• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2003.10a
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• pp.415-421
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• 2003

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.104-104
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• 1999

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2018.11a
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• pp.265-266
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• 2018

• The monthly packaging world
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• s.361
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• pp.65-69
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• 2023

• Journal of Korean Society of Coastal and Ocean Engineers
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• v.30 no.1
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• pp.10-18
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• 2018

Recently, a port city has been gradually expanding near coastal area, and many facilities for tourism and waterfront have been constructed near the shore. When storm surge developed by typhoon have occurred, coastal facilities have a lot of damage and failure with loss of life caused directly by the waves. Various barriers have been suggested to protect property and human life from disasters, they have not been widely applied though. Because they do not satisfy the recent trends that emphasize the surrounding scenery. In this study, a moveable barrier on revetment is proposed against wave overtopping. This moveable barrier has two function, sightseeing and protecting. In case of usual day, it is installed on the revetment and used observatory deck for sightseeing. When wave overtopping has occurred by storm surge, it protect coastal area through changing of flat deck to triangular barrier. The hydraulic and the structural performance of the newly proposed movable barrier was investigated through numerical analysis using commercial program. As a results, this structure has numerically good performance, and follow-up research is required through experimental tests though.

• Advances in aircraft and spacecraft science
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• v.4 no.1
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• pp.37-52
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• 2017

Gas turbines operating in dusty or sandy environment polluted with micron-sized solid particles are highly prone to blade surface erosion damage in compressor stages and molten sand attack in the hot-sections of turbine stages. Commercial/Military fixed-wing aircraft engines and helicopter engines often have to operate over sandy terrains in the middle eastern countries or in volcanic zones; on the other hand gas turbines in marine applications are subjected to salt spray, while the coal-burning industrial power generation turbines are subjected to fly-ash. The presence of solid particles in the working fluid medium has an adverse effect on the durability of these engines as well as performance. Typical turbine blade damages include blade coating wear, sand glazing, Calcia-Magnesia-Alumina-Silicate (CMAS) attack, oxidation, plugged cooling holes, all of which can cause rapid performance deterioration including loss of aircraft. The focus of this research work is to simulate particle-surface kinetic interaction on typical turbomachinery material targets using non-linear dynamic impact analysis. The objective of this research is to understand the interfacial kinetic behaviors that can provide insights into the physics of particle interactions and to enable leap ahead technologies in material choices and to develop sand-phobic thermal barrier coatings for turbine blades. This paper outlines the research efforts at the U.S Army Research Laboratory to come up with novel turbine blade multifunctional protective coatings that are sand-phobic, sand impact wear resistant, as well as have very low thermal conductivity for improved performance of future gas turbine engines. The research scope includes development of protective coatings for both nickel-based super alloys and ceramic matrix composites.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.1
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• pp.41-47
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• 2015

In this paper, the effective electron Schottky barrier height (${\Phi}_{Bn}$) of the Ni silicide/n-silicon (100) interface was studied in accordance with different thicknesses of the antimony (Sb) interlayer for high performance n-channel MOSFETs. The Sb interlayers, varying its thickness from 2 nm to 10 nm, were deposited by radio frequency (RF) sputtering on lightly doped n-type Si (100), followed by the in situ deposition of Ni/TiN (15/10 nm). It is found that the sample with a thicker Sb interlayer shows stronger ohmic characteristics than the control sample without the Sb interlayer. These results show that the effective ${\Phi}_{Bn}$ is considerably lowered by the influence of the Sb interlayer. However, the current level difference between Schottky diodes fabricated with Sb/Ni/TiN (8/15/10 nm) and Sb/Ni/TiN (10/15/10 nm) structures is almost same. Therefore, considering the process time and cost, it can be said that the optimal thickness of the Sb interlayer is 8 nm. The effective ${\Phi}_{Bn}$ of 0.076 eV was achieved for the Schottky diode with Sb/Ni/TiN (8/15/10 nm) structure. Therefore, this technology is suitable for high performance n-channel MOSFETs.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.95-95
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• 2014

An OLED(Organic Light-Emitting Diode) device based on the emissive electroluminescent layer a film of organic materials. OLED is used for many electronic devices such as TV, mobile phones, handheld games consoles. ULVAC's mass production systems are indispensable to the manufacturing of OLED device. ULVAC is a manufacturer and worldwide supplier of equipment and vacuum systems for the OLED, LCD, Semiconductor, Electronics, Optical device and related high technology industries. The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and TCO (Transparent Conductive Oxide) films. ULVAC has delivered a large number of these systems not only Organic Evaporating systems but also LTPS CVD systems. The most important technology of thin-film encapsulation (TFE) is preventing moisture($H_2O$) and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass substrate, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This report provides a review of promising thin-film barrier technologies as well as the WVTR(Water Vapor Transmission Rate) properties. Multilayer thin-film deposition technology of organic and inorganic layer is very effective method for increasing barrier performance of OLED device. Gases and water in the organic evaporating system is having a strong influence as impurities to OLED device. CRYO pump is one of the very useful vacuum components to reduce above impurities. There for CRYO pump is faster than conventional TMP exhaust velocity of gases and water. So, we suggest new method to make a good vacuum condition which is CRYO Trap addition on OLED evaporator. Alignment accuracy is one of the key technologies to perform high resolution OLED device. In order to reduce vibration characteristic of CRYO pump, ULVAC has developed low vibration CRYO pumps to achieve high resolution alignment performance between Metal mask and substrate. This report also includes ULVAC's approach for these issues.

• Journal of the Korea Institute of Building Construction
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• v.18 no.5
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• pp.463-469
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• 2018

A currently used roof green system with multi layers has a low constructability. Therefore a new integrated waterproof & root barrier sheet and roof green box unit system was developed using steel plate fixture and cone type fixture by electromagnetic induction heating method. This study was proceeded to evaluate adhesion performance of two types of fixtures on Engineering PE, TPO, PVC sheet in a normal condition, repeated heating and cooling condition. As a result, adhesion load on Engineering PE sheet showed the highest value. The adhesion loads of steel plate fixture showed higher value as heating temperature was getting higher. However adhesion loads of cone type fixture showed opposite tendency. Regarding to the test conditions, test results of normal condition, repeated heating and cooling condition showed same value. The cone type fixture using butyl tape showed 7 times lower adhesion load than that of cone type fixture using electromagnetic heating and 28% lower adhesion load in a repeated heating and cooling condition than a usual condition.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.37-41
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• 2012

The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.