• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.609-610
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• 2010

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.1004-1006
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• 1998

Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.923-924
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• 2009

• 한국재료학회지
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• 제15권11호
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• pp.711-716
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• 2005

The effects of change in the component of bonding materials in carbon nanotube cathode (CNT-cathode) on field enhancement and field emission characteristics were investigated. The field enhancement factor$\beta$ was dependent on the electrical conductivity of the bonding materials. The use of frit glass as a bonding material showed a higher field enhancement factor and better field emission characteristics than an Ag paste. The reason for why the frit glass showed better field emission characteristics can be summarized as follows. First, a frit glass improves the real aspect ratio of CNTs compared to an Ag paste. Second, the number of CNTs in CNT-cathodes is considerably reduced because the CNTs were extensively oxidized during $390^{\circ}C$ heat treatment in air atmosphere in the case of Ag paste.

• 대한기계학회논문집B
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• 제26권12호
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• 한국세라믹학회지
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• 제43권9호
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• pp.544-551
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• 2006

The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.

• 한국기계가공학회지
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• 제20권5호
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• pp.135-141
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• 2021

As a trend of lightening automobiles and electronic products, several studies are currently underway to replace parts of metals with resins. In particular, heterojunctions between metals and resins are now under the spotlight. This study aims to evaluate the variation in bonding strength with process conditions when the polybutylene terephthalate (PBT) polymer is bonded to a specimen of the lightweight 6061 aluminum alloy (AL6061). Conditions of the bonding surface of the AL6061 specimen, the temperature of the injection mold, and the content of the glass fiber were considered to be process variables. Bonded specimens were manufactured for different values of these variables. Bonding strength tests were then performed on these specimens and variations were analyzed in their characteristics corresponding to those of the process conditions. Fractures in these specimens were assessed using scanning electron microscopy (SEM) to assess the fracture surface. This was then used to analyze the fracture shape and determine whether anodizing the specimen led to the development of cracks on the joint surface. Results of the above test indicated that while the surface condition of the specimen and the temperature of the injection mold significantly influenced the strength of bonding, the content of the glass fiber did not.

• 대한소아치과학회지
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• 제32권2호
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• pp.191-199
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• 2005

본 연구는 매복된 치아를 교정력을 이용하여 견인할 때 견인의 대상이 되는 치아를 개창술로 노출시켜 브라켓을 부착하는 과정에서 혈액 오염이 일어날 수 있는 상황을 실험실 환경에서 재현한 다음, 이와 같은 오염의 유무와 접착제의 종류가 브라켓의 전단강도에 미치는 영향을 평가하기 위해 시행하였다. 본 연구의 결과 글래스 아이오노머의 전단 강도는 레진에 비해 모든 조건에서 낮은 수치를 보였으나 혈액 오염이 없거나 광조사 직전 오염된 경우 임상적으로 교정적 정출술에 적절한 전단 강도를 나타내었다. 두 재료 모두 접착제 적용 전에 치면이 혈액에 오염되었을 경우 다른 조건에 비해 현저하게 낮은 전단 강도를 보였으나 광조사 직전에 혈액에 오염되었을 경우에는 오염되지 않은 대조군과 유의한 차이가 없었다. 이상의 연구 결과, 개창술을 통해 브라켓을 부착할 경우 접착제 적용 직전 혈액 오염을 주의한다면 산부식 과정 이 생략되어 술식이 비교적 간단하고 접착 파절 후 치면에 접착제가 남아 있지 않은 장점을 지닌 글래스 아이오노머 접착제의 사용을 추천할 수 있을 것으로 사료된다.

• 대한소아치과학회지
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• 제23권2호
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• pp.357-364
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• 1996

소아치과 임상에서 자주 사용되는 3 종의 광중합형 GIC의 아말감에 대한 접착능을 평가 할 목적으로 60 개의 아말감 부착시편을 이용하여 중간결합제인 Scotchbond 의 사용여부에 따른 경화된 아말감에 대한 광중합 GIC의 전단결합강도를 측정하고 경계부의 파절양상을 관찰한 결과, 다음과 같은 결론을 얻었다. 1. 아말감에 대한 광중합형 GIC의 전단강도는 Fuji II LC, Vitremer, Vitrebond의 순으로 높게 나타났다 (p<0.05). 2. 중간결합제인 Scotchbond를 사용하지 않은 경우에서 Scotchbond 를 사용한 경우에 비해 전단결합강도가 높게 나타났다(p<0.05). 3. 결합파절면은 Scotchbond를 사용한 경우의 대부분에서 Scotchbond와 아말감의 경계부에서 시편의 탈락이 나타났다. 아말감과 광중합 GIC의 결합을 시도할 경우에는 Scotchbond는 사용하지 않는 것이 바람직할 것으로 사료되었다.

• 대한기계학회논문집A
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• 제25권1호
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.