• Applied Chemistry for Engineering
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• v.9 no.6
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• pp.894-900
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• 1998

An interphase between carbon fiber and epoxy matrix was introduced to increase impact strength of carbon fiber reinforced composites (CFRC) without sacrificing the interlaminar shear strength. Flexible polymers, I. e., MVEMA (poly(methyl vinyl ether-co-maleic anhydride)) and EMA(poly(ethylene-co-maleic anhydride)), which have reactive functional groups were considered as interphase materials. Weight hain of MVEMA and EMA onto the surface of carbon fibers was evaluated by changing the parameters of electrodeposition process. Electrodeposition mechanism of polymers which have anhydride functional group was identified by IR spectroscopy, that is, the generation of $RCOO^-$ functional group by the attack of hydroxide anion in the basic solution was observed. The weight gain was increased by increasing concentration of polymers, current density, and electrodeposition time. However the excess generation of oxygen gas decreased the weight gain by removing the deposited polymers. Washing in the running water easily removed the deposited polymers which are on the fiber surface without bonding, as a results, only 0.5 wt% of deposited polymers are remained.

• Journal of the Korean Chemical Society
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• v.46 no.3
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• pp.179-186
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• 2002

A molecular orbital analysis based on the extended Huckel calculations has been carried out to study the OH bond activation of water on the $TiO_2$(110) surface. $H_2O$ binds with its axis perpendicular to the surfac on top of the five-coordinate $Ti^{4+}$ atom via its $3a_1$ orbital. In this bonding situation, the two-coordinated bridging $O^{2-}$ atom ($O_b$, basic site) on $TiO_2$(110) is too distant from an H atom of water to form hydrogen-bondig interactions with water that facilitate O-H bond cleavage. It has been elucidated that the O-H bond is appreciably weakened when the water molecule is tilted to give a hydrogen bond with the $O_b$ atom. This mechanism includes mutual transfer of electron density from the $3a_1$ orbital of the water molecule to the $Ti^{4+} 3d_{z2}$ orbital and from the $O_b$ P orbitals to the $2b_1$ of the adsorbed water molecule This should result in lengthening of the O-H bond in the surface complex and the subsequent dissociation into the fragments OH and H.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.24.1-24.1
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• 2009

Tantalum carbo-nitride($T_aC_xN_y$) films were deposited with chemical vapor deposition(CVD) using tert-butylimido tris-diethylamido tantalum (TBTDET, $^tBu-N=Ta-(NEt_2)_3$, $Et=C_2H_5$, $^tBu=C(CH_3)_3$) between $350^{\circ}C$ and $600^{\circ}C$ with argon as a carrier gas. Fourier transform infrared (FT-IR)spectroscopy was used to study the thermal decomposition behavior of TBTDET in the gas phase. When the temperature was increased, C-H and C-N bonding of TBTDET disappeared and the peaks of ethylene appeared above $450^{\circ}C$ in the gas phase. The growth rate and film density of $T_aC_xN_y$ film were in the range of 0.1nm/min to 1.30nm/min and of $8.92g/cm^3$ to $10.6g/cm^3$ depending on the deposition temperature. $T_aC_xN_y$ films deposited below $400^{\circ}C$ were amorphous and became polycrystal line above $500^{\circ}C$. It was confirmed that the $T_aC_xN_y$ film was a mixture of TaC, graphite, $Ta_3N_5$, TaN, and $Ta_2O_5$ phases and the oxide phase was formed from the post deposition oxygen uptake. With the increase of the deposition temperature, the TaN phase was increased over TaC and $Ta_3N_5$ and crystallinity, work function, conductivity and density of the film were increased. Also the oxygen uptake was decreased due to the increase of the film density. With the increase of the TaC phase in $T_aC_xN_y$ film, the work function was decreased to 4.25eV and with the increase of the TaN phase in $T_aC_xN_y$ film,it was increased to 4.48eV.

• International Journal of Costume and Fashion
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• v.13 no.1
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• pp.35-47
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• 2013

We know that humans are able to live comfortably when there is a balance between the living environment that surrounds us and us. Clothing, one of the necessities of life, serves a dual purpose of functioning as protection for the body as well as providing visual satisfaction, and so is the most effective bonding mechanism. A different type of comfort that has been provided through industrialization and advancements in technology has resulted in pollution problems in the environment, and it has reached a point of seriously thinking about its effects. The biggest problems in environmental pollution are air pollution and waste disposal, and something that cannot be ignored is that environmental hormones and harmful heavy metals have been discovered in the synthetic dyes used in the clothing product, and not only are they harmful to the body, but they also have adverse effects on skin allergies such as atopic dermatitis. Its effects on clothing, especially underwear and baby products, can become a serious issue. The use of natural vegetable dye can be considered the basis for the traditional Korean dyeing process, however not all natural dyeing process can be thought of as traditional Korean dyeing. This is because natural dyeing used to be the most common method of dyeing before synthetic dyes came along and became the dye of choice for most clothing. Natural dyes are beneficial to the body, and the nature colors, achieved from the natural materials, relieve eye strains as well as have a healing effect for people who are suffering from psychological instability such as stress. However, the use of mordant in order to increase the fastness and get better color effects can lead to even more damage to the environment, and it cannot be a dyeing method that is good for the body. Traditional natural dyeing is different from regular natural dyeing because it uses colors that the Korean people can identify with and applies specific methods in order to achieve those colors. Even though experimental study with dyestuff and practical use of the dyeing methods for traditional Korean dyeing has been started(Soh, H., 1983) and has been ongoing, it is still not easy for regular people to use the method on their own. At the present time, natural dye materials are getting made and sold more than ever, but there is a lot of confusion among consumers regarding the difference between traditional Korean dyeing and natural dyeing, as companies are using the two terms interchangeably to market their natural dye products. So getting a better understanding of the characteristics of traditional Korean dyeing and traditional colors should be considered first priority at this time. The purpose of this thesis is to study the traditional Korean view of color, which developed the culture of traditional dyeing in Korea, and the characteristics of traditional Korean dyeing, a method that pursued achieving Korea's color through natural dyeing.

• Korean Journal of Materials Research
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• v.18 no.11
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• pp.617-622
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• 2008

In this study, the additivity factors of compositions to density and glass transition point ($T_g$) in a $xLi_2O-(1-x)[(1-y)TeO_2-yZnO]$ (0$T_g$ was discussed. As a method for predicting the relation between glass structure and ionic conductivity, density was measured by the Archimedes method. The glass transition point was analyzed to predict the relation between ionic conductivity and the bonding energy between alkali ions and non-bridge oxygen (NBO). The relation equations showing the additivity factor of each composition to the two properties are as follows: Density(g/$cm^3$) = $2.441x_1\;＋\;5.559x_2\;＋\;4.863x_3\;T_g(^{\circ}C)$ = $319x_1\;＋\;247x_2\;＋\;609x_3\;－\;1950x_1x_3$ ($x_1$ : fraction of $Li_2O$, $x_2$ : fraction of $TeO_2$, $x_3$ : fraction of ZnO) The density decreased as $Li_2O$ content increased. This was attributed to change of the $TeO_2$ structure. From this structural result, the electric conductivity of the glass samples was predicted following the ionic conduction mechanism. Finally, it is expected that electric conductivity will increase as the activation energy for ion movement decreases.

• Journal of Biomedical Engineering Research
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• v.19 no.5
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• pp.503-511
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• 1998

In this study, the stress distribution for different tibial components was observed In order to Investigate the load transfer and potential failure mechanism of the tibial components subjected to dynamic impact loading and also to evacuate the effect of bone-implant bonding conditions on the implant system. The 3-dimensional finite element models included an intact tibia, cemented metal-backed tibial component, uncemented metal-blocked tibial component, cemented all-polyethylene tibial component, and metal-backed component with a debonded bone/stem interface. The results showed that the cemented metal-hocked component Induced slightly higher peak stress at stem tip than the uncemented component. The peak stress of the all-polyethylene tibia1 component at stem trip showed about half thats of metal-backed tibial components. The all-polyethylene component showed a similar dynamic response to intact tibia. In case of debonded bone/stem interface, the peak stress below the metal tray was three times Higher than that of the fully bonded interface and unstable stress distribution at the stem tip was observed with time, which causes another adverse bone apposition and implant loosening. Thus, the all-polyethylene tibial component bonded fully to the surrounding bone might be most desirable system under an impact loading.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Transactions of the Korean hydrogen and new energy society
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• v.26 no.2
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• pp.179-183
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• 2015

In this study, we propose a catalyst structure including enzyme and metal nano rod for glucose sensing. In the catalyst structure, glucose oxidase (GOx) and gold nano rod (GNR) are alternatingly immobilized on the surface of carbon nanotube (CNT), while poly(ethyleneimine) (PEI) is inserted in between the GOx and GNR to fortify their bonding and give them opposite polarization ($[GOx/GNR]_nPEI/CNT$). To investigate the impact of $[GOx/GNR]_nPEI/CNT$ on glucose sensing, some electrochemical measurements are carried out. Initially, their optimal layer is determined by using cyclic voltammogram and as a result of that, it is proved that $[GOx/GNR/PEI]_2/CNT$ is the best layer. Its glucose sensitivity is $13.315{\mu}AmM^{-1}cm^{-2}$. When it comes to the redox reaction mechanism of flavin adenine dinucleotide (FAD) within $[GOx/GNR/PEI]_2/CNT$, (i) oxygen plays a mediator role in moving electrons and protons generated by glucose oxidation reaction to those for the reduction reaction of FAD and (ii) glucose does not affect the redox reaction of FAD. It is also recognized that the $[GOx/GNR/PEI]_3/CNT$ is limited to the surface reaction and the reaction is quasi-reversible.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.363-363
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• 2008

The development of dry etching process for sapphire wafer with plasma has been key issues for the opto-electric devices. The challenges are increasing control and obtaining low plasma induced-damage because an unwanted scattering of radiation is caused by the spatial disorder of pattern and variation of surface roughness. The plasma-induced damages during plasma etching process can be classified as impurity contamination of residual etch products or bonding disruption in lattice due to charged particle bombardment. Therefor, fine pattern technology with low damaged etching process and high etch rate are urgently needed. Until now, there are a lot of reports on the etching of sapphire wafer with using $Cl_2$/Ar, $BCl_3$/Ar, HBr/Ar and so on [1]. However, the etch behavior of sapphire wafer have investigated with variation of only one parameter while other parameters are fixed. In this study, we investigated the effect of pressure and other parameters on the etch rate and the selectivity. We selected $BCl_3$ as an etch ant because $BCl_3$ plasmas are widely used in etching process of oxide materials. In plasma, the $BCl_3$ molecule can be dissociated into B radical, $B^+$ ion, Cl radical and $Cl^+$ ion. However, the $BCl_3$ molecule can be dissociated into B radical or $B^+$ ion easier than Cl radical or $Cl^+$ ion. First, we evaluated the etch behaviors of sapphire wafer in $BCl_3$/additive gases (Ar, $N_2,Cl_2$) gases. The behavior of etch rate of sapphire substrate was monitored as a function of additive gas ratio to $BCl_3$ based plasma, total flow rate, r.f. power, d.c. bias under different pressures of 5 mTorr, 10 mTorr, 20 mTorr and 30 mTorr. The etch rates of sapphire wafer, $SiO_2$ and PR were measured with using alpha step surface profiler. In order to understand the changes of radicals, volume density of Cl, B radical and BCl molecule were investigated with optical emission spectroscopy (OES). The chemical states of $Al_2O_3$ thin films were studied with energy dispersive X-ray (EDX) and depth profile anlysis of auger electron spectroscopy (AES). The enhancement of sapphire substrate can be explained by the reactive ion etching mechanism with the competition of the formation of volatile $AlCl_3$, $Al_2Cl_6$ or $BOCl_3$ and the sputter effect by energetic ions.

• Journal of the Korea Concrete Institute
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• v.17 no.3 s.87
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• pp.393-400
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• 2005

Steel encased composite columns have been used for buildings and piers of bridges. Since the column section for the pier is relatively larger than that of building columns, economical steel ratio needs to be investigated for the required performance. Composite action between concrete and embedded steel sections can be obtained by bond and friction. However, the behavior of the column depends on the load introduction mechanism. Compression can be applied to concrete section, steel section and composite section. In this paper, experiments on shear strength of the steel encased composite column were performed to study the effect of confinement by transverse reinforcements, mechanical interlock by holes, and shear connectors. Bond strength obtained from the tests showed considerably higher value than the design value. Confinement, mechanical interlock and stud connectors Increased the shear strength and these values can be used effectively to obtain composite action of Steel Reinforced Concrete(SRC) columns.