• Journal of Welding and Joining
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• v.20 no.6
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• pp.830-837
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and $Ti_3Ag$ and titanium oxide, $TiO_2$ were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of $900^{\circ}C$ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about $30\mu\textrm{m}$, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• 연구논문집
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• s.24
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• pp.63-79
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• 1994

This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

• Transactions of Materials Processing
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• v.22 no.5
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• pp.269-274
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• 2013

Experiments and numerical simulations of the incremental upsetting test were carried out to investigate void closure behavior and mechanical characteristic of a 1.5wt%C ultra-high carbon steel. The experimental results showed that the voids become quickly smaller as the reduction ratio increases. The simulation results confirmed this behavior and indicated that the voids were completely closed at a reduction ratio of about 40~45% during incremental upsetting. After the completion of the incremental upsetting tests, the process of diffusion bonding was employed to heal the closed voids in the deformed specimens. To check the appropriate temperature for diffusion bonding, deformed specimens were kept at 800, 900, 1000 and $1100^{\circ}C$ for an hour. In order to investigate the effect of holding time for diffusion bonding at $1100^{\circ}C$, specimens were kept at 10, 20, 30, 40, 50 and 60minutes in the furnace. A distinction between closed and healed voids was clearly established using microstructural observations. In addition, subsequent tensile tests demonstrated that complete healing of a closed void was achieved for diffusion bonding temperatures in the range $900{\sim}1100^{\circ}C$ with a holding time larger than 1 hour.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.325-333
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• 2001

The effect of base metal grain size on isothermal solidification behavior of Ni-base superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding of single crystal. coarse-grained and fine-grained CMSX-2 was carried out at 1373∼1548k for various holding time in vacuum. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process for single crystal, coarse-grained and fine-grained base metals. The completion time for isothermal solidification decreased in the order ; single crystal, coarse-grained and fine-grained base metals. The difference of isothermal solidification rates produced when bonding the different base metals could be explained quantitatively by the effect of base metal grain boundaries on the apparent average diffusion coefficient of boron in CMSX-2.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.147-154
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• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.89-96
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GTD-111 was investigated. Bonds were fabricated using a series of holding times(0-7.2ks) at three different temperatures(1403, 1418 and 1453K) under a vacuum of 13.3mPa. In raw material, ${\gamma}$- ${\gamma}$' eutectic phases, platelet η phases, MC carbide and PFZ were seen in interdendritic regions or near grain boundary and size of primary ${\gamma}$' precipitates near interdendritic regions were bigger than core region. The primary ${\gamma}$' precipitates in dendrite core were dissolved early in bonding process, but ${\gamma}$' precipitates near interdendritic regions were dissolved partially and shape changed. The dissolution rate increased with increasing temperature. Phases in interdendritic regions or near pain boundary continually changed with time at the bonding temperature. In the bonding temperature of 1403K, eutectic phases had not significantly changed, but η phases had transformed from platelet shape to needle morphology and PFZ region had widened with time. The interdendritic region and near pain boundary were liquated partially at 1423k and fully at 1453k by reaction of η phases and PFZ. In the bonding temperature of 1453K, interdendritic region and near pain boundary were liquated and then new phases which mixed with η phases, PFZ and MC carbide crystallized during cooling. Crystallized η phases transformed from rod shape to platelet shape with increasing holding time.

• Journal of Korean Tunnelling and Underground Space Association
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• v.11 no.1
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• pp.71-83
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• 2009

Shotcrete is an important primary support for tunnelling in rock. The quality control of shotcrete is a core issue in the safe construction and maintenance of tunnels. Although shotcrete may be applied well initially onto excavated rock surfaces, it is affected by blasting, rock deformation and shrinkage and can debond from the excavated surface, causing problems such as corrosion, buckling, fracturing and the creation of internal voids. This study suggests an effective non-destructive evaluation method of the tunnel shotcrete bonding state applied onto hard rocks using the impact-echo (IE) method and ground penetration radar (GPR). To verify previous numerical simulation results, experimental study carried out. Generally, the bonding state of shotcrete can be classified into void, debonded, and fully bonded. In the laboratory, three different bonding conditions were modeled. The signals obtained from the experimental IE tests were analyzed at the time domain, frequency domain, and time-frequency domain (i.e., the Short- Time Fourier transform). For all cases in the analyses, the experimental test results were in good agreement with the previous numerical simulation results, verifying this approach. Both the numerical and experimental results suggest that the bonding state of shotcrete can be evaluated through changes in the resonance frequency and geometric damping ratio in a frequency domain analysis, and through changes in the contour shape and correlation coefficient in a time-frequency analysis: as the bonding state worsens in hard rock condition, the autospectral density increases, the geometric damping ratio decreases, and the contour shape in the time-frequency domain has a long tail parallel to the time axis. The correlation coefficient can be effectively applied for a quantitative evaluation of bonding state of tunnel shotcrete. Finally, the bonding state of shotcrete can be successfully evaluated based on the process suggested in this study.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.2
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• pp.263-271
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• 2003

The purpose of the present study was to evaluate the patterns of hybrid layer according to the application time and the frequency and its effects on the shear bonding strength of All-In-One system in primary teeth. A single bonding agent(Scotchbond Multi-Purpose Plus, 3M) and an All-In-One system(Prompt L-pop, 3M ESPE) were applied on the dentin varying the application time and the frequency in primary teeth. Shear bond strength was measured and the patterns of hybrid layers were observed by SEM. The following results were obtained ; 1. The shear bonding strength of single bonding agent was significantly higher than that of All-In-One system(P<0.05). 2. The shear bonding strength of All-In-One system applied twice or 3 times were higher than that of applied once (P<0.05). And thickness of the hybrid layer was increased when applied twice or 3 times compared to once. 3. The shear bonding strength of All-In-One system when applied for 15 second and 30 second were higher than that of 7 second (P<0.05). And the hybrid layer thickness of 15 second and 30 second's application time were higher than that of 7 second. 4. Thickness of hybrid layer applied with single bonding agent was $2-4{\mu}m$ and that of All-In-One system was $1-2{\mu}m$.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.863-870
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• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.