• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1376-1379
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• 2004

This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.35-40
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• 1997

The present study considers the analysis and control of the bonding process for a LOC DIe Bonder. A mathematical model for describing the bonding process is developed and proved by experiments. A feedback scheme is also applied for system in order to ensure the robustness of the bonding force control. The theoretical and experimental results are proved useful for the design and control of the LOC Die Bonder.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Journal of Technologic Dentistry
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• v.33 no.1
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• pp.25-35
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• 2011

Purpose: There are some advantages of the acrylic resin denture base ; appropriate strength, volume safety, simple processing apparatus, and low cost. But, it have a weakness for fracture by intense pressure or shock. However, the repairs for resin denture base are possible using various materials and techniques. There is a few studies in repairs for resin denture base, but not clinical researches. And there is no studies in absorbed saliva into the region of fracture and bond strength. This study is to observe re-bond strength of resin denture base after repairing under saliva absorption. Methods: The samples were made of heat curing resin and the rectangular parallelepiped specimens which were 50mm long, 10mm wide and 3mm high. The four different groups immersed in the artificial saliva for 2 weeks were prepared, 1) no repaired control samples, 2) immediately repaired samples, 3) repaired samples after 1 day dry, and 4) repaired samples after 3 days dry. The prepared samples were repaired by two different curing materials, self curing resin and heat curing resin method. Each groups composed of 10 specimens were experimented with the three point bending tests for bonding strength measuring Results: There were under condition absorbed in the artificial saliva and repaired by self curing resin method, repaired specimens after 1 day and 3 days dry groups had higher values of bonding strengths than control group, and bonding strengths of immediately repaired samples were similar to those of control samples (p<0.05). There were under condition immersed in the artificial saliva and repaired by heat curing resin method, immediately repaired samples showed similar values to bonding strengths of control groups, and repaired samples after 1 day and 3 days dry groups were lower than those of control group (p>0.05). Conclusion: In this study, the repairs for resin denture base were remarkably high values of bonding strengths than those of the past, and showed that have stable bonding strengths independent of saliva absorption of denture base, so present repairs for resin denture base can be performed, regardless of saliva conditions.

• Smart Structures and Systems
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• v.1 no.1
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.119-124
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• 2021

In a situation where Moore's law, which states that the performance of semiconductor integrated circuits doubles every two years, is showing a limit from a certain point, and it is difficult to increase the performance due to the limitations of exposure technology.In this study, a wafer hybrid method that can increase the degree of integration Various research on bonding technology is currently in progress. In this study, in order to achieve rotational precision between wafers in wafer hybrid bonding technology, modeling of θ_z alignment stage and VCM actuator modeling used for rotational alignment, magnetic field analysis and desgin, control, and evaluation are performed. The system of this study was controlled by VCM actuator, capactive sensor, and dspace, and the working range was ±7200 arcsec, and the in-position and resoultion were ±0.01 arcsec. The results of this study confirmed that safety and precise control are possible, and it is expected to be applied to the process to increase the integration.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.113-128
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• 1995

The purpose of this study was to investigate the effect of stannous fluoride on the dentin bonding with three kinds of commercially available dentin bonding systems containing different adhesive monomers. Dentin specimens with exposed labial dentin prepared from freshly extracted bovine mandibular anterior teeth were divided into experimental and control groups. The specimens of experimental groups were bonded with dentin bonding systems and composite resins including All bond 2 ㅡ& Bisfil, Scotchbond Multi-Purpose & Z100, and Denthesive II Charisma after 2 % stannous& fluorided application for S minutes and washing for 1 minute. The specimens of control groups were bonded with the same dentin bonding systems and composite resins as used in the experimental groups. After bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, the tensile bond strength and cohesive failure rate were measured, and then the pretreated dentin surfaces and the fractured dentin surfaces were examined under scanning electron microscope. The results were as follows : Mean bond strength of stannous fluoride applied groups of All bond 2, Scotchbond MP, and Denthesive II were 2.5MPa, 1.1MPa, and 1.1MPa respectively, and those of control groups were 7.5MPa, 8.1MPa, and 4.6MPa. Bond strength values of stannous fluoride applied groups were significantly lower than those of the control groups(p<0.05). SEM findings of dentin surfaces after stannous fluoride application demonstrated an appearance of partially remained smear layer and smear plugs inspite of pretreatment with 10 % phosphoric aicd or maleic acid solution, and an appearance of smear layer covered surface under Denthesive II priming. But those of control groups commonly showed clean dentin surfaces without smear layer and smear plugs. On SEM observation of the fractured dentin-resin interface, while most of the specimens of stannous fluoride applied groups showed adhesive failure mode, those of All bond 2 and Scotchbond MP control groups showed mainly adhesive-cohesive mixed failure mode, and mainly adhesive failure mode in Denthesive II control group.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Journal of Welding and Joining
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• v.18 no.1
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• pp.70-76
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• 2000

A rolled steel for structural parts and lead bronze alloy were bonded each other by a new semi-solid diffusion bonding process to investigate the effect of the process parameters, for example bonding temperature and bonding time, on the interface characteristics, and bonding behavior. It can be possible that manufacture of the bonded steel/lead bronze which has a cylindrical shape with inserted the lead bronze alloy into the steel ring by the diffusion bonding process under the semi-solid condition of the lead bronze alloy without any pressure and flux. It has been know that the control of the amount of the liquid phase in semi-solid lead bronze alloy was very important to obtain soundness interface, since the shear strength of the bonded steel/lead bronze at 850℃ for 60 minutes under the condition of about 40% of the liquid phase in the lead bronze alloy shows maximum value, 210 MPa. The shear strength increases with an increase in bonding time and show maximum value, and then decreases.

• Journal of Technologic Dentistry
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• v.39 no.3
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• pp.153-159
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• 2017

Purpose: In this study, a corresponding porcelain coating material was applied to dental Co-Cr metal among PFM. Methods: The bonding strength of the fired specimens was measured by a three-point flexural rigidity test. SEM/EDS was used to observe the surface component of specimens. Results: First, All groups were higher than the minimum bonding strength of 25 MPa specified in ISO 9693 for dental metal-ceramics specimens. Second, The bonding strength of control group(WO) is 44.64 MPa. Experimental group DM was 35.45 MPa and DP was 31.82 MPa(P<0.05). Tukey's HSD tests results have shown that the bonding strength in control group(WO) is higher than that of experimental group(DM, DP). Third, In the case of metal - porcelain bonding strength, the application of opaque porcelain and firing were higher than those of the group treated with degassing process. Conclusion: The bonding strength was higher when the powder opaque porcelain was applied than the paste opaque porcelain.