• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.2
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• pp.67-75
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• 2013

In order to improve osseo-integration of a dental implant with bone crystal we studied an implant with holes inside its body to deliver bioactive materials based on a proposed patent. After bioactive material is absorbed, bone crystal can grow into holes to increase implant bonding in addition to surface integration. The larger cross section area of outlet holes showed the less values of the maximum stress, and the stress concentrations near the uppermost outlet holes were also reduced with an increasing number of outlet holes. The conclusion, that the uppermost outlet design improvement was most effective to reduce the stress concentration and improve the growth rate of bone crystal, could be drawn. After the design optimizations, Type 6-C had provided the best results in this study. The overall shape optimization studies on the shape, location, number, and so on, of the outlet holes, should be carried out further.

• Journal of Institute of Control, Robotics and Systems
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• v.16 no.2
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• pp.172-176
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• 2010

Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.1
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• pp.105-112
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• 2013

This paper presents the structural design and finite element analysis of precision stage based on a double triangular parallel mechanism for precision positioning and large force generation. Recently, with the acceleration of miniaturization in mobile appliances, the demand for precision aligning and bonding has been increasing. Such processes require both high precision and large force generation, which are difficult to obtain simultaneously. This study aimed at constructing a precision stage that has high precision, long stroke, and large force generation. Actuators were tactically placed and flexure hinges were carefully designed by optimization process to constitute a parallel mechanism with a double triangular configuration. The three actuators in the inner triangle function as an in-plane positioner, whereas the three actuators in the outer triangle as an out-of-plane positioner. Finite element analysis is performed to validate load carrying performances of the developed precision stage.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.12
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• pp.1115-1121
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• 2015

Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.367-368
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• 2008

한의학의 주요 방법 중 하나인 맥진은 한의사가 환자의 손목 부위를 손가락으로 진맥하여 환자의 맥동을 감지하는 행위이다. 하지만 이러한 맥진은 주관적이고 형이학적 이어서 맥진의 발전을 위해서는 맥진의 객관화와 정량화가 요구된다. 본 연구는 기존의 와이어 본딩(wire bonding)을 이용한 맥진 센서의 단점인 내성을 극복하기 위하여 FDB(Face Down Bonding) 방식을 이용하였으며, $3{\times}3$ 멀티 어레이 센서간의 crosstalk를 극복하고자 센서들을 격리시킬 수 있는 댐(dam)을 형성하였다. 또한, 댐을 감싸고 상단 및 하단에 들기를 형성하는 패드를 이용하여 피부에 접촉하도록 제작하였다. 센서의 특성을 평가하기 위하여 각 센서 출력 단자의 저항 값을 측정하였으며 센서 스펙에서 제공하는 값과 동일함을 확인하였고, 실제 요골동맥 부위에서 맥파를 측정하여 전형적인 요골동맥 맥과 파형이 측정됨을 확인하였다.

• Transactions on Electrical and Electronic Materials
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• v.15 no.2
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• pp.91-95
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• 2014

This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

• Structural Engineering and Mechanics
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• v.48 no.5
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• pp.643-660
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• 2013

Reinforced concrete structures are vulnerable to high temperature conditions such as those during a fire. At elevated temperatures, the mechanical properties of concrete and reinforcing steel as well as the bond between steel rebar and concrete may significantly deteriorate. The changes in the bonding behavior may influence the flexibility or the moment capacity of the reinforced concrete structures. The bond strength degradation is required for structural design of fire safety and structural repair after fire. However, the investigation of bonding between rebar and concrete at elevated temperatures is quite difficult in practice. In this study, bond constitutive relationships are developed for normal and high-strength concrete (NSC and HSC) subjected to fire, with the intention of providing efficient modeling and to specify the fire-performance criteria for concrete structures exposed to fire. They are developed for the following purposes at high temperatures: normal and high compressive strength with different type of aggregates, bond strength with different types of embedment length and cooling regimes, bond strength versus to compressive strength with different types of embedment length, and bond stress-slip curve. The proposed relationships at elevated temperature are compared with experimental results.

• Journal of Distribution Science
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• v.14 no.8
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• pp.35-44
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• 2016

Purpose - This study aims to understand the relationship between Chinese local SNS usage and social capital building through Chinese international students in South Korea. A research model that illustrates the relationship between the SNS usage (i.e., intensity, communication and social capital building is proposed. Based on the analysis, this study will provide responses to the question of if SNS really presents the danger of trapping international consumers in their local comfort zone or enhance social capital for the users. Research design, data, and methodology - The survey questionnaire is circulated among the WeChat (a Chinese local SNS) users who are the Chinese international students studying in South Korea. The collected data is analyzed by structural equation method using SPSS and AMOS. Results - Proposed hypotheses of the positive relationships between the attachment of SNS use and both individuals' bridging and bonding social capital are supported. It's also supported that (1) interpersonal communication, (2) interpersonal communication with old friends, and (3) interpersonal communication for making new friends on SNS positively influence individuals' bridging social capital. Conclusions - This paper demonstrates the importance of intensity of WeChat use and interpersonal communication that impact Chinese international students' bridging and bonding social capital on WeChat.

• Transactions of Materials Processing
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• v.13 no.4
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• pp.342-349
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• 2004

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair. The joining strength from the process ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance is devised to reduce the depth of drawing and the forming load. Taguchi method is employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method is used. The experiments show that in the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions is reduced by more than 65 percent and the forming load by 50 percent.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.1A
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• pp.107-112
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• 2004

We propose the optimum TO-can package design in SFF/SFP optical transceiver modules to improve 3dB-bandwidth. The frequency response of TO-38 package is measured and compared to simulation where the 3dB-bandwidth was 3.5GHz. For a higher operating bandwidth (>15GHz), the new optimized physical geometries of TO-can package such as bonding-wire, lead and material was suggested. The optimal result of simulation shows that TO-can package can be used at a higher bit rate optical module of 10Gbps.