Warpage of Flexible OLED under High Temperature Reliability Test
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Lee, Mi-Kyoung
(Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Suh, Il-Woong (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) Jung, Hoon-Sun (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) Lee, Jung-Hoon (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) Choa, Sung-Hoon (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) |
1 | G. P. Crawford, Editor, "Flexible flat panel displays", Wiley, Chichester (2005). |
2 | J. H. Ahn, H. Lee, and S. H. Choa, "Technology of flexible semiconductor/memory device", J. Microelectron. Packag. Soc., 20(2), 1 (2013). |
3 | Y. Zhang and P. L. P. Rau "Playing with multiple wearable devices: exploring the influence of display, motion and gender", Computers in Human Behavior, 50, 148 (2015). DOI |
4 | J. H. Kim and J. W. Park, "Improving the flexibility of largearea transparent conductive oxide electrodes on polymer substrates for flexible organic light emitting diodes by introducing surface roughness", Organic Electronics, 14(12), 3444 (2013). DOI |
5 | A. W. J. Gielen, M. Barink, J. van den Brand, and A. M. B. van Mol, "The electro-thermal-mechanical performance of an OLED: a multi-physics model study", 10th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Euro-SimE, 1 (2009). |
6 | C. G. Kim, H. S. Choi, M. S. Kim, and T. S. Kim, "Packaging substrate bending prediction due to residual stress", J. Microelectron. Packag. Soc., 20(1), 21 (2013). DOI |
7 | T. Mizutani, T. Ikeda, K. Miyake, and N. Miyazaki, "Warpage analysis of an LCD panel under thermo-mechanical and hygro-mechanical stress", Electronic Materials and Packaging, EMAP 2007. International Conference, 1 (2007). |
8 | M. K. Yeh, L. Y. Chang, and M. R. Lu, "Bending stress analysis of flexible touch panel", Microsyst Technol, 20 (8), 1641 (2014). DOI |
9 | C. J. Chiang, C. Winscom, S. Bull, and A. Monkman, "Mechanical modeling of flexible OLED devices", Organic Electronics, 10(7), 1268 (2009). DOI |
10 | H. Y. Low, and S. J. Chua, "Mechanical properties of organic light-emitting thin films deposited on polymer-based barrier substrate: potential for flexible organic light-emitting displays", Mater. Lett., 53(4), 227 (2002). DOI |
11 | G. G. Stoney, "The tension of metallic films deposited by electrolysis", Proceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character, 82(553), 172 (1909). |
12 | K. Roll, "Analysis of stress and strain distribution in thin films and substrates", J Appl Phys, 47, 3224 (1974). |
13 | C. C. Lee, Y. S. Shih, C. S. Wu, C. H. Tsai, S. T. Yeh, Y. H. Peng, and K. J. Chen, "Development of robust flexible OLED encapsulations using simulated estimations and experimental validations", J. Phys. D: Appl. Phys. 45(27), 275102 (2012). DOI |
14 | W. Lin and M. W. Lee, "PoP/CSP warpage evaluation and viscoelastic modeling", Electronic Components and Technology Conference, 1576 (2008). |
15 | N. Murata, "Adhesives for optical devices", Electronic Components and Technology Conference, 1178 (1998). |
16 | Y. Wang and P. Hassell, "On-line measurement of thermally induced warpage of BGAs with high sensitivity shadow moire", The International Journal of Microcircuits and Electronic Packaging, 21(2), 191 (1998). |
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