• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.583-588
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• 2007

This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.4
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• pp.581-592
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• 2003

The aim of this study was to evaluate the effect of chemo-mechanical caries removal system($Carisolv^{TM}$, Medi Team, Sweden) for resin adhesion to carious primary and permanent dentin compared with conventional drilling method. The buccal surface of 92 primary molars and 92 permanent molars were used. Exposed dentins were occurred artificial caries. 32 tooth of primary molars and 32 tooth of permanent molars were prepared to observe treated dentin surface with $Carisolv^{TM}$ and conventional drilling method by SEM. Other tooth were prepared to measure resin-dentin shear bonding strength according to caries removal methods and dentin adhesive system. Two adhesive systems and a composite resin were used; single bonding agent(Scotchbond Multi-Purpose Plus, 3M) and self-etching bonding system(Prompt L-pop, 3M ESPE), and a composite resin (Z-250, 3M). The results were as follows : 1. The removal effect of carious dentin on $Carisolv^{TM}$ was stronger on the primary dentin than that to permanent dentin, and dentin surface became rougher with treated $Carisolv^{TM}$ than drilling method. 2. Acid-etched dentin surfaces were showed smoothening without smear layer. 3. In specimen applied single bonding system hybrid layer and adhesive layer were $2-4{\mu}m$ and $10-15{\mu}m$ in thickness, whereas self-etching bonding system were showed only thin hybrid layer($1-2{\mu}m$). 4. The shear bonding strength of group applied single bonding agent was higher than that applied self-etching priming system(P<0.05). 5. The shear bonding strength of group applied $Carisolv^{TM}$ and self-etching priming system were slightly higher than that applied conventional drilling method and self-etching priming system(P>0.05).

• Journal of the korean academy of Pediatric Dentistry
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• v.26 no.1
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• pp.53-61
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• 1999

Newley developed dentin bonding system which contains self-etching primer performed the removing of smear layer and etching procedure at once. So, it make possible more simple and shorter working time, the stronger bonding strength than conventional dentin bonding system. Cavities were prepared in the buccal and lingual surface of 30 extracted primary molars, and randomly assigned into three equal groups of 10 each. All cavities were filled with Z-100 composite resin following manufacturer's specifications after priming of three different dentin bonding system. Specimens stored for 7 days in 37 degree C water, thermocycled for 1000 cycles between 5 degree C and 55 degree C, immersed in 50% silvernitrate solution for 24 hours, and embedded in resin before being sectioned longitudinally. Data were analyzed by t-test and ANOVA. Mac-Bond II and Clearfil Linear-Bond II showed less microleakage at the occlusal and gingival margins compared to Scotchbond Multi Purpose. All dentin bonding systems showed significantly less microleakage at the occlusal margins compared to the gingival margins. But, there were no significantley difference between each group.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.93-94
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• 2006

The sheath of a single-conductor cable for ac service acts as a secondary of a transformer, the current in the conductor induces a voltage in the sheath. When the sheaths of single-conductor cables are bonded to each other, as is common practice for multi-conductor cables, the induced voltage causes current to flow in the completed circuit. This current causes losses in the sheath. Various methods of bonding may be used for the purpose of minimizing sheath losses. In korea, sheath cross bonding system was employed for the prevention of sheath losses, the sheaths wire subjected to at voltages, and the bonding was designed to keep the magnitude of the induced voltages within small limits so as to prevent the possibility of sheath corrosion. But, sheath cross bonding system without transposition of cable can not achieve an exact balance of induced sheath voltages unless the cables are lain in trefoil. This paper describes a transposition system with sheath cross bonding using EMTP(Electromagnetic Transient Program). The transposition system with cross bonding can be extended to longer cable circuits for laid in flat as wall as trefoil by the methods described in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Proceedings of the KIEE Conference
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• 2008.11a
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• pp.119-121
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• 2008

In underground power cable system, the device for limiting over-voltage is needed when transient over-voltage break out between sheath and ground. For this reason, the SVL(Sheath Voltage Limiter) has been applied on weak points. But the broken SVLs which are installed on the single point bonding system on underground cable are frequently found. In this paper, EMTP(Electromagnetic Transient Program) is utilized to analyze effects on the installation methodology of the parallel ground conductor and SVL for the single point bonding system on the underground cable. The result shows that the proposed installation methodology can be applied for single point bonding system and contribute for power system stabilization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.385-386
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• 2009

This paper deals with assessment of equipotential bonding and electrical continuity in Buinding by investigation on the spot at construction site. The assessment was carried out for continuity of steelwork in reinforced concrete structure, bonding conductor, protective conductor. A new grounding system based on international standards includes unity grounding system, structure grounding utilizing steel reinforced concrete, equipotential bonding, use of surge protective device.

• Journal of the Korean Wood Science and Technology
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• v.43 no.5
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• pp.682-690
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• 2015

The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.293-299
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• 2005

It is important to reduce chair time and procedure in restorative treatment for children. Composite resin is not only used in esthetic restoration of anterior teeth but also posterior teeth by its improved physical property. The 7th generation dentin bonding system was recently developed in order to simplify three steps which is needed to bond composite resin to tooth surface-etchant, primer, adhesive. We compared shear bond strengths of 4, 5, 6, 7th generations dentin bonding systems. The primary dentin was pretreated with 4, 5, 6, 7th generation dentin bonding systems. Then composite resin was cured to the specimen using molds 2.5mm in diameter and 2mm in height. Thermocycling was performed and shear bond strength was finally measured. The results were as follow; 1. The mean values of shear bond strengths in 5th generation dentin bonding system(group 2) were greater than those of 4, 6, 7th generation dentin bonding system(group 1, 3, 4). The differences were statistically significant. 2. The mean values of shear bond strengths in 4th generation dentin bonding system(group 2) were greater than those of 6, 7th generation dentin bonding system(group 1, 3, 4). But, the differences were not statistically significant. 3. Between the mean values of shear bond strengths in 6, 7th generation dentin bonding system(group 3, 4) were similar.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.470-471
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• 2008

SVL is installed at underground transmission system to protect cables and insulation joint-box from overvoltages caused by lightning, switching, and line-to-ground fault. Domestic underground power system adopts cross bonding type to reduce the induced voltage at sheath, but single-point bonding is required depending the system installation configuration. SVL can be easily broken by overvoltages induced at joint-box because single-point bonding has uneffective system structure to extract fault current. ANSI/IEEE recommends Parallel Ground Continuity Conductor(PGCC) to prevent SVL breakdown. In this paper, EMTP simulation is performed to analyze effects on SVL under PGCC installation when single-line-to-ground fault occurs. The result shows that PGCC and short single-point bonding distance can reduce overvoltages at SVL.