• 한국세라믹학회지
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• 제36권8호
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• pp.863-870
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• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 복합신소재구조학회 논문집
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• 제6권4호
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• pp.30-37
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• 2015

iFLASH System is new structural floor system which consists of sandwich panels filled with nano-composite. The nano-composite has low specific gravity and high bonding strength with steel plates. The bonding strength is one of important factors for structural performance of iFLASH System and it can further be improved by surface preparation such as blast metal cleaning. However, using none blast steel plates is recommended since surface preparation generates additional fabrication time and cost. In this study, a bonding strength test and bending experiment were conducted to check feasibility of applying none blast steel plates to iFLASH System. Moreover, stress in bonding plane between steel plates and nano-composite was analytically evaluated by finite element method. Consequently, flexural capacity of the specimen was 11% higher than theoretically calibrated value and its flexural behavior was structurally efficient without defect of bonding.

• 대한소아치과학회지
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• 제23권4호
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• pp.867-886
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• 1996

The purpose of this study was to evaluate the shearbond strength and resin-dentin interface of three different dentinal bonding systems in primary and permanent teeth. Thirty extracted human primary molars and premolars, which were non-carious and free of obvious defect, were selected for this study. All specimens were divided into six groups with two groups allocated for each of the three dentinal bonding system(All-bond 2, Scotchbond Multi-Purpose, Gluma bonding system). After completion of bonding composite to dentin using each tested dentin bonding system, bond strength measurement and histological observation were performed. The results are as follows: 1. All-bond 2 and Scotchbond Multi-Purpose, A good quality hybrid layer was identified, the morphology of which could be equated with the zone of H-E and Brown-Brenn staining. In Gluma bonding system, hybrid layer was very thin, and separated from the solid polymer. 2. All-bond 2 had the highest mean shearbond strength, followed by Scotchbond Multi-Purpose and Gluma bonding system in both primary and permanent teeth. There was no statistically significant difference between All-bond 2 and Scotchbond Multi-Purpose. Statistically significant difference could be found between Gluma bonding system and the other two groups(p<0.05). 3. The fracture patterns observed were mainly the mixture of adhesive failure and dentin dettachment pattern in All-bond 2 and Scotchbond Multi-Purpose while adhesive failure prevailed in Gluma bonding system.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.221.1-221.1
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• 2015

The vapor-liquid-solid (VLS) method, where the "liquid" catalytic droplets collecting atoms from vapor precursors build the solid crystal layers via supersaturation, is a ubiquitous technique to synthesize 1-dimensional nanoscale materials. However, the lack of fundamental understanding of chemical information governing the process inhibits the rational route to the structural programming. By combining the in situ or operando IR spectroscopy with post-growth high resolution electron microscopy, we show the strong correlation between the surface chemical species concentration and nanowire structures. More specifically, the critical role of surface adsorbed hydrogen, generated from the decomposition of Si2H6 precursor on the interplay between nanowire / kinking and the defect propagation is demonstrated. Our results show that adsorbed hydrogen atoms are responsible for selecting -oriented growth and indicate that a twin boundary imparts structural coherence. The twin boundary, only continuous at / kinks, reduces the symmetry of the trijunction and limits the number of degenerate directions available to the nanowire. These findings constitute a general approach for rationally engineering kinking superstructures and also provide important insight into the role of surface chemical bonding during VLS synthesis.

• 콘크리트학회지
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• 제11권1호
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• pp.129-139
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• 1999

본 연구는 콘크리트 구조물의 보강공법으로 널리 쓰이고 있는 강판에 의한 부착식 보강공법의 단점인 단부에서의 강판분리 현상에 대한 보완실험으로 실시되었다. 실험결과 노치가 적용된 강판부착식 공법이 항복하중 이후 최대하중까지의 증가율이 기존의 공법보다 증가되어 구조물의 보강 성능의 개선 및 안전성의 확보 측면에서 크게 개선되었을 뿐만 아니라 균열이나 처짐의 조절측면에서도 우수한 것으로 판명되었다. 이는 강판에 대한 약간의 변형만으로도 구조물의 수명을 연장시킬 수 있다는 장점과 함께 경제적으로도 보강된 구조물에 대한 추가적인 제반 비용의 절감도 기대할 수 있을 것이다.

• 한국분말재료학회지
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• 제24권6호
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• pp.489-493
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• 2017

In this study, the surface passivation process for InP-based quantum dots (QDs) is investigated. Surface coating is performed with poly(methylmethacrylate) (PMMA) and thioglycolic acid. The quantum yield (QY) of a PMMA-coated sample slightly increases by approximately 1.3% relative to that of the as-synthesized InP/ZnS QDs. The QYs of the uncoated and PMMA-coated samples drastically decrease after 16 days because of the high defect state density of the InP-based QDs. PMMA does not have a significant effect on the defect passivation. Thioglycolic acid is investigated in this study for the effective surface passivation of InP-based QDs. Surface passivation with thioglycolic acid is more effective than that with the PMMA coating, and the QY increases from 1.7% to 11.3%. ZnS formed on the surface of the InP QDs and S in thioglycolic acid show strong bonding property. Additionally, the QY is further increased up to 21.0% by the photochemical reaction. Electron-hole pairs are formed by light irradiation and lead to strong bonding between the inorganic and thioglycolic acid sulfur. The surface of the InP core QDs, which does not emit light, is passivated by the irradiated light and emits green light after the photochemical reaction.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1998년도 봄 학술발표회논문집(II)
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• pp.647-652
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• 1998

Recently, many strengthening methods are developed and used to rehabilitate existing structure. One of the popualr methods is the strengthening with steel plate. But steel plate have a defect that is a debondig at the end of the steel plate due to stress concentration. The objective of this paper is an experimental study for improving bonding properties of a strengthening plate. The two normally reinforced beams and ten strengthened beams steel plate, which has various notches were tested. The test results show that the notches of strengthening plate improve post-yield behavior significantly compared. It is proved that the notch in a strengthening plate increase of ulimate strength after the yield strength 9% more than ordinary strengthening method.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.913-916
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• 1999

Recent developments of carbon nanotubes are reviewed［1,2,3,4］. We use Tersoff carbon potential for bonded interactions［5］ and Lennard-Jones 12-6 potential for non bonding interactions［6］to describe mechanical properties of the temperature-dependent armchair single wall carbon nanotube. At first we report that through defect number and bonding energy calculation, how single wall carbon nanutube is capped in the constant temperature. (300K, 2000K, 3000K, 4000K) At second, we perform MD simulation, which are performed on the energy optimized structure of carbon nanotube.

• 대한가정학회지
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• 제25권1호
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• pp.35-42
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• 1987

Since the 1930's, a rapid development of resin processing has contributed to making our clothing life convenient and rich. Wrinkle considered as the largest defect of cellulose fiber is generated from fixation of molecules which are divided by compression or crookedness. It can be protected by building a bridge between the molecules the joint combination of the inside of the fiber. The formaldehyde reactive resin which is used in processing resin is a chemical compound with more than 2 N-methylol or N-alkoxymethylol group and a chemical compound with N-methylol shows the property of W.W and D.P through the very complex bridge-bonding reaction under the OH group of cellulose and acid catalyst. However, if the processing is excessively carried out, resin-processed textile emits the formaldehyde when the bridge bonding agent reacts to amine type under the acid condition or the formaldehyde remains in the condition of non-reaction or the resin combinates by itself, or the methylol group of non-reactive resin is hydrolyzed due to the insufficient themomagnetic treatment.