• Journal of Adhesion and Interface
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• v.1 no.1
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• pp.30-37
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• 2000

This study focused on the direct blending of bonding agents (resorcinol, hexamethylenetetramine, NaOH) into rubber compound to simplify the composite manufacturing process. The mechanism of direct blending system was studied by comparing the following two cases. The one is direct blending of bonding agents into rubber compound and then allows the reaction (Case I). The other is mixing of reactant obtained by reaction of bonding agents (Case II). According to the morphology analysis, the Case II showed the clean interfacial area between bonding agents and matrix rubber, while the Case I created the new interphase under proper processing condition. Also, the optimum adhesion strength between SBR and nylon cord could be obtained with bonding agents whose molar ratios of resprcinol/hexamethylenetetramine was 1.2/1 in the recipes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.367-372
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• 2020

As packaging processes for atomic gyroscope vapor cells, the glass tube tip-off process, anodic bonding, and paste sealing have been widely studied. However, there are stability issues in the alkali metal which are caused by impurity elements and leakage during high-temperature processes. In this study, we investigated the applicability of a vapor cell low-temperature packaging process by depositing Au on a Pyrex cell in addition to forming an Au-Sn thin film on a cap to cover the cell, followed by laser irradiation of the Au/Au-Sn interface. The mechanism of the thin film bonding was evaluated by XRD, while the packaging reliability of an Ne gas-filled vapor cell was characterized by variation of plasma discharge behavior with time. Furthermore, we confirmed that the Rb alkaline metal inside the vapor cell showed no color change, indicating no oxidation occurred during the process.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.4
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• pp.38-44
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• 2007

Combat vehicles are frequently maneuvered in battlefields when the lives of combatants are being threatened. These vehicles are important elements that influence the consequences of a battle. Their armor must be lightweight and provide excellent protection to ensure successful operations. Ceramic composite armor has recently been developed by many countries to fulfill these requirements. We reviewed previous research to determine an effective armor design, and then fabricated a composite armor structure using $Al_2O_3$ and glass fiber-reinforced polymer. Specimens were manufactured under controlled conditions using different backing plate thicknesses and bonding methods for the ceramic layer and the backing plate. The penetration of an armor-piercing bullet was evaluated from ballistic protection tests. The bonding method between the ceramic layer and the fiber-reinforced polymer influenced the ballistic protection performance. A bonding layer using rubber provided the best protection.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.452-455
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• 2009

A cost-effective route to synthesize $\beta$-SiAlONs from Si mixtures by reaction bonding followed by post-sintering was investigated. Three different z values, 0.45, 0.92 and 1.87, in $Si_{6-z}Al_zO_zN_{8-z}$ without excess liquid phase were selected to elucidate the mechanism of SiAlON formation and densification. For RBSN (reaction-bonded silicon nitride) specimens prior to post-sintering, nitridation rates of more than 90% were achieved by multistep heating to $1400^{\circ}C$ in flowing 5%$H_2$/95%$N_2$; residual Si was not detected by XRD analysis. An increase in density was acquired with increasing z values in post-sintered specimens, and this tendency was explained by the presence of higher amounts of transient liquid phase at larger z values. Measured z values from the synthesized $\beta$-SiAlONs were similar to the values calculated for the starting compositions. Slight deviations in z values between measurements and calculations were rationalized by a reasonable application of the characteristics of the nitriding and post-sintering processes.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.6.2-6.2
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• 2009

Ultra-fine grained (UFG) Al alloys, which have submicron grain structures, are expected to show outstanding high strength at ambient temperature and excellent superplastic deformation at elevated temperatures and high strain rate. In order to get the UFG microstructure, various kind of severe plastic deformation (SPD) processes have been developed. Among these processes, accumulative roll bonding (ARB) process is a promising process to make bulky Al sheets with ultrafine grained structure continuously. The purpose of the present study is to clarify the grain refinement mechanism during the ARB process and to investigate on the effects of ultra-fine grained structure on the mechanical properties. In addition, UFG AA8011 alloy (Al-0.72wt%Fe-0.63wt%Si) manufactured by the ARB had fairly large tensile elongation, keeping on the strength. In order to clarify the reason for the increase of elongation in the UFG AA8011 alloy, detailed microstructural and crystallographic analysis was performed by TEM/Kikuchi-line and SEM/EBSP method. The unique tensile properties of the UFG AA8011 alloy could be explained by enhanced dynamic recovery at ambient temperature, owing to the large number of high angle boundaries and the Al matrix with high purity.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.315-321
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• 2004

The void evolution in direct bonding process of $Si/Si_3$$N_4$ ∥ $SiO_2$/Si silicon wafer pairs has been investigated with an infrared camera. The voids that formed in the premating process grew in the conventional furnace annealing process at a temperature of $600^{\circ}C$. The voids are never shrunken even with the additional annealing process at the higher temperatures. We observed that the voids became smaller and disappeared with sequential scanning by our newly proposed fast linear annealing(FLA). FLA irradiates the focused line-shape halogen light on the surface while wafer moves from one edge to the other. We also propose the void shrinking mechanism in FLA with the finite differential method (FDM). Our results imply that we may eliminate the voids and enhance the yield for the direct bonding of wafer pairs by employing FLA.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.549-555
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• 1996

Diamond Like Carbon film is amorphous film which is considered to consist of three coordinate graphite structure and tetrahedron coordinate diamond structure. Its hardness, thermal conductivity and chemical stability are nearly to one of diamond. It is well known to become semi-conductor by doping of inpurity. In this study Diamond Like Carbon film was synthesized by Microwave Plasma CVD in the gas mixture of hydrogen-methan-nitrogen and doped of nitrogen on the single-crystal silicon or silica glass. The temperature of substrate and nitrogen concentration in the gas mixture had an effect on the bonding state, structural properties and conduction mechanism. The surface morphology was observed by Scanning Electron Microscope. The strucure was analyzed by laser Raman spectrometry. The bonding state was evaluated by electron spectroscopy. Diamond Like Carbon film synthesized was amorphous carbon containing the $sp^2$ and $sp^3$ carbon cluster. The number of $sp^2$ bonding increased as nitrogen concentration increased from 0 to 40 vol% in the feed gas at 1233K substrate temperature and at $7.4\times10^3$ Pa. Increase of nitrogen concentration made Diamond Like Carbon to be amorphous and the doze of nitragen could be controlled by nitrogen concentration of feed gas.

• Journal of Welding and Joining
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• v.19 no.5
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• pp.534-539
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• 2001

The formation mechanism of microconstituents in brazed joints of duplex stainless steel and Cr-Cu alloy which is an essential process of rocket engine manufacturing was investigated using Cu base insert metal. $SUS329J_3L$ and C18200 were used for base metal and AMS 4764 was used for insert metal. The brazing was carried out under various conditions. There were various phases in the joints, because of reaction between liquid insert metal and base metals. Since liquid insert metal reacts with duplex stainless steel, liquid Cu from insert metal infiltrated into the $\alpha/\beta$ interface of duplex stainless steel. Through the process of Cu infiltration, isolated stainless steel pieces come into the liquid insert metal. Since liquid insert metal reacts with Cr-Cu alloy. Cr precipitates from C18200 come into the liquid insert metal. With increment of bonding temperature and holding time, amounts and sizes of phases increased. but Cr-Mn compounds decreased at 1303k for 1.2ks and Mn-rich phases disappeared Fe-Cr compounds formed.

• Journal of the Korean Ceramic Society
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• v.11 no.1
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• pp.3-9
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• 1974

The role of added metal oxide in the adherence mechanism of low melting glass to several metal plates such as oxygen free high conducting copper, low carbon steel, chrominum galvanized on copper, and stainless steel was investigated. The metal oxide which added to glass were cupric oxide, ferric oxide, chromic oxide, and stainless steel oxide. The glass to that various metla oxide were added, sealed with several metal plates in the electric furnace at $650^{\circ}C$ for 5 minutes. The results as follows; 1) The interfacial reaction was promoted and strong chemical bonding with glass and metals by which the surface energy was decreased showed excellent sealing by addition of metal oxide. 2) When the interfacial reaction of glass and metals was promoted by addition of metal oxide found out that various adhernece mechanism were related to the sealing. 3) When the amount of metal oxide addition was 3-5% the excellent sealing was achieved.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.1
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• pp.105-112
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• 2013

This paper presents the structural design and finite element analysis of precision stage based on a double triangular parallel mechanism for precision positioning and large force generation. Recently, with the acceleration of miniaturization in mobile appliances, the demand for precision aligning and bonding has been increasing. Such processes require both high precision and large force generation, which are difficult to obtain simultaneously. This study aimed at constructing a precision stage that has high precision, long stroke, and large force generation. Actuators were tactically placed and flexure hinges were carefully designed by optimization process to constitute a parallel mechanism with a double triangular configuration. The three actuators in the inner triangle function as an in-plane positioner, whereas the three actuators in the outer triangle as an out-of-plane positioner. Finite element analysis is performed to validate load carrying performances of the developed precision stage.