• Restorative Dentistry and Endodontics
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• v.30 no.4
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• pp.283-293
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• 2005

The purpose of this study was to evaluate the effect of dual bonding technique by comparing microshear bond strength between two different luting methods of resin cement to tooth dentin. Three dentin bonding systems(All-Bond 2, One-Step, Clearfil SE Bond), two temporary cements (Propac, Freegenol) were used in this study. In groups used conventional luting procedure, dentin surfaces were left untreated. In groups used dual bonding technique, three dentin bonding systems were applied to each dentin surface. All specimens were covered with each temporary cement. The temporary cements were removed and each group was treated using one of three different dentin bonding system. A resin cement was applied to the glass cylinder surface and the cylinder was bonded to the dentin surface. Then, micro-shear bond strength test was performed. For the evaluation of the morphology at the resin/dentin interface, SEM examination was also performed. 1. Conventional luting procedure showed higher micro-shear bond strengths than dual boning technique. However, there were no significant differences. 2. Freegenol showed higher micro-shear bond strengths than Propac, but there were no significant differences. 3. In groups used dual bonding technique, SE Bond showed significantly higher micro-shear bond strengths in One-Step and All-Bond 2 (p<0.05), but there was no significant difference between One-Step and All-Bond 2. 4. In SEM observation, with the use of All-Bond 2 and One-Step, very long and numerous resin tags were observed. This study suggests that there were no findings that the dual bonding technique would be better than the conventional luting procedure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.717-718
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• 2009

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.270-274
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• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• Journal of Korea Foundry Society
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• v.12 no.4
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• Current Photovoltaic Research
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• v.3 no.2
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• pp.61-64
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• 2015

In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between silicon substrate and copper electrode was analyzed using morphology observation technic. SEM and TEM analysis were performed to analyze a crystallinity and distribution shape of heterogeneous copper phase. Molecular dynamics simulation was performed to calculate glass transition temperature of copper metal. In the result, amorphous copper phase was observed near interface between silicon substrate and metal electrode. The results of the molecular dynamics simulation show that an amorphous copper phase could be formed at a temperature below the melting point of copper because cold spraying resulted in a lower glass transition temperature.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.1-7
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• 2001

In order to form a uniform oxidation layer of spinel phase on Kovar which helps the strong bonding in Kovar-to-glass sealing, the humidified $N_2/H_2$ was used as an oxidation atmosphere. The oxidation of Kovar was controlled by diffusion mechanism and the activation energy was 31.61 kacl/mol at 500~$800^{\circ}C$. After oxidation at $600^{\circ}C$, the external oxidation layer was below 0.5 $\mu \textrm{m}$ thick. According to TEM analysis, oxidized Kovar was spinel its lattice parameter of 7.9 $\AA$. Oxidation of under $600^{\circ}C$ and in a humidified $N_2/H_2$ atmosphere, Kovar was found to be appropriate for the Kovar-to-glass sealing.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.1-8
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• 1999

The state of compatability of poly(vinyl alcohol)(PVA) and methyl cellulose(MC), prepared by an aqueous solution casting, were investigated over the entire compositions by dynamical mechanical analyzer(DMA) and differential scanning calorimetry(DSC). The glass transition temperatures of the blends, estimated by DMA, indicate that the blends of PVA and MC showed a definite degree of partial miscibility by showing two glass transition temperatures below 80 wt % MC contents in the blends and one glass transition temperature above 80 wt % of MC contents. The DSC results show a depression of melting point and crystallization temperature of PVA in the blends containing more than 80 wt % MC. This indicates that a considerable compatibility in the blend above 80 wt % MC contents may be attribute to the presence of interaction of hydroxyl groups of component polymers through hydrogen bonding. The DMA study of the effect of plasticizer on the polymers showed that water was a good plasticizer for PVA and PEG400 for MC. The addition of water and PEG400 in the blends showed a synergic plasticizing effect on these blends, which resulted in the large extent of the improvement of the compatibility. The elongation of PVA, MC and blonds was found to increase with addition of PEG400 in the blends, but the tensile strength to decrease with addition of plasticizer.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• Journal of the Korean Ceramic Society
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• v.23 no.4
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• pp.27-34
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• 1986

In the present study an attempt was made to synthesize $10TiO_2$.$90SiO_2$ glass by Sol-Gel process. Tetra-ethyl-ortho-silane and titanium-iso-propoxide were used as precursors. As the mutual solvent ethanol and iso-propanol were used. TEOS was partially hydrolyzed with one-fold mole of $H_2O$ prior to the reaction with titanium-iso-propoxide to control the difference of hydrolysis rate of the two metal alkoxides. At gelling temperature higher than 6$0^{\circ}C$ it was difficult to obtain monolithic gels. At such a low temperature as 85$0^{\circ}C$ clear amorphous gel derived glass with Si-O-Ti bonding was obtained.

• Korean Journal of Materials Research
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• v.12 no.7
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• pp.545-549
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• 2002

Potassium-Calcium-Phosphate glasses in range $XCaO\cdot(50-X)K_2O$ \cdot $50P_2$$O^{5}$were investigated. Glass transition temperature(Tg) of prepared glasses were below $520^{\circ}C$, thermal expansion coefficient from $270.3$\times$10^{7}$ to $604.5$\times$10^{7}$/$^{\circ}C$. The structure of XCaO.(50-X)$K_2$O\cdot$50P_2$$O^{5}$ glasses were examined by FT-IR spectroscopy indirectly. As CaO was increased, Ts, Tg, P-O-P bonding strength and chemical durability were increased. Glass surface change was observed with increasing dissolution time using bulk specimen, weight loss and pH change were measured as function of the dissolution time.