• 한국전기전자재료학회논문지
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• 제15권7호
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• pp.576-582
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• 2002

Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectrics were fabricated, and nitrogen distribution and bonding species which contribute to memory characteristics were analyzed. Also, memory characteristics of devices depending on the anneal temperatures were investigated. The devices were fabricated by retrograde twin well CMOS processes with $0.35\mu m$ design rule. The processes could be simple by in-situ process in growing dielectric. The nitrogen distribution and bonding states of gate dielectrics were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary Ion Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). As the nitridation temperature increased, nitrogen concentration increased linearly, and more time was required to form the same reoxidized layer thickness. ToF-SIMS results showed that SiON species were detected at the initial oxide interface which had formed after NO annealing and $Si_2NO$ species within the reoxidized layer formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. It could be said that nitrogen concentration near initial interface is limited to a certain quantity, so the excess nitrogen is redistributed within reoxidized layer and contribute to electron trap generation.

• 대한전자공학회논문지SD
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• 제48권8호
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• pp.1-4
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• 2011

SiOC 박막과 같은 유무기 하이브리드 저유전 물질에서의 열처리효과에 의한 전기적인 특성의 변화와 유전상수에 관하여 연구하였다. SiOC 박막은 분극에 따른 특성을 분석하기 위해서 TMS과 산소의 혼합가스를 이용한 CVD방법에 의하여 증착되었으며, 300~500도까지 변화하면서 열처리를 하였다. SiOC 박막은 열처리에 의하여 유전상수는 더욱 낮아지며, 400도에서 열처리 한 경우 전기적인 특성이 우수한 것을 확인하였다. XRD 패턴에 의하면 300도이하에서 열처리한 박막과 400도 이상에서 열처리 한 경우 결합구조가 달라지는 것을 알 수 있고 400도 근처에서 급격한 변화가 일어나고 있는 것을 확인하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• 유통과학연구
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• 제15권11호
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• pp.31-39
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• 2017

Purpose - This research aims to examine the influence of social capital formed on SNS on SNS users' life satisfaction. This research divides social capital into bridging and bonding social capital based on Social Capital Theory and suggests that each type of social capital will have a positive impact on SNS users' life satisfaction. In addition, this research suggests the self-construal of SNS users as a moderating variable based on Self-Construal Theory. Research design, data, and methodology - To test the hypotheses presented, an online survey was conducted with adult participants. An online research company was hired to conduct an online survey; survey participants were volunteer adult participants residing in Korea. And data was analyzed using SPSS. Results - Analysis results showed that the impact of bonding social capital on life satisfaction was not statistically different between SNS users of differing self-construals(independent vs. interdependent self-construal). However, this study also determined that the impact of bridging social capital on life satisfaction was greater for SNS users with an interdependent self-construal as opposed to those with an independent self-construal. Conclusions - The results of this study expand the scope of available research on social capital formed on SNS and provide practical implications for SNS providers.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.205-205
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• 2011

The self-assembly of ${\gamma}$-phenylalanine on Au(111) at 150 K was investigated using scanning tunneling microscopy (STM). Phenylalanine can potentially form two-dimensional (2D) molecular networks through hydrogen bonding (through the carboxyl and amino groups) and ${\pi}-{\pi}$ stacking interactions (via aromatic rings). We found that ${\gamma}$-phenylalanine molecules self-assembled on Au(111) surfaces into well-ordered structures such as ring-shaped clusters (at low and intermediate coverages) and 2D molecular domains (intermediate and monolayer coverages), whereas ${\alpha}$-phenylalanine molecules formed less-ordered structure on Au(111). The self-assembly of ${\gamma}$- but not ${\alpha}$-phenylalanine may be related to the flexibility of the carboxyl and amino groups in the molecule. Moreover, as expected, the 2D molecular network of ${\gamma}$-phenylalanine on Au(111) was mediated by a combination of hydrogen bonding and ${\pi}-{\pi}$ stacking interactions.

• 한국자동차공학회논문집
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• 제17권3호
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• pp.22-28
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• 2009

Recently, there has been an active study about smart fluid to control the vibration, in which MR fluid is evaluated as most efficient because it can generate different bonding forces based on the intensity of the external magnetic fields. This paper attempts to find a mechanism that, under limited conditions during a clutch production that uses such dynamic characteristic, defects the maximum intensity of electromagnetism. Using the finite element analysis program, we predicted a change within the bonding force of the MR fluid occurring inside the clutch when it is subjected to an increased electric current. In addition, we analyzed the change in the magnetic intensity when the coil comprising the coil control center is switched to multiple lines from the standard single line, to find a mechanism that can maximize the effect. Based on this analysis, we developed the clutch and tested its function, hoping to widen future MR fluid's range of application.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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• pp.150-151
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• 2007

We present an one-axis parallel-plate type of bulk micromachined torsional micromirror array with single crystalline silicon (SCS) fabricated on the glass substrate. Structurally, bottom electrodes (amophous silicon) in this mirror are DRIEed along the aluminum mirror patterns on SCS, which are self-aligned with mirror plates. Tracing the history of the micromirror study, we found that few papers have been published on research for uniform driving voltages based upon the tilting direction. If there is a slight misalignment during anodic bonding between top (mirror plate) and bottom electrodes, the non-uniformity of driving voltage will be led depending on two different tilting direction. This paper discusses how much the pull-in voltages can be different due to misalignment between two electrodes. Moreover, We achieve uniform pull-in voltage regardless of misalignments in photolithography and anodic-bonding between two individual layers.

• 접착 및 계면
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• 제22권2호
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• pp.69-77
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• 2021

세계적으로 지속가능한 세상을 만들기 위한 노력이 제조업에서 많이 이루어지고 있다. 이를 위해서는 사용 후 제품을 쉽고 간단하게 해체할 수 있는 설계 개념 중요하다. 접합된 제품 해체 시부품에 대한 피해가 없도록 접합부위가 분해되어 재활용이나 수리를 가능하게 하는 신기술이 최근 개발되고 있다. 본 총설에서는 조절가능한 접합-해체용 소재 기술, 특히 빛으로 해체하는 접착소재기술 동향을 정리하였다. 또한 반도체, 디스플레이 산업에 현재 활용되고 있는 빛 이용 임시 접합-해체용 필름에 대해 기술하였다.