• 제목/요약/키워드: baking process

검색결과 128건 처리시간 0.031초

전북 지방의 유과 제조 방법 및 소비자들의 유과 선호도 조사 (Research Study of Yukwa Baking Process, a Traditional Desert Originated from Jeonbuk, Korea)

  • 김중만;한은주;차경옥
    • 동아시아식생활학회지
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    • 제20권3호
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    • pp.402-414
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    • 2010
  • A survey was conducted to study the ingredient and the nutrition of Yukwa consumed in Jeonbuk region. Additional survey was performed to the adult population in Jeobook region to identify the recognition and improvement of Yukwa. The ingredient and baking process varies from each region. The modernization of Yukwa baking process requires introduction of new flavour using new ingredient and simplification of the baking process as these two factors are holding back the modernization of the Yukwa. Top quality Yukwa can be produced by standardized baking process, using top quality agricultural goods, cultivated in Korea. The key to making Yukwa more accessible to the public is by simplifying the current baking process, including the drying process Bandegi, which is the most complicated process of all.

Soft-Baking 처리를 통한 용액 공정형 In-Zn-O 박막 트랜지스터의 전기적 특성 향상 (Improvement in Electrical Characteristics of Solution-Processed In-Zn-O Thin-Film Transistors Using a Soft Baking Process)

  • 김한상;김성진
    • 한국전기전자재료학회논문지
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    • 제30권9호
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    • pp.566-571
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    • 2017
  • A soft baking process was used to enhance the electrical characteristics of solution-processed indium-zincoxide (IZO) thin-film transistors (TFTs). We demonstrate a stable soft baking process using a hot plate in air to maintain the electrical stability and improve the electrical performance of IZO TFTs. These oxide transistors exhibited good electrical performance; a field-effect mobility of $7.9cm^2/Vs$, threshold voltage of 1.4 V, sub-threshold slope of 0.5 V/dec, and a current on/off ratio of $2.9{\times}10^7$ were measured. To investigate the static response of our solutionprocessed IZO TFTs, simple resistor load type inverters were fabricated by connecting a resistor (5 or $10M{\Omega}$). Our IZO TFTs, which were manufactured using the soft baking process at a baking temperature of $120^{\circ}C$, performed well at the operating voltage, and are therefore a good candidate for use in advanced logic circuits and transparent display backplanes.

제과제빵 기술의 발전과 베이커리 시장의 분석 (Development of Baking Technology and Analysis of Domestic and International Bakery Market and Trends)

  • 이광석
    • 식품과학과 산업
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    • 제45권4호
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    • pp.16-20
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    • 2012
  • Although the technology of breadmaking simply goes through the process of mixing, fermentation, and baking, it is very hard to make a same product every day. The reason is that baking science begins with the very first process of breadmaking which is mixing, and every steps and working environments are so closely connected. The baking science has developed in short time since the theory of fermentation has released. If you check the development of baking technology synthetically, it is consisted of the discovery of nutritional and functional ingredients, the optimization process of new machines, and the maintenance of the quality as fulfilling social demands. Because the baking business is making and selling the product, baking itself is a business, and it has the form that manufacturing and service business coexist. In today's current domestic bakery market, the supply exceeds the demand. Moreover, the concept of bakery itself has been changing from the fixed image of bakery which is selling the bread to the differentiated bakery with others. As we look at the general bakery's trends, it is focused on going back to the basic or traditions, going to the functional, and working with automations. To conclude, the baking has a long history, but it actually has the short history in the technological development. Baking business can be viewed as the simple business, but many factors are related to the business. It has a few basic kinds of products in baking, but it has diverse kinds of products with the base of infinite creativity. Even though it is physically a hard working business, it is also a business that can face with fun. For managing a bakery, finally, the differentiated strategy with other bakery that maximizes the customers' value is needed.

고강도 강판 저항 점용접부 강도 및 파단에 미치는 Paint Baking의 영향 (The Effect of Paint Baking on the Strength and Failure of Spot Welds for Advanced High Strength Steels)

  • 최철영;이동윤;김인배;김양도;박영도
    • 대한금속재료학회지
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    • 제49권12호
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    • pp.967-976
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    • 2011
  • Conventional fracture tests of resistance spot welds have been performed without consideration of the paint baking process in the automobile manufacturing line. The aim of this paper is to investigate the effect of the paint baking process on load carrying capacity and fracture mode for resistance spot welded 590 dual phase (DP), 780DP, 980DP, 590 transformation in duced plasticity (TRIP), 780TRIP and 1180 complex phase (CP) steels. With paint baking after resistance spot welding, the l-shape tensile test (LTT) and nano-indentation test were conducted on the as-welded and paint baked samples. Paint baking increased the load-carrying capacity of the resistance spot welded samples and improved the fracture appearance from partial interfacial fracture (PIF) to button fracture (BF). Improvement in fracture appearance after LTT is observed on weldments of 780 MPa grade TRIP steels, especially in the low welding current range with paint baking conditions. The higher carbon contents (or carbon equivalent) are attributed to the low weldability of the resistance spot welding of high strength steels. Improvement of the fracture mode and load carrying ability has been achieved with ferrite hardening and carbide formation during the paint baking process. The average nano-indentation hardness profile for each weld zone shows hardening of the base metal and softening of the heat affected zone (HAZ) and the weld metal, which proves that microstructural changes occur during low temperature heat treatment.

제빵 굽기 공정의 신경회로망 모형화 (Neural Network Modeling for Bread Baking Process)

  • 김승찬;조성인;전재근
    • 한국식품과학회지
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    • 제27권4호
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    • pp.525-531
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    • 1995
  • 제빵 공정 중의 굽기 공정을 대상으로 공정에 이용되는 오븐의 예측 제어를 위해 빵의 부피, 색깔, 빵의 온도 변화를 예측할 수 있는 모형을 개발하였다. 첫째, 모형 개발을 위해 필요한 데이터 획득을 위해 영상 처리 장치, K-type 열전쌍 온도 센서 등을 이용하여, 굽기 공정 중의 물리적 변화를 측정하였다. 빵의 상태 변화는 부피가 먼저 증가하고, 부피 증가가 멈춘 후에 색깔의 변화가 수반되었다. 표면 온도는 초기에 급격히 상승한 후에 완만한 상승으로 전환되었고, 내부 온도는 초기에 어느 정도 일정한 온도를 유지하다가, 중반에 급격한 상승을 나타내고, 이후에 다시 일정하게 유지되었다. 부피, 색과, 품온 간의 상호관계는 비선형적인 관계를 가진 것으로 판명되었다. 둘째, 빵의 부피, 색 변화를 예측하기 위해 MLP구조와 BP학습을 이용하여, 30초, 2분 이후의 부피 및 색 변화를 예측할 수 있는 모형과 부피, 색, 오븐 온도를 입력으로 품은 및 표면 온도를 예측할 수 있는 모형을 개발하였다. 개발된 모형의 예측 오차가 각각 4.62%, 7.38%, 1.09%로, 굽기 공정 중의 빵의 상태를 유의성 있게 예측할 수 있었다.

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Evaluation of Deodorization Capabilities, Morphologies, and Thermal Stabilities of Baking Soda, Charcoal, Coffee, and Green Tea for Kimchi Packaging Application

  • Jeong, Suyeon;Yoo, Seung Ran
    • 한국포장학회지
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    • 제26권1호
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    • pp.1-9
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    • 2020
  • We evaluated the applicability of baking soda, charco'al, coffee, and green tea as a natural deodorant in Kimchi packaging. Moreover, to evaluate the potential usage of these deodorants in packaging materials and confirm their applicability in high-temperature melt-extrusion processing, the thermal stabilities of the deodorants were investigated, and heat-treated deodorants were evaluated in terms of the deodorizing function compared with non-treated deodorants. Aroma patterns were decreased after deodorizing treatment with all-natural deodorants. Dimethyl disulfide, methyl trisulfide, and diallyl disulfide, the most significant odorous Volatile organic compounds (VOCs) of Kimchi, decreased after treatment with the deodorants. In particular, baking soda and charcoal showed the highest efficiency in removing odorous compounds and VOCs from Kimchi, even after high-temperature processing. The acetic acid removal rates for both baking soda and charcoal were 99.9±0.0%. The heating process increases the deodorizing effects of baking soda. Sensory evaluation results showed that there is a significant increase (p < 0.05) in the overall preference for Kimchi samples packaged with charcoal and baking soda. This study provides useful information for the deodorization effects of natural deodorants for Kimchi smell and their applicability for packaging materials.

KSTAR 토카막 진공용기 및 플라즈마 대향 부품의 탈기체 처리를 위한 가열 해석 (The baking analysis for vacuum vessel and plasma facing components of the KSTAR tokamak)

  • 이강희;임기학;조승연;김종배;우호길
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 추계학술대회논문집B
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    • pp.247-254
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    • 2000
  • The base pressure of vacuum vessel of the KSTAR (Korea Superconducting Tokamak Advanced Research) Tokamak is to be a ultra high vacuum, $10^{-6}{\sim}10^{-7}Pa$, to produce clean plasma with low impurity containments. For this purpose, the KSTAR vacuum vessel and plasma facing components need to be baked up to at least $250^{\circ}C,\;350^{\circ}C$ respectively, within 24 hours by hot nitrogen gas from a separate baking/cooling line system to remove impurities from the plasma-material interaction surfaces before plasma operation. Here by applying the implicit numerical method to the heat balance equations of the system, overall temperature distributions of the KSTAR vacuum vessel and plasma facing components are obtained during the whole baking process. The model for 2-dimensional baking analysis are segmented into 9 imaginary sectors corresponding to each plasma facing component and has up-down symmetry. Under the resulting combined loads including dead weight, baking gas pressure, vacuum pressure and thermal loads, thermal stresses in the vacuum vessel during bakeout are calculated by using the ANSYS code. It is found that the vacuum vessel and its supports are structurally rigid based on the thermal stress analyses.

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780 MPa급 TRIP강의 저항 점용접부 강도 및 파단에 미치는 Paint Baking의 영향 (Effect of Paint Baking on the Strength and Failure of Spot Welds for 780 TRIP Steels)

  • 손종우;남대근;김동철;박영도
    • Journal of Welding and Joining
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    • 제28권2호
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    • pp.66-73
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    • 2010
  • Conventional fracture test of resistance spot weld had been performed without consideration of paint baking process in automobile manufacturing line. This study was aim to investigate the effect of paint baking on fracture mode and load carrying capacity in fracture test for resistance spot welded 780TRIP steels. With paint baking cycle after resistance spot welds, peel tests and microhardness were conducted on the as-welded and baked samples. Resistance spot welds in AHSS (Advanced High Strength Steels) are prone to display partial interfacial fractures during fracture test or vehicle crash. Baking cycle increased the load-carrying capacity of the resistance spot welded samples and improved the fracture appearance from partial to full button fracture for the L-type peel tests. Specially, the differences in fracture appearance are apparent when the nugget size of spot welds is small enough to produce the partial interfacial fracture. The comparison of macrohardness and microstructure between as-welded and baked samples showed that there are no large difference in change the fracture mode. However, the results of the instrumented indentation test suggested that fusion zone and HAZ of baked sample have less tensile and yield strength and proves that the tempering effects are applied and enhanced the resistance to fracture on welds with application of baking cycle.

Extreme baking effect of interlayer on PLED's performance

  • Kim, Mu-Gyeom;Kim, Sang-Yeol;Lee, Tae-Woo;Park, Sang-Hun;Park, Jong-Jin;Pu, Lyong-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1775-1778
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    • 2006
  • Through baking process on an interlayer, known as hole transporting layer, varying baking temperature up to 300 degree, which is considered as extremely high for polymer light emitting device (PLED) system, we found interesting relationship between packing density and morphology affecting device performance. Granular morphology shows that as temperature increases, grain size is getting smaller to pack closely and make interlayer harden. Such denser interlayer has temperature dependency of its own mobility, even without clear evidence of degradation of material itself. Its fact proven in a single film also reflects on multilayered PLED's performance like IVL, efficiency, lifetime. It's found that, especially, to enhance lifetime is related with thermal stability of interlayer and its mobility dependency to meet better charge balance. Therefore, it gives us understanding not only baking effect of interlayer, but also material & device designing guide to enhance lifetime.

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마이크로파 가열에 의한 고구마의 가공 특성 (Effects of Microwave Heating on Processing of Whole Sweetpotatoes)

  • 금준석;;한억
    • 한국식품조리과학회지
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    • 제10권2호
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    • pp.138-141
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    • 1994
  • Whole, peeled sweetpotatoes were subjected to four different processes: 15 min microwave heating followed by 15 min baking (1), 90 min baking (2), 15 min microwave heating (3), and 15 min boiling followed by 15 min microwave heating (4). Samples of green and cured roots were used in the study. Scanning electron photomicrographs revealed that cured roots contained larger numbers of starch granules in the parenchyma cells than green roots, most of them compounded. The starch in cooked green roots was gelatinized while for cured roots it was mostly hydrolyzed into dextrins and sugars. Starch in process (3) roots was mostly gelatinized while in process (1) and process (2) roots gelatinized starch appeared in little quantity, thus it was primarily converted to dextrins and sugars. The process (4) resulted in little conversion of starch. The process (1) product resulted in a similar product to the process (2) product.

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