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θz Stage Design and Control Evaluation for Wafer Hybrid Bonding Precision Alignment  

Mun, Jea Wook (Korea Institute of Industrial Technology)
Kim, Tae Ho (Korea Institute of Industrial Technology)
Jeong, Yeong Jin (Korea Institute of Industrial Technology)
Lee, Hak Jun (Korea Institute of Industrial Technology)
Publication Information
Journal of the Semiconductor & Display Technology / v.20, no.4, 2021 , pp. 119-124 More about this Journal
Abstract
In a situation where Moore's law, which states that the performance of semiconductor integrated circuits doubles every two years, is showing a limit from a certain point, and it is difficult to increase the performance due to the limitations of exposure technology.In this study, a wafer hybrid method that can increase the degree of integration Various research on bonding technology is currently in progress. In this study, in order to achieve rotational precision between wafers in wafer hybrid bonding technology, modeling of θz alignment stage and VCM actuator modeling used for rotational alignment, magnetic field analysis and desgin, control, and evaluation are performed. The system of this study was controlled by VCM actuator, capactive sensor, and dspace, and the working range was ±7200 arcsec, and the in-position and resoultion were ±0.01 arcsec. The results of this study confirmed that safety and precise control are possible, and it is expected to be applied to the process to increase the integration.
Keywords
Wafer Hybrid Bonding; in-position; high precision ${\theta}_z$ control; VCM actuator;
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  • Reference
1 G. Moore, "Cramming more components onto integrated circuits", IEEE Solid-State Circuits Society Newsletter, Vol. 38, No. 8, pp.114, April 1965.
2 E. Track, N. Forbes, G, Strawn, "The End of Moore's Law", Computing in Science and Engineering, Vol. 19, No. 2, pp. 4-6, March 2017.   DOI
3 B. Rebhan, M. Bernauer, T. Wagenleitner, M. Heilig, F. Kurz, S. Lhostis, E. Deloffre, A. Jouve, V. Balan, L. Chitu, "200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS", 2015 IEEE 17th Electronics Packaging and Technology Conference, February 2016.
4 A. Jouve, V. Balan, N. Bresson, C. Euvrard-Colnat, F. Fournel, Y. Exbrayat, G. Mauguen, M. Abdel 'Sater, C. Beitia, L. Arnaud, S. Cheramy, S. Lhostis, A. Farcy, S. Guillaumet, S,. Mermoz, 1μm Pitch direct hybrid bonding with 300nm wafer-to-wafer overlay accuracy", 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, March 2018.
5 B. Brandstatter, D. Aschenwald, B. Auer, N. Bilewicz, R. Boomsma, C. Kroll, T. Widmann, "High-speed ultraaccurate direct C2W bonding", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), August 2020.
6 M. W. Nam, C. G. Kim, "A Study on Electrical Characteristics for Coil Winding Number Changes of Eddy Current Bobbin Coil for Steam Generator Tubes in NPPs", Journal of the Korean Society for Nondestructive Testing, February 2012.
7 J. S. Delis, "Design considerations, machinery and control options in coil winding", IEEE Electrical Insulation Magazine, Vol.9, July-Aug, 1993.
8 T. Plach, B. Rebhan, V. Dragoi, T. Wagenleitner, M. Wimplinger, and P. LindnerHigh, "high Accuracy Aligned Wafer Bonding for Wafer-Level Integration", The Electrochemical Society, Vol.86, No.5 2018.
9 J. W. Kim, J. S. Kim, "Development of The 3-channel Vision Aligner for Wafer Bonding Process", Journal of the Semiconductor & Display Technology, Vol. 16, No. 1. March 2017.
10 L. Peng, S.W. Kim, S. Iacovo, F. Inoue, A. Phommahaxay, E. Sleeckx, J. De Vos, D. Zinner, T. Wagenleitner, T. Uhrmann, M. Wimplinger, B. Schoenaers, A. Stesmans, V. V. Afanas'ev, A. Miller, G. Beyer, E. Beyne, "Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology", 2018 IEEE International Interconnect Technology Conference, September 2018.