• Computers and Concrete
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• 제12권5호
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• pp.651-668
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• 2013

Concrete structures need repairing due to various reasons such as deteriorative effects, overloading, poor quality of workmanship and design failures. Cement based repair mortars are the most widely used solutions for concrete repair applications. Various factors may affect the bond strength between concrete substrate and repair mortars. In this paper, the effects of polymer additives, strength of the concrete substrate, surface roughness, surface wetness and aging on the bond between concrete substrate and repair mortar has been investigated. Full factorial experimental design is employed to investigate the main and interaction effects of these factors on the bond strength. Analysis of variance (ANOVA) under design of experiments (DOE) in Minitab 14 Statistical Software is used for the analysis. Results showed that the interaction bond strength is higher when the application surface is wet and strength of the concrete substrate is comparatively high. According to the results obtained from the analysis, the most effective repair mortar additive in terms of bonding efficiency was styrene butadiene rubber (SBR) within the investigated polymers and test conditions. This bonding ability improvement can be attributed to the self-flowing ability, high flexural strength and comparatively low air content of SBR modified repair mortars. On the other hand, styrene acrylate rubber (SAR) modified mortars was found incompatible with the concrete substrate.

• Applied Science and Convergence Technology
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• 제26권2호
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• pp.21-25
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• 2017

The shape of the reflection spectrum is complex and appears to overlap with several signals, because the surface state is uneven due to the natural oxide film, so that the spectrum becomes a complicated signal shape divided into regions 1 and 2 due to diffuse reflection. On the other hand, it is seen that the reflection spectrum after PEO surface treatment is overlapped with several signals. In addition, the reflectance of the energy band varies from 1.32 to 1.46 eV. Usually, the MgO-type oxide film was observed at an energy band of ~4.2 eV. The thickness of the oxide film was increased as the DC voltage was increased by the thin film thickness meter (QuaNix; 7500M) after Plasma Electrolytic Oxidation (; PEO) surface treatment. This is because the higher the DC voltage, the easier the binding of the $OH^-$ ions in the solution solution and the $Mg^+$ ions of the magnesium alloy. An important part of the bonding of ordinary ions is the energy source (plasma) which can promote bonding. However, when a certain threshold voltage or more is applied, the material is adversely affected. The oxide film of the surface may be destroyed without increasing the thickness of the oxide film, that is, whitening of the material may occur.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2010년도 춘계학술대회 논문집
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• pp.592-593
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• 2010

• 한국건축시공학회지
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• 제12권4호
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• pp.442-450
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• 2012

본 연구는 50 MPa급 고강도 콘크리트 모의 기둥부재를 대상으로 PF섬유 혼입 및 방화석고보드를 부착하므로써, 내화특성 및 잔존내력에 대하여 검토하였다. 먼저, 모체 콘크리트의 기본 물성은 모두 목표 범위를 만족하는 것으로 나타났다. 내부 온도이력은 방화석고보드가 미부착된 경우 온도가 다소 높게 나타나는 경향을 보였고, 방화석고보드가 부착된 경우는 섬유 혼입율이 증가할수록 온도가 점차 낮게 분포되었다. 상호관계로는 시간이 경과할수록 섬유가 혼입된 경우에서 낮은 온도분포를 나타내었으며, 보드가 부착되었을 때 더욱 낮은 온도 경향을 확인할 수 있었다. 한편, 외관성상은 PF 0 %에서 심한 파괴 폭렬 현상이 발생하였으며, 섬유혼입율이 증가할수록 탈락 현상은 방지되었으나, 색상 변질 및 다수의 균열이 발견되었고, 보드가 부착된 경우는 혼입율이 증가할수록 외관이 양호해지는 경향을 나타내었다. 잔존 압축강도로 보드 미부착 PF 0 %에서는 강도측정이 불가능하였으며, 섬유혼입율이 증가할수록 강도는 증가하였으나, 약 30~40 %의 강도저하 현상을 나타내었고, 보드 부착 PF 0 %의 경우 강도측정은 가능하였으나 약 80 % 가량 강도가 저하하였으며, 섬유혼입율이 증가할수록 저하폭은 감소하여 약 10~20 %의 강도 저하만을 나타내었다. 이상을 종합하면, PF섬유 혼입 및 방화석고보드 부착을 개별적으로 사용하는 것보다는 두 가지 방법을 복합적으로 적용할 때 내화성능 향상에 있어서 보다 효과적일 것으로 분석되었다.

• 한국정밀공학회지
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• 제16권1호통권94호
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• pp.227-237
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• 1999

As the interface bonding phenomenon between the matrix and the reinforcements has a large effect on the mechanical properties of MMCs, a sugestion of the strength analysis technique considering the residual stress and the interface bonding phenomenon is very important for the design of pans and the estimation of fatigue behavior. In this paper the three dimensional finite element anaysis is performed during the elasto-plastic deformation of the particulate reinforced metal matrix composites. It was analyzed with the volume fractions in view of microscale. Bonding strength. interface separation and matrix void growth between the matrix and the reinforcements will be predicted on deformation under tensile loading. An interface seperation is estimated by the fracture criterion which is a critical value of generalized plastic work per unit volume. The shape of the reinforcement is assumed to be a perfect sphere. And the type of the reinforcement distribution is assumed as FCC array. The thermal residual stress in MMCs is induced by the heat treatment. It is included at the simulation as an initial residual stress. The element birth and death method of the ANSYS program is used for the estimation of the interface bonding strength, void generation and propagation. It is assumed that the fracture in the matrix region begin to occur under the external loading when the plastic work per unit volume is equal to the critical value. The fracture strain will be defined. The experimental data of the extruded $SiC_p$>/606l Al composites are compared with the theoretical results.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.37-41
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• 2014

차세대 전자 소자 기술에서 전력전달은 소자의 전력을 낮추고 발열로 인한 문제 해결을 위해서 매우 중요한 기술로 대두되고 있다. 본 연구에서는 직사각형 ABL 전력 범프를 이용한, Cu-to-Cu 플립 칩 본딩 공정의 신뢰성 문제에 대해 살펴보았다. 다이 내 범프 높이 차이는 전기도금 후 CMP 공정을 진행했을 경우 약 $0.3{\sim}0.5{\mu}m$ 이었고, CMP 공정을 진행하지 않았을 경우는 약 $1.1{\sim}1.4{\mu}m$으로 나타났다. 또한 면적이 큰 ABL 전력 범프가 입출력 범프 보다 높이가 높게 나타났다. 다이 내 범프 높이 차이로 인해 플립 칩 본딩 공정 시 misalignment 문제가 발생하였고, 이는 본딩 quality 에도 영향을 미쳤다. Cu-to-Cu 플립 칩 공정을 위해선 다이 내 범프 높이 균일도와 Cu 범프의 평탄도 조절이 매우 중요한 요소라 하겠다.

• 센서학회지
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• 제16권5호
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• Asian Spine Journal
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• 제12권6호
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• pp.1078-1084
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• 2018

Study Design: Prospective observational study. Purpose: This prospective analysis aimed to evaluate the efficacy and bone-bonding rate of hybrid hydroxyapatite (HA) spacers in expansive laminoplasty. Overview of Literature: Various types of spacers or plates have been developed for expansive laminoplasty. Methods: Expansive open-door laminoplasty was performed in 146 patients with cervical myelopathy; 450 hybrid HA spacers and 41 autogenous bone spacers harvested from the spinous processes were grafted into the opened side of each lamina. The patients were followed up using computed tomography (CT), and their bone-bonding rates for hybrid HA and autogenous spacers, bone-fusion rates of the hinges of the laminae, and complications associated with the implants were then examined. Results: Clinical symptoms significantly improved in all patients, and no major complications related to the procedure were noted. The hybrid HA spacers exhibited sufficient bone bonding on postoperative CT. The hinges completely fused in over 95% patients within 1 year of the procedure. Only 4 spacers (0.9%) developed lamina sinking, and most expanded laminae maintained their positions without sinking or floating throughout the follow-up period. Conclusions: Hybrid HA spacers contributed to high bone-fusion rates of the spacers and hinges of the laminae, and no complications were associated with their use. Cervical laminoplasty with these spacers is safe and simple, and it yields sufficient fixation strength while ensuring sufficient bone bonding during the immediate postoperative period.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 대한치과보철학회지
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• 제54권3호
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• pp.193-202
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• 2016

목적: 본 연구에서는 치과용 CAD-CAM (computer aided design-computer aided manufacturing) hybrid 수복재료인 LAVA Ultimate와 VITA ENAMIC을 광중합 복합레진을 사용하여 수리할 때 표면처리방법(grinding, air abrasion with aluminum oxide, HF acid)과 접착재료(Adper Single Bond 2, Single Bond Universal)의 종류가 두 재료 사이의 전단결합강도에 어떠한 영향을 미치는지 알아보고자 하였다. 재료 및 방법: LAVA Ultimate와 VITA ENAMIC 시편을 30일간 $37^{\circ}C$의 인공타액(Xerova solution)에 보관하여 시효처리를 실시한 후 각각 SiC paper grinding한 것, grinding 후 air abrasion처리를 추가한 것, grinding 후 HF 처리한 것으로 분류하고 각각 no bonding, Adper Single Bond 2, 또는, Single Bond Universal 도포로 세분하여 9개의 group, 총 18개의 subgroup으로 나누어 실험을 실시하였다(N=10). HF 처리group에서는 도재시편을 대조군으로 추가하였다(N=10). 표면 처리 후 광중합 복합레진(Filtek Z250)을 각각의 시편에 부착하고 이를 1주일간 실온의 물에 침적시켰고 이후 전단결합강도를 측정하고 파절양상 및 표면처리 효과를 SEM으로 확인하였다. One-way ANOVA를 이용하여 group 간의 유의성을 분석하였고 사후 분석으로 Scheffe test를 실시하였다(${\alpha}=.05$). 결과: 실험 결과 접착재료 처리를 한 group들이 접착재료 처리를 하지 않은 group에 비해 모든 표면처리에서 더 높은 전단결합력을 나타내었으며, 표면처리만 시행한 group에서는 aluminum oxide air abrasion이 전단결합력의 증가에 약간의 영향을 미치는 것으로 나타났으나 통계적 유의성은 보이지 않았다. 결론: LAVA Ultimate와 VITA ENAMIC의 두 재료를 광중합 복합레진을 이용하여 수리를 실시할 경우 각각의 재료에 적합한 표면처리방법과 접착재료의 선택에 대한 연구가 더 필요할 것으로 사료된다. 특히 LAVA Ultimate의 경우 접착재료의 사용은 추천된다고 사료되었다.