• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.609-610
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• 2010

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.1004-1006
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• 1998

Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.923-924
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• 2009

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.711-716
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• 2005

The effects of change in the component of bonding materials in carbon nanotube cathode (CNT-cathode) on field enhancement and field emission characteristics were investigated. The field enhancement factor$\beta$ was dependent on the electrical conductivity of the bonding materials. The use of frit glass as a bonding material showed a higher field enhancement factor and better field emission characteristics than an Ag paste. The reason for why the frit glass showed better field emission characteristics can be summarized as follows. First, a frit glass improves the real aspect ratio of CNTs compared to an Ag paste. Second, the number of CNTs in CNT-cathodes is considerably reduced because the CNTs were extensively oxidized during $390^{\circ}C$ heat treatment in air atmosphere in the case of Ag paste.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• Journal of the Korean Ceramic Society
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• v.43 no.9 s.292
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• pp.544-551
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• 2006

The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.5
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• pp.135-141
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• 2021

As a trend of lightening automobiles and electronic products, several studies are currently underway to replace parts of metals with resins. In particular, heterojunctions between metals and resins are now under the spotlight. This study aims to evaluate the variation in bonding strength with process conditions when the polybutylene terephthalate (PBT) polymer is bonded to a specimen of the lightweight 6061 aluminum alloy (AL6061). Conditions of the bonding surface of the AL6061 specimen, the temperature of the injection mold, and the content of the glass fiber were considered to be process variables. Bonded specimens were manufactured for different values of these variables. Bonding strength tests were then performed on these specimens and variations were analyzed in their characteristics corresponding to those of the process conditions. Fractures in these specimens were assessed using scanning electron microscopy (SEM) to assess the fracture surface. This was then used to analyze the fracture shape and determine whether anodizing the specimen led to the development of cracks on the joint surface. Results of the above test indicated that while the surface condition of the specimen and the temperature of the injection mold significantly influenced the strength of bonding, the content of the glass fiber did not.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.191-199
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• 2005

This study was experienced in order to obtain the shear bond strength of orthodontic bracket adhesives under the blood contamination that can be occurred during the procedure of bracket bonding under window opening surgery. As a result of this study, shear bond strength of all glass ionomer groups were lower than resin cement groups. However, the strength of uncontaminated and post-contaminated group of glass ionomer was strong enough to perform an orthodontic forced eruption. This study revealed that during a window opening surgery, glass ionomer without etching procedure is available in order to bond a bracket if surface of teeth is not pre-contaminated by blood before the adhesive application. Both simple procedure and less adhesives remnant after bonding failure could make light-cured glass ionomer cement the ultimate choice for racket bonding.

• Journal of the korean academy of Pediatric Dentistry
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• v.23 no.2
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• pp.357-364
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• 1996

The purpose of this study was to asses the shear bond strengths of 3 types of light-curing Glass Ionomer cement to dental amalgam with or without an intermediary agent. 60 amalgam adherent specimens were prepared and aged in water at $37^{\circ}C$ for 3 days. Before bonding, the amalgam surfaces were finished flat on 600-grit silicon carbide paper. 30 specimens among 60 were used for bonding in this condition, and the other 30 were covered with a thin layer of light-curing intermediary agent. Shear bond strengths were measured with universal testing machine (Instron, Model 4301) and statistically processed by ANOVA and t-test. On completion of bond test, the fracture surfaces were examined under light microscope so that the mode of bond failure could be assessed The results were as follows : 1. Bond strength of Fuji II LC group showed the hightest value and was followed by Vitremer, Vitrebond groups (p<0.05). 2. The bond strengths achieved without an intermediary agent were higher than those obtained with intermediary agent (p<0.05). 3. For the specimens bonded with intermediary agent, bond failures occured mostly at the agent-amalgam interface. So, the use of intermediary bonding agent was thought not recommendable at glass ionomer-amalgam interface.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.