Thin and Hermetic Packaging Process for Flat Panel Display Application

  • Kim, Young-Cho (Department of Electronic Engineering, Chungwoon University) ;
  • Jeong, Jin-Wook (Department of Electronic Engineering, Chungwoon University) ;
  • Lee, Duck-Jung (Electronic Materials and Devices Research Center, Korea institute of Science and Technology) ;
  • Choi, Won-Do (Semiconductor Electronic Components & Electric Industry Division Ministry of Commerce, Industry & Energy) ;
  • Lee, Sang-Geun (Agency for Technology and Standards, MOICE, Electronic Standards Division) ;
  • Ju, Byeong-Kwon (Electronic Materials and Devices Research Center, Korea institute of Science and Technology)
  • Published : 2002.03.24

Abstract

This paper presents a study on the tubeless Plasma Display Panel (PDP) packaging using glass-to-glass electrostatic bonding with intermediate amorphous silicon. The bonded sample sealing the mixed gas with three species showed high strength ranging from 2.5 MPa to 4 MPa. The glass-to-glass bonding for packaging was performed at a low temperature of $180^{\circ}C$ by applying bias of 250 $V_{dc}$ in ambient of mixed gases of He-Ne(27 %)-Xe(3 %). The tubeless packaging was accomplished by bonding the support glass plate of $30mm{\times}50mm$ on the rear glass panel and the capping glass of $20mm{\times}20mm$. The 4-inch color AC-PDP with thickness of 8 mm was successfully fabricated and fully emitted as white color at a firing voltage of 190V.

Keywords

References

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