• ETRI Journal
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• 제32권4호
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• pp.614-617
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• 2010

For an antenna-in-package (AiP), via holes are used to connect the antenna ground and system ground. In this letter, a dual-frequency AiP with a U-slot embedded in the patch is proposed. By properly arranging three via holes under the non-radiating edge, an AiP with two resonant frequencies is realized. Then a U-slot is embedded in the patch to further improve the bandwidth of the AiP. To validate the proposed design, an AiP with the bandwidth of 4.49% at 2.45 GHz and 6.02% at 5.32 GHz is achieved and fabricated. The measured results agree with the simulated results.

• 한국전자파학회논문지
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• 제18권5호
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• pp.563-568
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• 2007

본 논문에서 제안된 패키지 안테나는 900 MHz RFID 대역에 적용하기 위하여 미엔더 라인과 단락 핀을 부설하고 LTCC(Low Temperature Cofired Ceramic) 층의 공동 내부에 RFID BGA(Ball Grid Array) 칩을 장착하였다. BGA 칩과 안테나 사이에 발생되는 커플링과 혼신을 감소시키기 위한 격리 특성을 확보하기 위하여 접지면과 비아 펜스를 부설하여 Faraday Cage를 구현하였다. 제안된 안테나는 낮은 주파수 대역에서 패키지 단계의 안테나 구현에 관점을 두었다. 제안된 안테나의 크기는 $13mm{\times}9mm{\times}3.51mm$이며, 측정된 안테나의 공진 주파수는 0.893 GHz, 임피던스 대역폭은 9 MHz, 최대 방사 이득은 -2.36 dBi를 나타내었다.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.15-22
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• 2013

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

• ETRI Journal
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• 제33권5호
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• pp.802-805
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• 2011

This letter presents a K-band polarization reconfigurable antenna integrated with a silicon radio frequency MEMS switch into the form of a compact package. The proposed antenna can change its state from linear polarization (LP) to circular polarization (CP) by actuating the MEMS switch, which controls the configuration of the coupling ring slot. Low-loss quartz is used for a radiating patch substrate and at the same time for a packaging lid by stacking it onto the MEMS substrate, which can increase the system integrity. The fabricated antenna shows broadband impedance matching and exhibits high axial ratios better than 15 dB in the LP and small axial ratios in the CP, with a minimum value of 0.002 dB at 20.8 GHz in the K-band.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1511_1512
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• 2009

This paper presents a polarization switching antenna integrated with silicon RF MEMS SPDT switches in the form of a package. A low-loss quartz substrate made of SoQ (silicon-on-quartz) bonding is used as a dielectric material of the patch antenna, as well as a packaging lid substrate of RF MEMS switches. The packaging/antenna substrate is bonded with the bottom substrate including feeding lines and RF MEMS switches by BCB adhesive bonding, and RF energy is transmitted from signal lines to antenna by slot coupling. Through this approach, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects, which are all caused from the packaging methods, can be reduced. This structure is expected to be used as a platform for reconfigurable antennas with RF MEMS tunable components. A linear polarization switching antenna operating at 19 GHz is manufactured based on the proposed method, and the fabrication process is carefully described. The s-parameters of the fabricated antenna at each state are measured to evaluate the antenna performance.

• 한국산업정보학회논문지
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• 제19권1호
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• pp.19-24
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• 2014

In this work, a compact patch antenna based on a low temperature cofired ceramic (LTCC) has been presented for V-band system-on-package (SoP) applications. In order to integrate it with transceiver block, a waveguide (W/G) to embedded microstrip line (eMSL) vertical transition was designed using slot-fed double stacked patch antennas for easy assembly and wide bandwidth. The $2{\times}2$ patch antenna integrating the transition was designed and fabricated in the 5-layer LTCC dielectrics. The whole size of the fabricated antenna including the $2{\times}2$ patches, transition and W/G was $20{\times}24{\times}5.39mm^3$. The fabricated antenna has achieved a 10 dB impedance bandwidth of 2.45 GHz from 61 to 63.45 GHz.

• Journal of Electrical Engineering and Technology
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• 제13권5호
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• pp.2004-2010
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• 2018

We propose a small active antenna to receive Global Navigation Satellite System (GNSS) signals, i.e., Global Positioning System (GPS) L1 (1,575MHz) and Russian Global Navigation Satellite System (GLONASS) L1 (1,600 MHz) signals. A two-stage low-noise amplifier (LNA) with more than 27 dB gain is implemented in the bottom layer of a three-layer antenna package. In addition, a hybrid coupler is used to combine signals from pair of proximately coupled orthogonal feeds with $90^{\circ}$ phase difference to achieve the circular polarization (CP) characteristic. Three layers of high permittivity (${\varepsilon}_r=10$) substrates are stacked and effectively integrated to have a small dimension of $64mm{\times}64mm{\times}7.42mm$ (including both circuit and antenna). The reflection coefficient of the fabricated antenna at the target frequency is below -10 dB, the measured antenna gain is above 26 dBic and the measured noise figure is less than 1.4 dB.

• 소음진동
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• 제4권3호
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• pp.327-335
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• 1994

In this paper, to identify the dynamic characteristics of antenna system, the antenna is divided into 4 components and those were analyzed with a conventional FEM package MSC/NASTRAN. Using a Component Mode Synthesis Method, dynamic characteristics of total system is also identified. The Coherence of each component to total system is evaluated by using strain and kinetic component to total system is evaluated by using strain and kinetic energy. The improving strategy of dynamic characteristics is suggested by changing mass and stiffness of large coherence components.

• 한국산업정보학회논문지
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• 제4권4호
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• pp.111-116
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• 1999

본 논문에서는 마이크로스트립의 단점인 대역폭을 개선하기 위해 마이크로스트림 전송선로가 있는 유전체 층(layer)과 복사 다이폴이 있는 유전체 층사이에 또 하나의 기생 다이폴(parasitic dipole)을 갖는 유전체 층이 있는 3층(3-layer)의 구조를 갖는 안테나를 제시하였다. 제시된 구조에서 파라미터들(복사 다이폴의 길이와 offset 위치, 기생 다이폴의 폭과 길이 및 기생 다이폴의 offset 위치 등)을 변화하여 궤환 손실(return loss)을 계산한 후, 최적 대역폭을 갖는 3-layer 안테나를 설계하였다. 그리고 설계된 3-layer와 기생 다이폴이 없는 2-layer 안테나의 대역폭을 각각 비교하였으며 또한 안테나를 제작 실험하여 이론치와 실험치를 비교 검토하였다. 앙상블(Ensemble 5.1)을 사용하여 시뮬레이션 하였다

• 한국정보통신학회논문지
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• 제3권2호
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• pp.305-311
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• 1999

본 논문에서는 유전율 1.06, 두께 $\lambda$/4인 발포체 기판상의 얇은 필름에 인쇄한 새로운 형태의 단일층 마이크로스트립 패치 안테나를 설계했다. 안테나의 대역폭이 광대역 임피던스정합을 얻기 위하여 3차원 트랜지션을 사용한다. 안테나의 방사패턴 및 반사손실, 전압정재파비는 "IE3D" 시뮬레이션 패키지를 사용하여 계산하여 측정결과와 비교했다. 측정 결과 전압정재파비 $\le$ 2:1 인 대역폭이 중심주파수 6.8 GHz에서 약 65%로 광대역 안테나임을 입증하였다. 그리고 반사손실 및 전압정재파비는 계산치와 실험치가 거의 일치하였다. 거의 일치하였다.