• 제목/요약/키워드: bipolar transistors

검색결과 111건 처리시간 0.025초

A novel radiation-dependence model of InP HBTs including gamma radiation effects

  • Jincan Zhang;Haiyi Cai;Na Li;Liwen Zhang;Min Liu;Shi Yang
    • Nuclear Engineering and Technology
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    • 제55권11호
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    • pp.4238-4245
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    • 2023
  • In order to predict the lifetime of InP Heterojunction Bipolar Transistor (HBT) devices and related circuits in the space radiation environment, a novel model including gamma radiation effects is proposed in this paper. Based on the analysis of radiation-induced device degradation effects including both DC and AC characteristics, a set of empirical expressions describing the device degradation trend are presented and incorporated into the Keysight model. To validate the effective of the proposed model, a series of radiation experiments are performed. The correctness of the novel model is validated by comparing experimental and simulated results before and after radiation.

Effects of Fast Neutron Irradiation on Switching of Silicon Bipolar Junction Transistor

  • Sung Ho Ahn;Gwang Min Sun
    • Journal of Radiation Protection and Research
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    • 제48권3호
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    • pp.124-130
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    • 2023
  • Background: When bipolar junction transistors (BJTs) are used as switches, their switching characteristics can be deteriorated because the recombination time of the minority carriers is long during turn-off transient. When BJTs operate as low frequency switches, the power dissipation in the on-state is large. However, when BJTs operate as high frequency switches, the power dissipation during switching transients increases rapidly. Materials and Methods: When silicon (Si) BJTs are irradiated by fast neutrons, defects occur in the Si bulk, shortening the lifetime of the minority carriers. Fast neutron irradiation mainly creates displacement damage in the Si bulk rather than a total ionization dose effect. Defects caused by fast neutron irradiation shorten the lifetime of minority carriers of BJTs. Furthermore, these defects change the switching characteristics of BJTs. Results and Discussion: In this study, experimental results on the switching characteristics of a pnp Si BJT before and after fast neutron irradiation are presented. The results show that the switching characteristics are improved by fast neutron irradiation, but power dissipation in the on-state is large when the fast neutrons are irradiated excessively. Conclusion: The switching characteristics of a pnp Si BJT were improved by fast neutron irradiation.

Measurement of III-V Compound Semiconductor Characteristics using the Contactless Electroreflectance Method

  • Yu, Jae-In;Choi, Soon-Don;Chang, Ho-Gyeong
    • Journal of Electrical Engineering and Technology
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    • 제6권4호
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    • pp.535-538
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    • 2011
  • The electromodulation methods of photoreflectanceand the related technique of contactless electroreflectance(CER) are valuable tools in the evaluation of important device parameters for structures such as heterojunction bipolar transistors, pseudomorphic high electron mobility transistors, and quantum dots(QDs). CER is a very general principle of experimental physics. Instead of measuring the optical reflectance of the material, the derivative with respect to a modulating electric field is evaluated. This procedure generates sharp, differential-like spectra in the region of interband (intersubband) transitions. We conduct electric-optical studies of both GaAs layers and InAs selfassembled QDs grown by molecular beam epitaxy. Strong GaAsbandgap energy is measured in both structures. In the case of lnAs monolayers in GaAs matrices, the strong GaAsbandgap energy is caused by the lateral quantum confinement.

Temperature Stable Current Source Using Simple Self-Bias Circuit

  • Choi, Jin-Ho
    • Journal of information and communication convergence engineering
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    • 제7권2호
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    • pp.215-218
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    • 2009
  • In this paper, temperature stable current and voltage references using simple CMOS bias circuit are proposed. To obtain temperature stable characteristics of bias circuit a bandgap reference concept is used in a conventional circuit. The parasitic bipolar transistors or MOS transistors having different threshold voltage are required in a bandgap reference. Thereby the chip area increase or the extra CMOS process is required compared to a standard CMOS process. The proposed reference circuit can be integrated on a single chip by a standard CMOS process without the extra CMOS process. From the simulation results, the reference current variation is less than ${\pm}$0.44% over a temperature range from - $20^{\circ}C$ to $80^{\circ}C$. And the voltage variation is from - 0.02% to 0.1%.

3V에 동작하는 PCS 단말기용 표면실장형 전압제어 발전기의 설계 및 제작 (Design and fabrication of the surface mountable VCO operating at 3V for PCS handset)

  • 염경환
    • 한국통신학회논문지
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    • 제21권3호
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    • pp.784-794
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    • 1996
  • 본 논문에는 PCS(WACS/TDMA) 단말기 내의 국부발진기에 적용 가능한 표면실장형 전압제어발진기의 체계적인 설계방법을 기술했다. 능동소자로는 표면 실장형 package로 구성되고 $f_{gamma}$가 4GHz인 silicon bipolar transistior를 2개 사용했으며 이들의 발진 한계로 인해 분리형으로 설계했고 공진기는 4층의 multilayer PCB의 제 3층을 이용한 strip line 공진기를 사용했다. 설계된 전압제어 발진기는 $12{\times}10{\times}4mm$의 크기를 가지며 동작 전압 3V에서 22mA의 전류소모와 출력 0 dBm, 주파수 조정폭 50MHz이상, 위상잡음이 중심주파수에서 100kHz offset 시 -100dBc/Hz의 성능을 보이고 있다. 크기와 전류소모 면에서는 개선이 요구되며 크기 면에서 개선은 좀더 소형인 chip부품을 사용 가능할 것이며, 전류소모 면에서는 좀더 높은 $f_{gamma}$를 갖는 transistor를 사용 개선할 수 있을 것으로 사료된다.

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바이어스 스트레스에 의한 실리콘-게르마늄 이종접합 바이폴라 트랜지스터의 열화 현상 (The degradation phenomena in SiGe hetero-junction bipolar transistors induced by bias stress)

  • 이승윤;유병곤
    • 한국진공학회지
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    • 제14권4호
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    • pp.229-237
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    • 2005
  • 바이어스 스트레스 인가 후에 발생하는 실리콘-게르마늄 이종접합 바이폴라 트랜지스터(SiGe HBT)의 열화현상을 고찰하였다. SiGe HBT가 바이어스 스트레스에 일정 시간 노출되면 소자 내부의 변화에 의하여 소자 파라미터가 원래 값으로부터 벗어나게 된다. 에미터-베이스 접합에 역방향 바이어스 스트레스가 걸리면 전기장에 의해 가속된 캐리어가 재결합 중심을 생성하여 베이스 전류가 증가하고 전류이득이 감소한다. $140^{\circ}C$ 이상의 온도에서 높은 에미터 전류를 흘려주는 순방향 바이어스 전류 스트레스가 가해지면 Auger recombination이나 avalancHe multiplication에 의해 형성된 핫 캐리어가 전류이득의 변동을 유발한다. 높은 에미터 전류와 콜렉터-베이스 전압이 동시에 인가되는 mixed-mode 스트레스가 가해지면 에미터-베이스 역방향 바이어스 스트레스의 경우와 마찬가지로 베이스 전류가 증가한다. 그러나 miked-mode 스트레스 인가 후에는 inverse mode Gummel 곡선에서 베이스 전류 증가가 관찰되고 perimeter-to-area(P/A) 비가 작은 소자가 심각하게 열화되는 등 에미터-베이스 역방향 바이어스 스트레스와는 근본적으로 다른 신뢰성 저하 양상이 나타난다.

A Study on SFCL with IGBT Based DC Circuit Breaker in Electric Power Grid

  • Bae, SunHo;Kim, Hongrae;Park, Jung-Wook;Lee, Soo Hyoung
    • Journal of Electrical Engineering and Technology
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    • 제12권5호
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    • pp.1805-1811
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    • 2017
  • Recently, DC systems are considered as efficient electric power systems for renewable energy based clean power generators. This discloses several critical issues that are required to be considered before the installation of the DC systems. First of all, voltage/current switching stress, which is aggravated by large fault current, might damage DC circuit breakers. This problem can be simply solved by applying a superconducting fault current limiter (SFCL) as proposed in this study. It allows a simple use of insulated-gate bipolar transistors (IGBTs) as a DC circuit breaker. To evaluate the proposed resistive type SFCL application to the DC circuit breaker, a DC distribution system is composed of the practical line impedances from the real distribution system in Do-gok area, Korea. Also, to reflect the distributed generation (DG) effects, several DC-to-DC converters are applied. The locations and sizes of the DGs are optimally selected according to the results of previous studies on DG optimization. The performance of the resistive type SFCL applied DC circuit breaker is verified by a time-domain simulation based case study using the power systems computer aided design/electromagnetic transients including DC (PSCAD/ EMTDC(R)).

전력용 IGBT의 시뮬레이션과 과도 해석 (Simulation of Power IGBT and Transient Analysis)

  • 서영수
    • 한국시뮬레이션학회논문지
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    • 제4권2호
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    • pp.41-60
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    • 1995
  • The IGBT(Insulated Gate Bipolar Transistor) is a power semiconductor device that has gained acceptance among circuit design engineers for motor drive and power converter applications. IGBT devices(International Rectifier, Proposed proposed model etc) have the best features of both power MOSFETs and power bipolar transistors, i.e., efficient voltage gate drive requirememts and high current density capability. When designing circuit and systems that utilize IGBTs or other power semiconductor devices, circuit simulations are needed to examine how the devices affect the behavior of the circuit. The interaction of the IGBT with the load circuit can be described using the device model and the state equation of the load circuit. The voltage rise rate at turn-off for inductive loads varies significantly for IGBTs with different base life times, and this rate of rise is important in determing the voltage overshoot for a given series resistor-inductor load circuit. Excessive voltage overshoot is potentially destructive, so a snubber protection circuit may be required. The protection circuit requirements are unique for the IGBT and can be examined using the model. The IGBT model in this paper is verified by comparing the results of the model with experimented results for various circuit operating conditions. The model performs well and describes experimented results accurately for the range of static and dynamic condition in which the device is intended to be operated.

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무선 송수신모듈용 실리콘 바이폴라 트랜지스터의 새로운 전류원 모델링 (A New Current Source Modeling of Silicon Bipolar Transistor for Wireless Transceiver Module)

  • 서영석
    • 조명전기설비학회논문지
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    • 제19권3호
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    • pp.93-98
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    • 2005
  • 근거리에서의 무선설비제어, 구내음성통신과 같은 전파통신설비의 송수신 모듈에 실리콘 바이폴라 트랜지스터가 많이 사용되고 있다. 이러한 실리콘 바이폴라 트랜지스터의 내부 전류원에 대한 새로운 모델링 방법이 제시되었다. 제안된 방법은 Si-BJT의 새로운 열 저항 추출방법과 전류원 파라메터에 대한 새로운 해석적인 방정식에 기반을 두고 있다. 이 방법은 기존의 방법에서 채택된 반복적인 최적화 과정 없이 바로 파라메터를 구할 수 있다. 제안된 방법을 5개의 핑거를 가지는 $0.4\times20[{\mu}m^2]$ 의 Si-BJT에 이 방법을 적용시켰으며, 모델링된 데이터는 측정결과를 $3[\%]$ 이내의 오차로 잘 예측하였다.

Bi-directional Two Terminal Switching Device based on SiGe for Spin Transfer Torque (STT) MRAM

  • Yang, Hyung-Jun;Kil, Gyu-Hyun;Lee, Sung-Hyun;Song, Yun-Heub
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.385-385
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    • 2012
  • A two terminal N+/P/N+ junction device to replace the conventional selective transistor was studied as a bilateral switching device for spin transfer torque (STT) MRAM based on 3D device simulation. An N+/P/N+ junction structure with $30{\times}30nm$ area requires bi-directional current flow enough to write a data by a drain induced barrier lowering (DIBL) under a reverse bias at N+/P (or P/N+ junction), and high current on/off ratio of 106. The SiGe materials are widely used in hetero-junction bipolar transistors, bipolar compensation metal-oxide semiconductors (BiCMOS) since the band gap of SiGe materials can be controlled by changing the fraction and the strain epilayers, and the drift mobility is increased with the increasing Ge content. In this work, N+/P/N+ SiGe material based junction provides that drive current is increased from 40 to $130{\mu}A$ by increased Ge content from 10~80%. When Ge content is about 20%, the drive current density of SiGe device substantially increased to 2~3 times better than Si-based junction device in case of 28 nm P length, which is sufficient current to operation of STT-MRAM.

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