• Restorative Dentistry and Endodontics
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• 제21권2호
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• pp.635-641
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• 1996

This study was designed to evaluate the anti cariogenic effect of F in primers, bonding agents, composite resins or glass ionomer cements in enamel. Twenty-five extracted teeth were selected and a cavity was prepared on either the buccal or the lingual surface of each tooth. After pumicing and etching, the samples were divided into 5 groups. In group A, the samples were primed, bonded and filled with ART bond and Brilliant Enamel (Coltene, Switzerland). Group B composed of Optibond and Herculited XRV (Kerr, USA), group C composed of Syntac and Tetric(Vivadent, Lichtenstein), and group D composed of Scotch-bond Multipurpose and Z 100 (3M, YSA). In group E, the samples were filled with glass ionomer cement (Fuji II LC, Japan), All surfaces except the 2mm beyond the cavosurface margin of the sample were protected, and samples were then put into an acid buffer for 3 days to develop the initial caries. The samples were then sectioned through the filling body into thin wafers and then examined with a polarizing microscope under water imbibition. The fluoride in primer, bonding agent, or composite filling material did not prevent the initial caries in the enamel area adjacent to the filling body whereas the fluoride in the glass ionomer did prevent the initial stage caries.

• Korean Chemical Engineering Research
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• 제44권5호
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• pp.513-519
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• 2006

본 연구에서는 유리(glass)와 석영(quartz)을 재질로 사용하여 MEMS(micro-electro mechanical systems) 공정을 통해 전기영동(electrophoresis)을 위한 microchip을 제작하였다. UV 광이 실리콘(silicon)을 투과하지 못하는 점에 착안하여, 다결정 실리콘(polycrystalline Si, poly-Si) 층을 채널 이외의 부분에 증착시킨 광 차단판(optical slit)에 의해 채널에만 집중된 UV 광의 신호/잡음비(signal-to-noise ratio: S/N ratio)를 크게 향상시켰다. Glass chip에서는 증착된 poly-Si 층이 식각 마스크(etch mask)의 역할을 하는 동시에 접합표면을 적절히 형성하여 양극 접합(anodic bonding)을 가능케 하 였다. Quartz 웨이퍼에 비해 불순물을 많이 포함하는 glass 웨이퍼에서는 표면이 거친 채널 내부를 형성하게 되어 시료용액의 미세한 흐름에 영향을 미치게 된다. 이에 따라, HF와 $NH_4F$ 용액에 의한 혼합 식각액(etchant)을 도입하여 표면 거칠기를 감소시켰다. 두 종류의 재질로 제작된 채널의 형태와 크기를 관찰하였고, microchip electrophoresis에 적용한 결과, quartz과 glass chip의 전기삼투 흐름속도(electroosmotic flow velocity)가 0.5와 0.36 mm/s로 측정되었다. Poly-Si 층에 의한 광 차단판의 존재에 의해, peak의 S/N ratio는 quartz chip이 약 2배 수준, glass chip이 약 3배 수준으로 향상되었고, UV 최대흡광 감도는 각각 약 1.6배 및 1.7배 정도 증가하였다.

• 한국산학기술학회논문지
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• 제14권2호
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• pp.567-572
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• 2013

냉난방을 사용하는 가정에서는 대부분 창문을 통해 열손실이 이루어지고 있는데 이를 방지하기 위해 Low-E 유리, 복층유리 또는 진공유리가 사용되고 있다. 본 논문에서는 진공유리 제작공정의 최종공정인 봉지공정에 대한 연구가 수행되었는데 기존 상압 접합이 아닌 진공챔버 내 접합이 고려되었다. 봉지과정의 효율성을 위해 진공챔버 내에서 히터온도에 따른 프리트 용융온도 및 접합시간을 최적화하였고 열응력으로 인한 유리 파손을 방지하기 위해 유리 예열온도를 최적화하였다. 이러한 결과를 바탕으로 성공적으로 진공유리를 제작하였고 측정된 열관류율은 약 $5.7W/m^2K$로 진공유리 내부압력은 약 $10^{-2}$ torr로 판명되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• 대한소아치과학회지
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• 제28권2호
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• pp.228-237
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• 2001

본 연구의 목적은 와동 충전시 충전재와 치질 사이에 개재되는 상아질 결합제가, 수복물에서 유리되는 불소가 와동 벽으로 침투하는 과정에 어떠한 영향을 주는지를 조사함이었고, 부가적으로 레진 강화형-글라스 아이오노머 시멘트의 접착에도 상아질 결합제를 도포 하는것이 치질과의 결합력을 강화시킬 수 있는지에 대해 평가하고자 하였다. Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 선정하여 상아질 결합제의 도포 여부에 따른 불소 유리량 측정과 전단 결합 강도를 비교분석하였으며, 치질 내로의 불소 침투 양상은 교환 시기에 있는 제2유구치에 Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 충전하고 3주내에 발거하여 EPMA로 분석하였다. 상아질 결합제는 불소 유리량을 현저하게 감소시키는 것으로 나타났으며(p<0.05) Fuji II $LC^{(R)}$의 경우 상아질 결합제의 도포가 결합강도를 증가시키지 못하였다. EPMA 분석결과 상아질 결합제는 충전재로부터 유리되어 나오는 불소가 치질 내로 확산되는 것을 방해하는 것으로 확인되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.11-11
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• 2004

• Restorative Dentistry and Endodontics
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• 제16권1호
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• pp.60-73
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• 1991

The purpose of this study is to evaluate the effects of etching time, environmental temperature and humidity on the adhesion of composite resin to glass-ionomer cement. Two chemical cure composite resins (Clearfil F II and Microrest AP) and two glass-ionomer cements (Fuji ionomer Type I and KET AC-CEM) were used as the experimental materials. The experiment is performed in 3 stages: The first stage is to bond composite resins to glass-ionomer cements, and the surface was not etched, and etched for 20 seconds, 40 seconds, and 60 seconds. Then specimens are stored in distilled water at $37^{\circ}C$ for 24 hours to measure tensile strength. The second stage is to choose the one group that had the highest tensile strength from the first stage and prepare two experimental groups: One group with composite resin bonded to glass-ionomer cement without etching and bonding agent application and the other with composite resin bonded to glass-ionomer cement with etching but without any bonding agent application. The specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and tensile strength is measured. The third stage is to choose group that had the highest tensile strength from the first stage experiment, and bond composite resin to glass-ionomer cement at $24^{\circ}C$ 44%, $30^{\circ}C$ 44%, $30^{\circ}C$ 80%, and $32^{\circ}C$ 92%. The storage time of specimens is to bond immediately after storage, then changed to 30 sec., 60 sec., and 120 sec.. Specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and their tensile strength are measured again. The following results were obtained: 1. As the etching time increases, the tensile bond strength between glass-ionomer cement and composite resin increase, and the tensile bond strength is the highest when acid etched for 60 minutes (P < 0.05). 2. After acid etching for 60 minutes, the tensile strength of the group with bonding agent was stronger than that without bonding agent application (P < 0.05). 3. The tensile strength of Clearfil F II was stronger than that of Microrest AP. 4. It was observed that the tensile bond strength is not affected by different storage time with different temperature and humidity. 5. As the humidity was increased, the tensile bond strength between glass-ionomer cement and composite resin decreased (P < 0.05).

• 한국재료학회지
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• 제6권1호
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• pp.3-11
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• 1996

대면적 정전 접합 장치를 고안 및 제작하여 Si과 glass를 정전 접합시켰다. 여러 온도에서 정전 접합 후 접합 면적을 측정하였으며 접합이 이루어진 경우 그 접합 면적이 90%를 넘었다. 접합시 전류를 측정하여 접합 강도와의 관계를 살펴보였다. 잔류 공공을 생성시키는 원인은 재료의 표면 거칠기 차이나 전극의 모양보다는 불순물 입자에 의한 것임이 밝혀졌고 같은 크기의 불순물 입자에 대한 공공의 크기는 접합 온도가 높을수록 감소하였다. 정전 접합에 미치는 불순물의 영향을 공공의 크기 및 불순물 입자의 크기를 측정하여 살펴보았다.

• 대한치과교정학회지
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• 제48권3호
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• pp.163-171
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• 2018

Objective: The aim of this study was to evaluate the mechanical and biological properties of orthodontic bonding agents containing silver- or zinc-doped bioactive glass (BAG) and determine the antibacterial and remineralization effects of these agents. Methods: BAG was synthesized using the alkali-mediated solgel method. Orthodontic bonding agents containing BAG were prepared by mixing BAG with flowable resin. $Transbond^{TM}$ XT (TXT) and $Charmfil^{TM}$ Flow (CF) were used as controls. Ion release, cytotoxicity, antibacterial properties, the shear bond strength, and the adhesive remnant index were evaluated. To assess the remineralization properties of BAG, micro-computed tomography was performed after pH cycling. Results: The BAG-containing bonding agents showed no noticeable cytotoxicity and suppressed bacterial growth. When these bonding agents were used, demineralization after pH cycling began approximately 200 to $300{\mu}m$ away from the bracket. On the other hand, when CF and TXT were used, all surfaces that were not covered by the adhesive were demineralized after pH cycling. Conclusions: Our findings suggest that orthodontic bonding agents containing silver- or zinc-doped BAG have stronger antibacterial and remineralization effects compared with conventional orthodontic adhesives; thus, they are suitable for use in orthodontic practice.

• 한국표면공학회지
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• 제46권4호
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• pp.162-167
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• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.