• Journal of the Korea Concrete Institute
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• v.19 no.4
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• pp.467-474
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• 2007

In this paper, a total of 13 beams with bonding, anchorage system, amount of prestressing and span length as variables of experiment were tested in flexural test and analyzed in finite element analysis; one control beam, two simplified FRP-boned beams, four prestressed FRP-unbonded beams and four prestressed FRP-bonded beams. Also, a nonlinear finite element analysis of beams in the flexural test is performed by DIANA program considered material nonlinear of concrete, reinforcement and the interfacial bond-slip model between concrete and CFRP plates. The failure mode of prestressed CFRP plated-beams is not debonding but FRP rupture. RC members strengthened with external bonded prestressed CFRP plates occurred 1st and 2nd debonding of the composite material. After the debonding of CFRP plates occurs in bonded system, behavior of bonded CFRP-plated beams change into that of unbonded CFRP-plated beams due to fix of the anchorage system. Also, It was compared flexural test results and analytical results of RC members strengthened with CFRF plates. The ductility of beams strengthened by CFRP plates with the anchorage system is considered high with the ductility index of above 3. Analysis results showed a good agreement with experiment results in the debonding load, yield load and ultimate load.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• The Journal of the Korean dental association
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• v.58 no.7
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• pp.435-442
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• 2020

Porcelain is the first ceramic material to be introduced into dentistry. Porcelain jacket crown was introduced by Dr. Charles H Land in 1886, which was an excellent aesthetic dental restoration but has not been widely used due to high firing shrinkage and low tensile strength. Then metal-ceramic system, which combines the esthetic properties of ceramics and the mechanical properties of metals, was introduced and nowadays it is still used in dental clinical field. However, the metal-ceramic system has shown some problems, such as increased lightness by reflection of light at opaque layer, shadow beneath the gingival line due to the block-out of light by metal coping, exposure of metal in margin part, bond failure between metal and porcelain, oxidation of metal coping during firing the porcelain, etc. Recently, along with the advance of fabrication methods of dental ceramics, the all-ceramic restorations with high esthetic and mechanical properties has increased and gradually replaced metal-ceramic restorations. Especially, CAD/CAM technology has opened a new era in fabricating the dental ceramic restorations. This overview will take a look at the past, present and future possibility of the dental ceramic materials.

• Journal of the Korea Concrete Institute
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• v.22 no.5
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• pp.675-684
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• 2010

The reinforced concrete members are designed to fail in flexural to lead ductile fracture. In the building structures, the failure is typically imposed on beams to prevent damages in columns. However, progression of plastic collapse mechanism may ultimately develop, a plastic hinge at the bottem end of the first floor column, which then can be subjected to shear or bond finally due to large axial force and small shear span-to-depth ratio. In this study, 10 RC column specimens failed in shear after flexural yielding was investigated to determine the factors affecting the plastic hinge length. The findings of this study showed that the most effective factor affecting the plastic hinge length was an axial force. As an axial force increase, an axial strain and a ductility ratio were decreased obviously. The test also shows the observed plastic hinge length was about 0.8~1.2d and the this result has difference compared with forward research.

• Journal of the Korean Wood Science and Technology
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• v.35 no.6
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• pp.13-22
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• 2007

This study was carried out to scrutinize possibility of manufacturing pitch pine (Pinus rigida) glued laminated timber in order to add values of pitch pine trees. Also, it was investigated to improve bending performance of pitch pine glulam. Pitch pine was imported as one of major plantation species in Korean peninsula. Machine stress rated grades of pitch pine lumber mostly ranged between E7 and E9. which grades were more or less inferior to producing high quality glulam. However, the adhesive properties between pitch pine and pitch pine, and between pitch pine and Japanese larch (Larix kaempferi Carr.), such as shear bond strength, wood failure rate and de-lamination rate of bonded layer submerged in cold and boiling water, were higher than Korean Standard criteria. These properties are essential for manufacturing glulam with single species or multiple species. The modulus of rupture (MOR) of pitch pine glulam exceeded the criterion of Korean Standard for glulam strength grade but modulus of elasticity (MOE) was lower than the criterion. On the other hand, the bending performances (MOR and MOE) were improved 20 percent by mixing with Japanese larch laminar. It is effective to arrange higher quality Japanese larch laminar at the outer layer of glulam for improving bending performances. In conclusion, it is possible to use low quality pitch pine as laminar of structural glulam for adding values of pitch pine.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.29 no.1
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• pp.73-83
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• 1997

Most of the materials used in various industrial fields and also in our daily life are multi-component materials or composite materials, and it is well known that there are many cases where adhesion between the constituents within the bonded systems plays an important role. There are various types of performance evaluation tests for the bonded materials, among which tests for evaluating the bond performance under various conditions may be regarded as the most interesting ones for those engaged in work related to adhesion. I have studied on the mechanism of adhesion form the rheological standpoint with my colleagues, including some students from Korea, and I am very happy to be able to have a talk on some of our research works. In Japan, the so-called "adhesives" are usually classified into two categories;adhesives and pressure sensitive adhesives (PSA). Adhesives are the materials which solidify after bonding and are after used as the structural adhesives because the adhesive strength is comparatively strong. On the other hand, the pressure sensitive adhesives never solidify and are used as PSA tapes, labels or decals. About the adhesives, we have examined the dependence of adhesive strength(shear, tensile, peel) upon both temperature and rate of deformation, and found out some empirical rules which are applicable to most of the adhesive systems. We have also developed a simplified theory of adhesion, which is deseribed in terms of mechanical equivalent mode1 and a few failure criteria. Although some of the common rules can be accounted for according to this theory, it must be pointed out that a fracture mechanical approach ms inevitable especially in the region where the meehanical relaxation time of the adhesive is extremely large [W. W. Lim and H. Mizumachi]. About the pressure sensitive adhesives, we have studied on the PSA performance (peel, tack, holding power) as a function of both the viscoelastic properties and surface chemical properties of the materials, and found out some rules, and again we have developed a theory which deseribes the mechanism. And in addition, we have studied on the miscibility between linear polymers and oligomers, because PSA is generally manufactured by blending gums and tackifier resins. Many phase diagrams have been found and some of them have been analyzed on thermodynamic basis, and it became evident that the miscibility is a very important factor in PSA [H. J. Kin and H. Mizumachi]. In this presentation, I want to emphasize the fact that the adhesion performance is closely related to the structure/property of the adhesives.adhesives.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of the Korean Wood Science and Technology
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• v.37 no.4
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• pp.357-363
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• 2009

This study was carried out to investigate whether adhesive used in manufacturing glulam can be used to bond wood and GFRP, when considering working process and economical efficiency. The six different glulams were manufactured, changing the adhesives and the mixing ratios of the adhesives, and investigated by the block shear test and the delamination of the water soaking or boiling water soaking. The three glulams were manufactured, using the resocinol resin based adhesive, the PVAc resin based adhesive and the epoxy resin adhesive, and the other three glulams, using the adhesives mixing resocinol resin and PVAc resin. The block shear strength is higher than $7.1N/mm^2$ in all types, which is standard of KS F3021. However, in the wood failure the block shear strength was the highest as 65.9% in the PVAc. The delamination of glulams glued with PVAc adhesive, which was 1.08% in water soaking and 4.16% in boiling water soaking, was lower than 5.00% which is the standard of KS F 3021, and the adhesive strength is good. In glulams glued with only resocinol resin adhesive, the wood layers were good as 1.26% in the water soaking delamination and 0.00% in the boiling water soaking delamination. The GFRP layers were not good as 21.85% in the water soaking delamination but were good as 1.45% in the boiling water soaking delamination.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.6
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• pp.757-764
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• 2000

Statement of the problem. All-ceramic post-and-core restorations offer a number of advantages compared with systems that use metal build-ups. In certain clinical cases, however, fractures at the joint between the post and core build-up have been reported. Purpose. The objective, therefore, is to improve the joint between the post and the core build-up. Material and methods. Three different methods were used to prepare all-ceramic post-and-core restorations; pressing IPS Empress core build-ups to CosmoPost zirconia posts, cement-ing IPS Empress core build-ups to CosmoPost zirconia posts and Celay-milling of zirconia blanks. A series of ten restorations was prepared for each of the three methods. The post-and-core complexes were tested to failure with the load applied perpendicular to the post axis. The load and deflection at fracture were recorded. Results. The highest breaking load and highest deflection were recorded for the cementing technique with values of 25.3 N and $394{\mu}m$, respectively, The corresponding values for the pressed core build-ups and the milled zirconia core build-ups were 22 N and $301{\mu}m$, and 13 N and $160{\mu}m$, respectively. All the differences are statistically significant (p=0.05). Regarding the load-dependence of the deflection, the cemented core build-ups again demonstrated the highest value with $15.5{\mu}m/N$. The difference in the values of $13.6{\mu}m/N\;and\;13{\mu}m/N$ recorded for the pressed-on and milled core build-ups, respectively, were statistically insignificant. Conclusion. In regard to the high fracture resistance of zirconia post, adhesive cementing the core build-up to the post offers a viable alternative to the conventional pressing technique. The elastic bond between the rigid high-strength zirconia post and the core build-up presents an additional advantage.

• Korean Journal of Heritage: History & Science
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• v.46 no.4
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• pp.78-89
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• 2013

For safe conservation treatment of damaged accessory relics that were unearthed, the quality of the material should be accurately identified through a nondestructive analysis and failure analysis. This study provides the basic conservational scientific data regarding material analyses and conservation treatment that were conducted for 11 relics, including amber and agate that were discovered during the repair of Geumsansa Temple's Hall of Maitreya Buddha and Left Attendant Buddhas in June 2008. An ultraviolet analysis, SEM-EDS analysis and FT-IR microscope analysis revealed that the physical and chemical characteristics of the 11 relics are the same as those of amber. It is inferred that the cracks and exfoliation of the surface of most amber relics is attributable to darkening of the color due to C=C bond oxidation. It is also assumed that cracks and exfoliation occurred from the weathered layer on the amber surface. As such, it is appropriate to engage in conservation treatment of the damaged amber relics by using $Paraloid^{(R)}$ B67 reinforcing agent that is diluted in nonpolar solvent. The greatest care is needed for future handling of organic artifacts.