• Proceedings of the Korean Fiber Society Conference
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• 2003.04a
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• pp.146-149
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• 2003

There are three major bonding types such as chemical bonding, thermal bonding, mechanical bonding to produce nonwoven fabrics. The development of the past few years has shown that the share of thermally bonded webs is growing steadily. The viability of the thermal bonding process is rooted in the price advantage obtained by lower energy costs. However, the thermal bonding process also obtains the quality requirements of the market place. (omitted)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.228-228
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• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.9
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• pp.656-661
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• 1999

As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

• Journal of Welding and Joining
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• v.18 no.6
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• pp.62-67
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• 2000

Metallurgical characteristics of bonded region and high temperature mechanical properties of heat resistant alloy, Fe-35Ni-26Cr during liquid phase diffusion bonding were investigated employing AM17 insert metal. The insert metal for bonding, AM17 was newly developed Ni-base metal using interpolation method. Bonding of specimens were carried out at 1,403~1,463K for 600s in vacuum. The microconstituents in the bonded interlayer disappeared in the bonding temperature over 1,423K. The microstructures, alloying elements and hardness distribution in the base metal. The tensile strength and elongation of the joints at elevated temperatures were the same level as one of the base metal in the bonding temperature over 1,423K. The creep rupture strength and rupture lives of joints were almost identical to those of base metal.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.30 no.4
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• pp.35-41
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• 1998

The bacterial cellulose has many unique properties that are potentially and commercially beneficial. In order to make opaque product from this cellulose, filling properties by fillers should be known. This study was performed to investigate the effect of filler addition on physical properties of sheets from bacterial cellulose. The effect of filling on its optical properties was also discussed. The apparent density and internal bonding strength of bacterial cellulose sheet are decreasing with the increase of filler contents. Those adversely affect Young's modulus and physical property of the sheet, but these negative phenomena of the bacterial cellulose sheet by filler addition are not so sensitive compared to substantial decreasing of physical properties of ordinary hardwood KP. This strength decrease would be attributed to the decrease of relative bonding sites among pulp fibers. Concerned to optical properties, the bacterial cellulose sheet shows high increase of brightness and opacity according to filler loading, but no significant changes in porosity up to 17.3% loading because of fine and filamentous structure of bacterial cellulose fibers.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.30 no.2
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• pp.47-54
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• 1998

Refining is one of the most important processes of fiber treatment that provides optical and physical properties of final paper products. The evaluation method of refining progress is usually freeness (CSF) or wetness (SR) test because of its rapidity and convenience. However, there are some deficiencies in using freeness or wetness test to evaluate pulp fibers accurately because its results are more influenced by fines contents than extent of fibers treatment. The objective of this study is to show the deficiency of wetness in evaluating the refining process. For this, beating is done by varying the beating load. Handsheets are made after beating until 25 and $32^{\circ}C$ SR, and then paper properties are measured. Refined fibers are analyzed by fiber length, fines contents, curl, kink, WRV, and zero-span tensile strength. The results show that longer beating time is required to reach the same wetness at lower beating load. There are differences in the average fiber length, distribution curve of fiber length, fines contents, curl, kink, WRV of long fiber fraction, drainage time, and zero-span tensile strength of rewetted sample at different beating load. At the low beating load in the same wetness, apparent density, breaking length, burst strength, and tear strength are higher, while opacity and air permeability are lower than those of the high beating load. Using Page s equation, which shows the relationship among tensile strength, intrinsic fiber strength, and interfiber bonding strength, interfiber bonding strength is calculated and analyzed to explain final paper properties. At $25^{\circ}C$ SR, interfiber bonding strength is only slightly higher at 2.5kgf beating load, while the intrinsic fiber strength is substantially higher. At $32^{\circ}C$ SR, intrinsic fiber strength is a little bit higher at 2.5kgf beating load, and interfiber bonding strength is remarkably higher than those of 5.6kgf beating load. These results can be used to explain the different properties of the final paper at selected beating loads.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• Journal of Technologic Dentistry
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• v.35 no.4
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• pp.359-364
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• 2013

Purpose: This study was to observe characteristic of metal oxidation and bonding strength according to composition of Ni-Cr alloy for porcelain fused to metal crown. The three kinds of Ni-Cr alloy with different composition ratio of parent metal were observed general properties and chemical properties of each alloy surface and measured the shear bonding strength between ceramic and each alloys. The aim of study was to suggest the material for design of parent metal's composition ratio to development of alloy for porcelain fused to metal crown. Methods: The three kinds of alloy as test specimen was Ni(59wt%)-Cr(24wt%), Ni(67wt.%)-Cr(16wt.%) alloy and Ni(71wt%)-Cr(12wt%)alloy. The oxide on surface was observed by EDX. And the shear test was performed by MTS. Results: The surface property and oxide characteristic analysis of oxide layer, weight percentage of Element O within $Ni_{59}Cr_{24}$ alloy measured 23.03wt%, $Ni_{67}Cr_{16}$ alloy measured 21.13wt% and $Ni_{71}Cr_{12}$ alloy was measured 48.55wt%. And the maximum shear bonding strength was measured 58.02Mpa between $Ni_{59}Cr_{24}$ alloy and vintage halo(H2 group). Conclusion: The surface property and oxide characteristic three kind of Ni-Cr alloy was similar. and shear bonding strength showed the highest bonding strength in H2 specimens.