• Restorative Dentistry and Endodontics
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• 제17권2호
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• pp.421-430
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• 1992

The purpose of this study was to evaluate the bond strength between the composite resin and light - cured glass ionomer cement base / liners treated by the several methods. The light - cured glass ionomer cement(Vitrebond / Cavalite) were injected into cavites prepared in acrylic plates. One hundred and twenty specimens were uniformly prepared and devided into 3 groups. For the first group, primer was not applied to glass ionomer cement. For the second group, no application of primer was undertaken and light - curing procedure to uncured glass ionomer cement surface which was covered by bonding agent was undertaken. After bonding composite resin to light - cured glass ionomer surface, the specimens, were stored in $37^{\circ}C$, 100% humidity for 1 hour. The following results were obtained : 1. The omission of application of a primer did not produce a significantly poorer bond strength. 2. Light - curing technique to uncured glass ionomer cement which was covered by bonding agent did not produce a significantly poorer bonding strength. 3. The bond strength of Cavalite to composite resin was significantly higher than that of Vitrebond. 4. There was no significant difference between two different types of composite materials(Silux-Plus / Herculite XR) when it was applied to bond to glass ionomer cement.

• 한국세라믹학회지
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• 제20권1호
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• pp.70-78
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• 1983

This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

• 한국진공학회지
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• 제8권4A호
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• pp.465-469
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• 1999

In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

• 한국항공우주학회지
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• 제50권7호
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• pp.455-463
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• 2022

세계 각국에서는 위성용 카메라 등 고신뢰성을 요구하는 카메라에 대한 연구개발 필요성이 높아짐에 따라 시편시험 수행을 통해 광기구 구조물과 광학부품 간 접착강도 물성치의 신뢰성을 확보해오고 있다. 다만 널리 활용되고 있는 시편형상은 취성 경향이 높은 유리 및 유리세라믹 소재에의 적용에 적합하지 않아 접착강도 한계값 도달 전 유리 부분 응력집중으로 인한 소재 자체 깨짐 현상이 정확한 접착강도 획득에 어려움을 유발한다. 본 연구에서는 유리 소재 자체 파단이 발생한 시편시험 결과를 바탕으로 다양한 시편형상에 대한 전단시험 환경에서의 응력분포 특성을 해석적으로 분석하였다. 이를 통해 유리부의 응력집중을 완화할 수 있는 형상적 특징을 도출하여 시편시험으로 검증가능한 접착 전단강도의 범위를 개선하였다.

• 한국정밀공학회지
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• 제27권7호
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• 마이크로전자및패키징학회지
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• 제16권1호
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• pp.27-31
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• 2009

본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

• Journal of the Korean Wood Science and Technology
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• 제39권2호
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• pp.156-162
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• 2011

To evaluate the bonding performance of reinforced glulam, the textile type of glass fiber and aramid fiber, and the sheet type of glass fiber reinforced plastic (GFRP) and carbon fiber reinforced plastic (CFRP) were used as reinforcements. The reinforced glulam was manufactured by inserting reinforcement between the outmost and middle lamination of 5ply glulam. The types of adhesives used in this study were polyvinyl acetate resins (MPU500H, and MPU600H), polyurethane resin and resorcinol resin. The block shear strengths of the textile type in glass fiber reinforced glulam using MPU500H and resorcinol resin were higher than 7.1 N/$mm^2$, and these glulams passed the wood failure requirement of Korean standards (KS). In case of the sheet types, GFRP reinforced glulams using MPU500H, polyurethane resin and resorcinol resin, and CFRP reinforced glulams using MPU500H and polyurethane resin passed the requirement of KS. The textile type of glass fiber reinforced glulam using resorcinol resin after water and boiling water soaking passed the delamination requirement of KS. The only GFRP reinforced glulam using MPU500H after water soaking passed the delamination requirement of KS. We conclude that the bonding properties of adhesive according to reinforcements are one of the prime factors to determine the bonding performance of the reinforced glulam.

• Journal of Information Display
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• 제3권1호
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• pp.11-16
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• 2002

This paper presents a study on the tubeless Plasma Display Panel (PDP) packaging using glass-to-glass electrostatic bonding with intermediate amorphous silicon. The bonded sample sealing the mixed gas with three species showed high strength ranging from 2.5 MPa to 4 MPa. The glass-to-glass bonding for packaging was performed at a low temperature of $180^{\circ}C$ by applying bias of 250 $V_{dc}$ in ambient of mixed gases of He-Ne(27 %)-Xe(3 %). The tubeless packaging was accomplished by bonding the support glass plate of $30mm{\times}50mm$ on the rear glass panel and the capping glass of $20mm{\times}20mm$. The 4-inch color AC-PDP with thickness of 8 mm was successfully fabricated and fully emitted as white color at a firing voltage of 190V.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1943-1945
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• 1996

In this paper, we developed a modified direct bonding method for the application of vacuum devices. By the proposed method, we successfully bonded the following materials: Si-Si, Si-$SiO_2$-Si, glass-Si, and glass-$SiO_2$-Si. In our experiments, we used corning #7070 wafer type glass and (100) or (110) single crystalline silicon wafers. In order to enhance the initial bonding strength we contacted the materials to be bonded as D. I. water wetted on the surfaces and evaporated the water under the room temperature and atmosphere environment. Finally we realized the glass bonding by simple direct bonding method which has been performed by electrostatic bonding method until now.

• 전기학회논문지
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• 제56권12호
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• pp.2217-2220
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• 2007

In this paper, we propose a new wafer level package (WLP) for the RF MEMS applications. The Film Bulk Acoustic Resonator (FBAR) are fabricated and hermetically packaged in a new wafer level packaging process. With the use of Au-Sn eutectic bonding method, we bonded glass cap and FBAR device wafer which has groove-shaped via formed in the backside. The device wafer includes a electrical bonding pad and groove-shaped via for connecting to the external bonding pad on the device wafer backside and a peripheral pad placed around the perimeter of the device for bonding the glass wafer and device wafer. The glass cap prevents the device from being exposed and ensures excellent mechanical and environmental protection. The frequency characteristics show that the change of bandwidth and frequency shift before and after bonding is less than 0.5 MHz. Two packaged devices, Tx and Rx filters, are attached to a printed circuit board, wire bonded, and encapsulated in plastic to form the duplexer. We have designed and built a low-cost, high performance, duplexer based on the FBARs and presented the results of performance and reliability test.