• Title/Summary/Keyword: ball transfer

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The Effects of a Group Exercise Program with Competitive Games on Balance in Chronic Stroke Patients (경쟁적 게임을 적용한 집단 운동 프로그램이 만성 뇌졸중 환자의 균형에 미치는 영향)

  • Yong-Ho, Cho;Sun-Wook, Park
    • Journal of the Korean Society of Physical Medicine
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    • v.17 no.4
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    • pp.133-139
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    • 2022
  • PURPOSE: The purpose of this study was to investigate the effects of a group exercise program with competitive games on balance in chronic stroke patients. METHODS: The subjects were chronic stroke patients living at home after their discharge from the hospital. A total of 32 subjects were divided into two groups. The experimental group performed a group exercise program with competitive games, and the control group performed individual exercises. The exercise program duration was one hour, and it comprised 10 minutes of stretching, 40 minutes of the main exercise, and 10 minutes of stretching at the end. The experimental group was divided into two teams of 8 players each and played competitive games (transfer a gym ball to another person, relay 10 m walking and return, transfer an object to the next person using both arms while sitting). The control group performed an arm/trunk exercise for 15 minutes and gait training for 25 minutes. These exercises were conducted twice a week (4 weeks). The Berg Balance Scale (BBS) and timed up-and-go (TUG) tests were performed to confirm the change in balance. RESULTS: In the experimental group, BBS showed a significant increase (p < .05) and TUG showed a significant decrease (p < .05). In the control group, there was no statistically significant change in the BBS. However, the TUG showed a significant decrease (p < .05). The BBS and TUG both showed statistically significant differences (p < .05) in the between-group comparison of the change in pre-post intervention values. CONCLUSION: A group exercise program with competitive games to improve the balance ability for fall prevention in chronic stroke patients could be used as a good intervention method.

A Design of the Active Web Server Supporting Synchronous Collaboration in the Web-Based Groupware Systems (동기화된 협동을 지원하기 위한 능동형 웹 서버 설계)

  • 허순영;배경일
    • Journal of the Korean Operations Research and Management Science Society
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    • v.24 no.4
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    • pp.157-170
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    • 1999
  • The web-based groupware systems hold many possibilities for system developers and users. Especially, web-based group collaborative systems are emerging as enterprise-wide information systems. Since data in group collaborative systems are apt to be shared among multiple concurrent users and modified simutaneously by them, the web-based group collaborative systems must support synchronous collaboration in order to provide users with synchronized and consistent views of shared data. However, current web technologies have limitations in supporting this, largely because the existing Hypertext Transfer Protocol(HTTP) is unidirectional and does not allow web servers to send messages to their web browsers without first receiving requests from them. This paper proposes an active web server that can overcome such limitations and facilitate synchronous collaboration in web-based group collaborative systems. To accomplish such goals, the active web server manages dependency relationships beween shared data and web browsers referencing them and actively propagates changing details of the shared data to all web browsers referencing them. And, this paper examines usefulness and effectiveness of the active web server to apply it to the ball-bearing design example of concurrent engineering design systems. The prototype system of the active web server is developed on a commercial Object-oriented Database Management System(0DBMS) called OBJECTSTERE using the C++ programming language.

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Critical Speed Analysis of the Liquid Rocket Turbopump (액체로켓 터보펌프의 임계 속도 해석)

  • Jeon, Seong-Min;Kwak, Hyun-Duck;Yoon, Suk-Hwan;Kim, Jin-Han
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.33 no.6
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    • pp.92-99
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    • 2005
  • Numerical analyses of critical speed and mass unbalance response are performed for a 30 ton thrust turbopump. The stiffness and damping of ball bearings and non-contact seals are quantified under aerodynamic and hydrodynamic loads induced by a fuel pump and turbine. Critical speed margin and tip displacements of the rotating parts are evaluated using a three-dimensional finite element method. The results are used to ensure the soundness of the rotordynamic design using an one-dimensional transfer matrix method. A further study shows that sufficient resonance margin may be assured via controlling the stiffness of the rotor support by employing an additional elastic ring to the bearing support.

A Study on the Vibration Analysis of an Automobile Steering System (승용차 스티어링 칼럼 시스템의 진동해석에 관한 연구)

  • 김찬묵;김도연
    • Journal of KSNVE
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    • v.8 no.3
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    • pp.494-503
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    • 1998
  • In this paper, in order to analyze dynamic characteristics of an automobile steering system consisting of many components, natural frequencies and transfer functions of each component and the total system are found on a FFT analyzer by experiments. Then, the data are transmitted to a commercial package program, CADA-PC. By analyzing the data, the mode shape of each natural frequency and damping values are obtained. Also, the function of a rubber coupling in column and telescoping effects on system are considered. C.A.E commercial programs are used to compare with the results of experiments. For the finite element modeling, I-DEAS is used. Data processing and post processing are operated on NASTRAN and XL, respectively. The ball-bearing and the linkage of shaft with column are modeled by spring element. Stiffness is modified from the results of experiments. The results of those show close agreement. In the mode shape of total system, wheel mode is dominant at lower frequency, while the column mode is main mode at higher. The role of rubber coupling in vibration isolation is clear on mode shape. Telescoping function makes natural frequency of column changed.

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A Study on Balancing of High-speed Spindle of CNC Automatic Lathe (CNC 자동선반 고속 스핀들의 밸런싱에 관한 연구)

  • Kim, Tae-Jong;Koo, Ja-Ham;Lee, Shi-Bok;Kim, Moon-Saeng
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.19 no.11
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    • pp.1214-1221
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    • 2009
  • A high-speed spindle can be very sensitive to rotating mass unbalance which has harmful effect on many machine tools. Therefore, the balancing procedure to reduce vibration in rotating system is certainly needed for all high-speed spindles. So, balancing procedure was performed with a spindle-bearing system for CNC automatic lathe by using numerical procedure. The spindle is supported by the angular contact ball bearings and the motor rotor is fixed at the middle of spindle. The spindle-bearing system has been investigated using combined methodologies of finite elements and transfer matrices. The balancing was performed through influence coefficient method and the comparison was made by whirl responses between before balancing and after balancing. As a result, balancing of simple spindle model reduced whirl orbit magnitude in case of a completely assembled spindle model.

Critical Cleaning Requirements for Back End Wafer Bumping Processes

  • Bixenman, Mike
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.57-64
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    • 2000
  • As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

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Critical Cleaning Requirements for Back End Wafer Bumping Processes

  • Bixenman, Mike
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.1
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    • pp.51-59
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    • 2000
  • As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

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A Study on Balancing of High Speed Spindle using Influence Coefficient Method (영향계수법을 이용한 고속 스핀들의 밸런싱에 관한 연구)

  • Koo, Ja-Ham;Kim, In-Hwan;Hur, Nam-Soo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.4
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    • pp.104-110
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    • 2012
  • The spindle with a built-in motor can be used to simplify the structure of machine tool system, while the rotor has unbalance mass inevitably. A high-speed spindle can be very sensitive to rotating mass unbalance which has harmful effect on many machine tools. Therefore, the balancing procedure to reduce vibration in rotating system is certainly needed for all high-speed spindles. So, it was performed with a spindle-bearing system for CNC automatic lathe by using numerical procedure. The spindle is supported by the angular contact ball bearings and the motor rotor is fixed at the middle of spindle. The spindle-bearing system has been investigated using combined methodologies of finite elements and transfer matrices. The balancing was performed through influence coefficient method and the comparison was made by whirl responses between before balancing and after balancing. As a result, balancing of simple spindle model reduced whirl orbit magnitude in case of a completely assembled spindle model.

Electrochemistry Characteristics of $Li_4Ti_5O_{12}$ Anode Electrode for Li-ion Battery (리튬전지용 $Li_4Ti_5O_{12}$ 음극전극의 전기화학적 특성)

  • Oh, Mi-Hyun;Kim, Han-Joo;Kim, Young-Jae;Son, Won-Keun;Lim, Kee-Joe;Park, Soo-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.340-341
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    • 2005
  • Lithium titanium oxide as anode material for energy storage prepared by novel synthesis method. $Li_4Ti_5O_{12}$ based spinel-framework structures are of great interest material for lithium-ion batteries. We describe here $Li_4Ti_5O_{12}$ a zero-strain insertion material was prepared by novel sol-gel method and by high energy ball milling (HEBM) of precursor to from nanocrystalline phases. According to the X-ray diffraction and scanning electron microscopy analysis, uniformly distributed $Li_4Ti_5O_{12}$ particles with grain sizes of 100nm were synthesized. Lithium cells, consisting of $Li_4Ti_5O_{12}$ anode and lithium cathode showed the 173 mAh/g in the range of 1.0 $\sim$ 3.0 V. Furthermore, the crystalline structure of $Li_4Ti_5O_{12}$ didn't transfer during the lithium intercalation and deintercalation process.

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Analysis of the Dynamic Behavior of a CNC Automatic Lathe Spindle System (CNC 자동선반 스핀들시스템의 동적 거동 해석)

  • Kim, T.J.;Koo, J.H.;Lee, S.B.;Kim, M.S.
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.19 no.3
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    • pp.261-267
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    • 2009
  • The spindle with a built-in motor can be used to simplify the structure of machine tool system, while the rotor has unbalance mass inevitably. Therefore, it is important to recognize the effect of unbalance mass. This paper presents analysis of dynamic behavior of a high speed spindle with a built-in motor. The spindle is supported by the angular contact ball bearings and the rotor is fixed at the middle of spindle. The spindle used in CNC automatic lathe has been investigated using combined methodologies of finite elements and transfer matrices. The Houbolt method is used for the integration of the system equations and the dynamic behavior of spindle is obtained considering unbalance mass of rotor. Results show that increasing rotational speed of spindle magnifies the whirl responses of spindle seriously. Also the whirl responses of spindle are affected by the other factors such as unbalance mass and bearing stiffness.