• Journal of Welding and Joining
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• 제18권2호
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• pp.191-191
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• 2000

The mechanism of the blowhole and the pit formation in lap-jointed fillet CO₂ arc welds of Zn-coated steel sheet was established by the direct observation of the gas behavior in the molten pool with the high speed camera system. Main conclusions obtained are as follows1) Some blowholes were formed by incomplete back-filling to the pits at the last stage of the solidification. This type of blowhole was formed through four stages of gas in the molten pool, incubation, explosion, back-filling and completion of back-filling stage.2) Most of the pits was back-filled at the last stage of their formation. (Received September 27, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.64-68
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• 2000

The mechanism of the blowhole and the pit formation in lap-jointed fillet Co₂arc welds of Zn-coated steel sheet was established by the direct observation of the gas behavior in the molten pool with the high speed camera system. Main conclusions obtained are as follows: 1) Some blowholes were formed by incomplete back-filling to the pits at the last stage of the solidification. This type of blowhole was formed through four stages of gas in the molten pool, incubation, explosion, back-filling and completion of back-filling stage. 2) Most of the pits was back-filled at the last stage of their formation.

• 한국지반환경공학회 논문집
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• 제10권6호
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• pp.19-25
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• 2009

본 연구에서는 산업부산물인 인산석고와 EPS 조각을 기존의 성토용 토사에 혼합하여 지반응력을 감소시킴으로써 고함수비로 준설매립된 공유수면 내 초연약지반의 침하, 활동파괴, 측방유동 등의 문제를 해결할 수 있는 경량혼합토를 개발하였다. 개발된 경량혼합토는 공유수면 매립지역에서 대량이용이 가능한 도로 및 교대의 성토재료, 각종 뒤채움재로의 사용에 대한 적용성을 평가하기 위하여 기본물성시험, 다짐시험, CBR시험, 전단강도시험 등 일련의 실내시험을 수행하였고 지반공학적 특성을 검토하였다. 시험결과, 경량혼합토의 최대건조단위중량은 $14.32{\sim}15.79kN/m^3$, 최적함수비는 21.91~24.23%로 일반 화강풍화토와 비교할 때 9.4~19.3%의 하중감소 효과가 있으며, 수정 CBR값은 10.4~18.4%로 국내 도로노상 및 뒤채움재에 대한 규정을 만족하는 것으로 나타났다. 또한 전단강도정수는 점착력 10.79~18.64kPa, 내부마찰각 $35.4{\sim}37.2^{\circ}$로 각각 나타나 국내에서 일반적으로 사용되는 성토재료 및 뒤채움재 범위를 충족시키는 것으로 평가되어 실제 성토재료 및 뒤채움재로 연약지반에서 효과적으로 활용이 가능할 것으로 판단되었다. 본 연구를 통하여 개발된 인산석고 경량혼합토는 하중감소 효과가 있으면서도 전단강도와 지지력면에서 큰 문제가 없어서 연약한 임해매립지반의 도로 노상토 및 뒤채움재로 사용될 수 있어 인산석고의 대량 재활용방안이 될 것으로 판단된다.

• The Korean Journal of Pain
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• 제21권3호
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• pp.217-223
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• 2008

Background: Lumbar transforaminal epidural injections (LTEIs) have been utilized in the treatment of radicular pain, and LTEIs have the advantage of target-specificity. However, there have not been enough studies on the contrast patterns in LTEIs with using fluoroscopy. The purpose of this study was to evaluate the spreading epidural contrast patterns that are seen during real-time fluoroscopic guided LTEIs. Methods: A total of 131 patients who underwent fluoroscopic guided LTEIs were studied. The inclusion criteria were those patients with low back pain and/or lower extremity pain that was caused by a herniated nucleus pulposus, lumbar spinal stenosis, failed back surgery syndrome, and herpes zoster-associated pain. We classified the contrast patterns in regard to the contrast flow spreading to the nerve root and/or the unilateral, bilateral or cylinderic type of epidural spreading on the AP view of the fluoroscopy and the ventral or dorsal epidural filling on the lateral view. In addition to the pattern analysis, we evaluated the range of contrast spreading from the cranial to the caudal epidural filling and the incidence of an intravascular flow pattern. Results: Epidural spreading was seen in 126 cases (96.2%) of the total patients through the nerve root. Ventral spreading occurred in 120 cases (95.2%). On the AP view, a nerve root with unilateral, bilateral and cylinderic epidural filling was noted for 108 (85.7%), 9 (7.1%) and 9 (7.1%) cases, respectively. The contrast spreading to vertebral segments was smaller for the patients with lumbar spinal stenosis and failed back surgery syndrome than for the other groups (P < 0.0083). The incidence of intravascular injection was 11.1% (14/126). Conclusions: LTEIs using fluoroscopic visualization provided excellent assessment of the ventral epidural filling as well as nerve root filling. However, unilateral epidural spreading was prominent for the LTEIs.

• 한국수소및신에너지학회논문집
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• 제35권3호
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• pp.300-309
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• 2024

Hydrogen utilization in the transportation sector, which relies on fossil fuels, can significantly reduce greenhouse gas by using to hydrogen fuel cell vehicles, and its adoption depends performance of hydrogen refueling station. The present study developed a model to simulate the back-to-back filling process of heavy duty hydrogen fuel cell vehicles at hydrogen refueling stations using a cascade method. And its quantitatively evaluated hydrogen refueling station performance by simulating various mass flow rates and storage tank capacity combinations, analyzing vehicle state of charge (SOC) of vehicles. In the cascade refueling system, the capacity of the high-pressure storage tank was found to have the greatest impact on the reduction of filling time and improvement of efficiency.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2005년도 춘계 학술발표회 논문집
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• pp.1283-1290
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• 2005

A thixotropic grout has been newly developed for the use of back-filling a tail void in the shield tunnel and filling up ground voids. The grout developed in the study is a mixture of colloidal silica, cement and some functional additives. Its engineering characteristics was investigated by measuring a viscosity and unconfined compressive strengths. The optimum mixing proportion for an effective thixotropic grout was proposed through several repeated laboratory tests. The various physical properties such as thixotropy, unconfined compressive strengths, and durability of the thixotropic grout and the gels produced from the grout were compared with those of the well-known waterglass grout such as L.W.. The thixotropic grout developed in the study exhibited an excellent performance for back-filling of tail voids, based on experimental results compared to the existing waterglass grout.

• 한국지반환경공학회 논문집
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• 제20권1호
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• pp.13-17
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• 2019

This paper presents case history of railway embankment excess settlement on soft clay during service in southern region of Korea. A lot of field observations show that the measured settlements are a lot larger than settlements actually calculated in this area. Back analysis is carried out to verify the soil parameters which are intended to investigate in the subsurface exploration phase and later in a laboratory test program. Recommendations and causes for the engineering practice are suggested to review the determination of excess settlements and, consequently, to improve the settlement prediction. This enormous discrepancy is due to the passing over secondary consolidation, and the design filling did not meet to real construction filling. Immediate settlement could be subsidiary factor of excess settlement.

• Restorative Dentistry and Endodontics
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• 제16권2호
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• pp.118-125
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• 1991

Eighty - eight recently extracted teeth were used to evaluate the leakage characteristics of the following retrofilling materials; amalgam, zinc oxide eugenol cement, glass - ionomer cement, and cermet glass - ionomer cement. Root canals were prepared with step - back method and obturated with gutta percha and zinc oxide eugenol sealer. Root apex were resected 2 mm from apex and class I cavities were prepared with 2 mm or 4 mm depth. The cavities were filled with above materials. After application of varnish on all surface except resected surface, the roots were placed in 1 % methylene blue solution for 6 days. After longitudinal polishing to expose cental parts of filled materials, penetrated depths of dye were measured. The results were as follws. 1. As retrofilling material, glass ionomer cement filling groups showed less leakage than the other groups except zinc oxide eugenol cement filling group(p<0.01). 2. Amalgam filling groups had greater leakage than zinc oxide eugenol cement filling group(p<0.01). 3. 4 mm depth of retrofilled cavity had no effect on leakage characteristics compared with 2 mm depth cavity(p>0.05). 4. Glass ionomer cement and cermet glass ionomer cement filling groups showed less apical leakage than amalgam filling groups. But there was no statistical significance(p>0.05). 5. There was no difference in apical leakage between glass ionomer cement filling groups and cermet glass ionomer cement filling groups(p>0.05).

• 동력기계공학회지
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• 제19권3호
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• pp.69-74
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• 2015

Check valves used in vessels include shock-release function on piping system, aside from basic back flow prevention. However, proper and enough protection of system is not obtainable due to use of high-pressure and bulk fluids, resulting from enlargement of vessels. In this study, casting analysis of check valves protecting systems in flow path from water hammering or back flow is conducted, using Z-CAST program. Also, molten metal filling, flow analysis, solidification analysis and shrinkage cavity analysis are conducted. The main results are as following. Regarding filling of each risering, molten metal showed stable supply condition without being isolated. It was identified that the final solidification exists on risering, but shrinkage cavity possibly might happens at the point of isolation solidification.

• Journal of Welding and Joining
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• 제32권3호
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.