있었다.

• Journal of the Korean Vacuum Society
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• v.5 no.1
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• pp.54-61
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• 1996

Indium-tin oxide (ITO) films were deposited on the glass substrate by the reactive -ionized cluster beam deposition(ICBD) method. In the oxygen atmosphere, indium cluster formed through the nozzle is ionized by the electron bombardment and is accelerated to be deposited on the substrate. And tin is simultaneoulsy evaporated from the boron-nitride crucible. The chracteristics of films were examined by the X-ray photoelectron spectroscopy(XPS), glancing angle X-ray diffractrion(GXRD) and the electrical properties. were measured by 4-point-probe and Hall effect measurement system . From the XPS spectrum , it was found that indium and tin atoms combined with the oxygen to form oxide$(In_2O_3, SnO_2)$. In the case of films with high tin-concentration, the GXRD spectra show that the main $In_2O_3$ peak of (222) plane, but also sub peaks((440) peak etc.) and $SnO_2$ peaks were detected. From that results, itis concluded that the heavily dopped tin component (more than 14 at. %) disturbs to form $In_2O_3$(222) phase. Four-point-probe and Hall effect measurement show that, in the most desirable case, the transmittance of the films is more then 90% in visible range and its resistivity is $$\rho$=3.55 \times10^{-4}\Omega$cm and its mobility is $\mu$=42.8 $\textrm{cm}^2$/Vsec.

• Korean Journal of Materials Research
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• v.16 no.3
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• pp.163-167
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• 2006

The transition of europium-doped gadolinium oxide phosphor to gadolinium borate phosphor with the concentration of boron in the spray pyrolysis was investigated. The particles prepared from spray solution below 10 wt% boric acid of prepared phosphor had crystal structure of $Gd_2O_3:Eu$ phosphor, in which the crystallinity of the particles decreased with increasing the boron concentration. A single phase $GdBO_3:Eu$ phosphor particles were prepared from spray solution above 50 wt% boric acid of prepared phosphor. The phosphor particles prepared from spray solution with 20 wt% boric acid of prepared phosphor had no XRD peaks of $Gd_2O_3:Eu$ and $GdBO_3:Eu$ Therefore the phosphor particles prepared from spray solution with 20 wt% boric acid of prepared phosphor had the lowest photoluminescence intensity under ultraviolet and vacuum ultraviolet. $GdBO_3:Eu$ and $Gd_2O_3:Eu$ phosphor particles prepared from spray solutions with proper concentrations of boric acid had good photoluminescence intensity under vacuum ultraviolet. The morphology of the phosphor particles were strongly affected by the concentrations of boric acid added into spray solution.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.3
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• pp.177-184
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• 2014

In chemical vapor deposition(CVD) tungsten silicide(WSix) dual poly gate(DPG) scheme, we observed the fluorine effects on gate oxide using the electrical and physical measurements. It is found that in fluorine-rich WSix NMOS transistors, the gate thickness decreases as gate length is reduced, and it intensifies the roll-off properties of transistor. This is because the fluorine diffuses laterally from WSix to the gate sidewall oxide in addition to its vertical diffusion to the gate oxide during gate re-oxidation process. When the channel length is very small, the gate oxide thickness is further reduced due to a relative increase of the lateral diffusion than the vertical diffusion. In PMOS transistors, it is observed that boron of background dopoing in $p^+$ poly retards fluorine diffusion into the gate oxide. Thus, it is suppressed the fluorine effects on gate oxide thickness with the channel length dependency.