• Macromolecular Research
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• v.12 no.5
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• pp.466-473
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• 2004

We have used FT-IR spectra to explain the effects of hydrogen bonding between chitosan and polycaprolactam (PA6). A dynamic mechanical analysis study suggested that the optimum chitosan and PA6 miscibility under the conditions of this experiment were obtained at a blending ratio of 40:60. We studied the thermal degradation of chitosan blended with PA6 (chitosan/PA6) by thermogravimetric analysis and kinetic analysis (by the Ozawa method). Dry chitosan and PA6 exhibited a single stage of thermal degradation and chitosan/PA6 blends having> 20 wt% PA6 exhibited at least two stages of degradation. In chitosan/PA6 blends, chitosan underwent the first stage of thermal degradation; the second stage proceeded at a temperature lower than that of PA6, because the decomposition product of chitosan accelerated the degradation of PA6. The activation energies of the blends were between 130 and 165 kJ/mol, which are also lower than that of PA6.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.173-176
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• 2000

In this paper, we investigated the surface degradation of HTV silicone rubber used for a polymeric insulator by UV irradiation. To study the surface ageing properties by W irradiation, we used the corona discharge charging and contact angle. Therefore, we observed the change of surface charge retention and decrease of surface hydrophobicity. Also, we discussed the chemical change in the surface range using the analytic equipment such as SEM, ATR-FTIR, ESCA. Therefore, it is found that the scissor of characteristic bonding and the reattachment of oxidant bonding was developed by UV rays radiation. As discussing the corona ischarge charging and the change of contact angle, it is found the effect of UV irradiation and the mechanism of chemical reaction

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.3
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• pp.194-199
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• 2001

The turbulent flow resistance of water solution with polymer is reduced as compared with that of pure water. This effects is named th drag reduction and offers the significant reduction of the pumping power and the energy consumption. But the intense shear forces and the high temperature experienced by the polymer solution when passing through the pipes cause the degradation a loss of drag reduction effectiveness. Especially, the degradation behavior is found to be strongly dependent on temperature. This mechanical and thermal degradation can be avoided by adding materials such as surfactant to the polymer solution, which enhance the bonding force between molecules. In the present study, Copolymer and SDS were utilized and they were mixed in 10 different mixture ratios, while total concentration was fixed as 100wppm. Degradation of Copolymer-SDS mixture solutions was investigated experimentally in closed loop at the temperature of $10^{\circ}C\; and\; 80^{\circ}C$ with various flow average velocities of 1.5 m/sec, 3.0m/sec, and 4.5m/sec. Degradation characteristics of polymer solution without surfactant show a radical loss of drag reduction effectiveness at high temperature. Degradation alleviation ability of surfactant is especially effective at high temperature. Consequently, this results show that the addition of surfactant to the polymer solution can control unfavorable degradation phenomena for high temperature systems.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.22-23
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• 2016

This study aims to derive the optimal condition that ensures the monolithicity of ultra-high performance concrete (UHPC), through the evaluation of bonding shear performance with respect to the time of cold joint occurrence during the placement. From the direct shear test, while the normalized bonding shear strength reduction of UHPC with the delay time of 15 minutes was the lowest at around 8%, a dramatic degradation of bonding shear performance was observed after 15 minutes. XRD analysis of the middle and surface sections was performed in order to analyze the composition of the thin film formed at the surface of UHPC, and as a result, the main ingredient appeared to be SiO₂ from the XRD pattern of middle and surface sections, which is believed to be the result of the rising of SiO₂-based filler, used as anadmixture in this study, toward the surface, due to its low specific gravity.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.22-30
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• 2013

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.38-41
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• 2024

In semiconductor manufacturing, the alignment process is fundamental to all manufacturing steps, and alignment errors are inevitably introduced. These alignment errors can lead to issues such as increased resistance, signal delay, and degradation. This study systematically analyzes the changes in the electrical characteristics of the bonding interface when alignment errors occur in metal interconnect and bonding structures. The results show that current density tends to concentrate at the edges of the bonding interface, with the middle part of the interface being particularly vulnerable. As alignment errors increase, the current path redistributes, causing previously concentrated current areas to disappear and an effect similar to an increase in contact area, resulting in a decrease in resistance in certain vulnerable parts. These findings suggest that proposing structural improvements to eliminate the vulnerable parts of the bonding interface could lead to interconnect with significantly improved resistance performance compared to existing structure. This study clarifies the impact of alignment errors on electrical characteristics, which is expected to play a crucial role in optimizing the electrical performance of semiconductor devices and enhancing the efficiency of the manufacturing process.

• Steel and Composite Structures
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• v.20 no.5
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• pp.999-1022
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• 2016

The use of Carbon Fiber Reinforced Polymer (CFRP) to strengthen steel structures has attracted the attention of researchers greatly. Previous studies demonstrated bonding of CFRP plates to the steel sections has been a successful method to increase the mechanical properties. However, the main limitation to popular use of steel/CFRP strengthening system is the concern on durability of bonding between steel and CFRP in various environmental conditions. The paper evaluates the performance of I-section steel beams strengthened with pultruded CFRP plate on the bottom flange after exposure to diverse conditions including natural tropical climate, wet/dry cycles, plain water, salt water and acidic solution. Four-point bending tests were performed at specific intervals and the mechanical properties were compared to the control beam. Besides, the ductility of the strengthened beams and distribution of shear stress in adhesive layer were investigated thoroughly. The study found the adhesive layer was the critical part and the performance of the system related directly to its behavior. The highest strength degradation was observed for the beams immersed in salt water around 18% after 8 months exposure. Besides, the ductility of all strengthened beams increased after exposure. A theoretical procedure was employed to model the degradation of epoxy adhesive.