Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A Study on the Fabrication of Vertical-walled Cavity and Direct Bonding Method

전계 방출 소자의 진공 실장을 위한 수직구조물의 제조 및 접합에 관한 연구

  • Ko, Chang-Gi (Div. of Electronics and Information Technology, KIST) ;
  • Ju, Byeong-Kwon (Div. of Electronics and Information Technology, KIST) ;
  • Lee, Yun-Hi (Div. of Electronics and Information Technology, KIST) ;
  • Jeong, Seong-Jae (Information Display Research Institute, Orion Electronics Co., LTD) ;
  • Lee, Nam-Yang (Information Display Research Institute, Orion Electronics Co., LTD) ;
  • Koh, Ken-Ha (Information Display Research Institute, Orion Electronics Co., LTD) ;
  • Park, Jung-Ho (Dept. of Electronics Engineering, Korea University) ;
  • Oh, Myung-Hwan (Div. of Electronics and Information Technology, KIST)
  • 고창기 (한국과학기술연구원 정보전자연구부) ;
  • 주병권 (한국과학기술연구원 정보전자연구부) ;
  • 이윤희 (한국과학기술연구원 정보전자연구부) ;
  • 정성재 ((주) 오리온전기 영상표시연구소) ;
  • 이남양 ((주) 오리온전기 영상표시연구소) ;
  • 고근하 ((주) 오리온전기 영상표시연구소) ;
  • 박정호 (고려대학교 전자공학과) ;
  • 오명환 (한국과학기술연구원 정보전자연구부)
  • Published : 1996.07.22
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Abstract

In this paper, we developed a modified direct bonding method for the application of vacuum devices. By the proposed method, we successfully bonded the following materials: Si-Si, Si-$SiO_2$-Si, glass-Si, and glass-$SiO_2$-Si. In our experiments, we used corning #7070 wafer type glass and (100) or (110) single crystalline silicon wafers. In order to enhance the initial bonding strength we contacted the materials to be bonded as D. I. water wetted on the surfaces and evaporated the water under the room temperature and atmosphere environment. Finally we realized the glass bonding by simple direct bonding method which has been performed by electrostatic bonding method until now.

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