• Korean Chemical Engineering Research
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• v.59 no.1
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• pp.21-34
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• 2021

Chitosan nanoparticles (CNPs) and Lactococcus lactis (L. lac.) were used as adsorbents to evaluate the adsorption performance of endocrine hormones, which are phthalates, in the healthy food packages. CNPs were produced through the cross bond with tripolyphosphate (TPP), and L. lac.-CNPs were prepared through the introduction of L. lac. during the preparation. The various functional groups of all adsorbents were identified using Fourier transform infrared spectroscopy (FTIR). Adsorption isotherm and adsorption kinetic confirmed the adsorption behavior and mechanism of CNPs, L. lac. and L. lac.-CNPs. The adsorption behavior of DBP and DEP for all particles was more suitable for the Freundlich adsorption isotherm model than for the Langmuir adsorption isotherm model, which means that the surface of the particles is heterogeneous. The adsorption mechanism was more suitable for the Pseudo-2nd-order model than for the Pseudo-1st-order model. This means that due to the presence of various functional groups on the particle surface, the adsorption of DBP and DEP is dominated by chemical adsorption such as electrostatic attraction and hydrogen bonding rather than physical adsorption. Finally, it was confirmed that the preparation of CNPs and L. lac.-CNPs can be performed easily and quickly, and it could be used as a cheaper adsorbent that can effectively remove phthalates.

• Journal of the korean academy of Pediatric Dentistry
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• v.33 no.4
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• pp.661-672
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• 2006

This study was performed to compare the shear bond strength of AQ Bond $Plus^{TM}$ with AQ $Bond^{TM}$ and Single $Bond^{TM}$. Also by observing the fractured interface under scanning electro-microscope, the fracture pattern and the quality of hybrid layer were analyzed. The possibility of clinical application of all-in-one system which has an advantage to reduce chair time for children with difficult behavior pattern was evaluated, The results obtained are as follows ; 1. There was no significant difference between AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$ in shear bond strength and Single Bond showed the highest bond strength with statistical significant difference (p<0.05). 2. Adhesive fracture pattern was mainly observed in both enamel/dentin in AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$ group while Single Bond group showed equal numbers for cohesive and adhesive pattern. 3. Under scanning electro-microscope, resin tags observed in AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$ were very weak and tangled while strong and thick tags were shown with many lateral branches in Single Bond. Careful case selection and accurate clinical application is recommended when using AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$considering the result showing its weaker strength than Single $Bond^{TM}$.

• Journal of the Korean Chemical Society
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• v.45 no.6
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• pp.555-561
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• 2001

Vinyl acetate usually used in PVA resin preparation was converted to PVAc by bulk polymerization using AIBN as a initiator and PVA was synthesized by changing the concentration of NaOH added for saponification subsequently. As a result of estimating molecular weight using GPC, molecular weight increased as the NaOH concentration increased to 2.5 N, 5.0 N, 7.5 N and 10.0 N and polydispersity had similar values of 2.1~2.3, however, showed slightly decreasing tendency. In addition, PVA saponificated by 10.0 N-NaOH showed high syndiotacticity in observation of tacticity using NMR spectroscopy. From this fact, the degree of tacticity was predicted to be high and it was in good agreement with the tendency of polydispersity by GPC. Also, from the result of FT-IR spectroscopy, it might be known that hydrolysis was more promoted in the PVA with 10.0 N-NaOH than other NaOH concentration. Intrinsic viscosity measured using Ubbelohde viscometer, which increased as the concentration of NaOH added for saponification increased. The change of shear strength with the change of shear rate was investigated using Brookfield viscometer, in consequence, viscosity of PVA synthesized decreased as shear rate increased. PVA solution confirmed to show the shear thining behavior by Casson plot and PVA with 10.0 N-NaOH had the largest yield value. DSC measurement was performed to know the thermal properties of PVA. Tp had nearly constant value of 214$^{\circ}C$ in all cases except for adding 2.5 N-NaOH and $\Delta$H was increased as the concentration of NaOH increased. From this properties, it was concluded that the degree of hydrogen bonding was proportional to the added concentration of NaOH and the increase of the degree of hydrogen bonding and hydrophobic interaction could affect the rheological and thermal properties of title compound.

• Applied Biological Chemistry
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• v.28 no.2
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• pp.68-75
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• 1985

Laboratory experiments were conducted to investigate the effect of compost and humic acid treatment on adsorption of Cd, Zn, and Cu in soils. Three soils differing in physical and chemical properties used in this experiments were Bonyrang (Typic Udifluvents) SL, Gangseo (Aquatic Eutrochrepts) L, and Gyorae (Typic Distrandepts) SiL. Adsorption of Cd, Zn, ana Cu on the soils followed Langmuir isotherm up to 75 ppm of initial concentration. The adsorption maxima of Cd, Zn, and Cu for the Bonryang soil, the lowest in pH, organic matter content, and CEC, were the lowest of the three soils. Although the Gyorae soil derived from volcanic ash was the highest in organic matter content and CEC, the adsorption maxima of heavy metals for the Gyorae soil were lower than those for the Gangseo soil of which organic content and CEC were intermidiate. The adsorption maxima/CEC ratios for the Bonryang, the Gangseo, the Gyorae soils were found to be in the range of $23{\sim}27%,\;28{\sim}57%$, and $11{\sim}14%$ respectively The bonding energy constants of Cd, Zn, and Cu for the soils were in the order of Gangseo>Bonryang>Gyorae soils. The adsorption maxima of Cd, Zu, and Cu for the Bonryang soil increased with compost treatment by $100{\sim}210%,\;90{\sim}230%$, and $130{\sim}290%$ respectively, while little difference was observed when the soil was treated with humic acid Bonding energy constants of Cd, Zn, and Cu for the Bonryang soil increased significantly with compost treatment, and showed insignificant correlation with humic acid treatment.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.17 no.2
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• pp.93-103
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• 1981

It is well-known that nowadays heat resisting and anti-corrosive materials have been widely used as the components materials of gas turbines, nuclear power plants and engines etc. In the fields of machine production industry. And materials for engine components, like as the exhaust valve of internal combustion engine, have been required to operate under the high temperature range of $700^{\circ}C$-$800^{\circ}C$ and high pressured gas with repeated mechanical load for the high performance of engines. For these components, friction welding for bonding of dissimilar steels can be applied for in order to obtain process shortening, production cost reduction and excellent bonding quality. And age hardening recently has been noticed to the heat resisting materials for further strengthening of high temperature strength, especially high temperature fatigue strength. However, it is difficult to find out any report concerning the effects of age hardening for strengthening high temperature fatigue strength to the Friction welded heat resisting and anti-corrosive materials. In this study the experiment was carried out as the high temperature rotary bending fatigue testing under the condition of $700^{\circ}C$ high temperature to the friction welded domestic heat resisting steels, SUH3-SUS303, which were 10hr., 100hr. aging heat treated at $700^{\circ}C$ after solution treatment 1hr. at $1, 060^{\circ}C$ for the purpose of observing the effects of the high temperature fatigue strength and fatigue fracture behaviors as well as with various mechanical properties of welded joints. The results obtained are summarized as follows: 1) Through mechanical tests and micro-structural examinations, the determined optimum welding conditions, rotating speed 2420 rpm, heating pressure 8kg/mm super(2), upsetting pressure 22kg/mm super(2), the amount of total upset 7mm (heating time 3 sec and upsetting time 2 sec) were satisfied. 2) The solution treated material SUH 3, SUS 303, have the highest inclination gradient on S-N curve due to the high temperature fatigue testing for long time at $700^{\circ}C$. 3) The optimum aging time of friction welded SUH3-SUS 303, has been recognized near the 10hr. at $700^{\circ}C$ after the solution treatment of 1hr. at $1, 060^{\circ}C$. 4) The high temperature fatigue limits of aging treated materials were compared with those of raw material according to the extender of aging time, on 10hr. aging, fatigue limits were increased by SUH 3 75.4%, SUS 303 28.5%, friction welded joints SUH 3-SUS 303 44.2% and 100hr. aging the rates were 64.9%, 30.4% and 36.6% respectively. 5) The fatigue fractures occurred at the side of the base matal SUS303 of the friction welded joints SUH 3-SUS 303 and it is difficult to find out fractures at the friction welding interfaces. 6) The cracking mode of SUS 303, SUH 3-303 is intergranular in any case, but SUH 3 is fractured by transgranular cracking.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.17-22
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• 2016

Flexible organic light-emitting diode (OLED) devices consist of multi-stacked thin films or layers comprising organic and inorganic materials. Due to thermal coefficient mismatch of the multi-layer films, warpage of the flexible OLED is generated during high temperature process of each layer. This warpage will create the critical issues for next production process, consequently lowering the production yield and reliability of the flexible OLED. In this study, we investigate the warpage behavior of the flexible OLED for each bonding process step of the multi-layer films using the experimental and numerical analysis. It is found that the polarizer film and barrier film show significant impact on warpage of flexible OLED, while the impact of the OCA film on warpage is negligible. The material that has the most dominant impact on the warpage is a plastic cover. In order to minimize the warpage of the flexible OLED, we estimate the optimal material properties of the plastic cover using design of experiment. It is found that the warpage of the flexible OLED is reduced to less than 1 mm using a cover plastic of optimized properties which are the elastic modulus of 4.2 GPa and thermal expansion coefficient of $20ppm/^{\circ}C$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.24.1-24.1
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• 2009

Tantalum carbo-nitride($T_aC_xN_y$) films were deposited with chemical vapor deposition(CVD) using tert-butylimido tris-diethylamido tantalum (TBTDET, $^tBu-N=Ta-(NEt_2)_3$, $Et=C_2H_5$, $^tBu=C(CH_3)_3$) between $350^{\circ}C$ and $600^{\circ}C$ with argon as a carrier gas. Fourier transform infrared (FT-IR)spectroscopy was used to study the thermal decomposition behavior of TBTDET in the gas phase. When the temperature was increased, C-H and C-N bonding of TBTDET disappeared and the peaks of ethylene appeared above $450^{\circ}C$ in the gas phase. The growth rate and film density of $T_aC_xN_y$ film were in the range of 0.1nm/min to 1.30nm/min and of $8.92g/cm^3$ to $10.6g/cm^3$ depending on the deposition temperature. $T_aC_xN_y$ films deposited below $400^{\circ}C$ were amorphous and became polycrystal line above $500^{\circ}C$. It was confirmed that the $T_aC_xN_y$ film was a mixture of TaC, graphite, $Ta_3N_5$, TaN, and $Ta_2O_5$ phases and the oxide phase was formed from the post deposition oxygen uptake. With the increase of the deposition temperature, the TaN phase was increased over TaC and $Ta_3N_5$ and crystallinity, work function, conductivity and density of the film were increased. Also the oxygen uptake was decreased due to the increase of the film density. With the increase of the TaC phase in $T_aC_xN_y$ film, the work function was decreased to 4.25eV and with the increase of the TaN phase in $T_aC_xN_y$ film,it was increased to 4.48eV.

• Journal of Korea Society of Industrial Information Systems
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• v.20 no.1
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• pp.63-77
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• 2015

As social network service(SNS) environments have been changed and increased, people perceive SNSs as a part of their daily lives. Therefore mutual communication activities based on the Internet and its influences are expanding continuously. This paper explored the difference between consumers' emotional well-being level and social capital formed through SNSs. Given that the reason of using SNS and its utilization can be different depending on consumers, this paper also examines generation differences. Hence, we examine how the forms of emotional well-being and social capital in SNSs can be different according to each generation. We conducted a survey targeting the consumers who have an experience of using online SNS and looked into the effects of emotional well-being and social capital among generations using eighty three valid samples. In this study, we find that there are differences on the effects of the sizes and the types of social capital formed through SNS, depending on the generations. In particular, the size of social capital from younger generation was larger compared to the older generation and bridging social capital, one of social capital types, was also bigger in the younger generation compared to the older generation. Although general emotional well-being was not differentiated among the generations, we could find a generation difference by showing that older generation's negative well-being, one of emotional well-being types, was more sensitive than younger generation. Based on such results, this paper proposes SNS utilization plan sub-divided by generations, suggesting management direction of online social networks.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.41-41
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• 2008

In general, polyimides (PIs) are used in alignment layers in liquid crystal displays (LCDs). The rubbing alignment technique has been widely used to align the LC molecules on the PI layer. Although this method is suitable for mass production of LCDs because of its simple process and high productivity, it has certain limitations. A rubbed PI surface includes debris left by the cloth, and the generation of electrostatic charges during the rubbing induces local defects, streaks, and a grating-like wavy surface due to nonuniform microgrooves that degrade the display resolution of computer displays and digital television. Additional washing and drying to remove the debris, and overwriting for multi-domain formation to improve the electro-optical characteristics such as the wide viewing angle, reduce the cost-effectiveness of the process. Therefore, an alternative to non-rubbing techniques without changing the LC alignment layer (i.e, PI) is proposed. The surface of LC alignment layers as a function of the ion beam (IE) energy was modified. Various pretilt angles were created on the IB-irradiated PI surfaces. After IB irradiation, the Ar ions did not change the morphology of the PI surface, indicating that the pretilt angle was not due to microgrooves. To verify the compositional behavior for the LC alignment, the chemical bonding states of the ill-irradiated PI surfaces were analyzed in detail by XPS. The chemical structure analysis showed that ability of LCs to align was due to the preferential orientation of the carbon network, which was caused by the breaking of C=O double bonds in the imide ring, parallel to the incident 18 direction. The potential of non-rubbing technology for fabricating display devices was further conformed by achieving the superior electro-optical characteristics, compared to rubbed PI.