Design for a Dual-Frequency Antenna-in-Package
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Li, Li
(College of Physics and Electronics Engineering, Shanxi University)
Han, Liping (College of Physics and Electronics Engineering, Shanxi University) Han, Guorui (College of Physics and Electronics Engineering, Shanxi University) Chen, Xinwei (College of Physics and Electronics Engineering, Shanxi University) Geng, Yanfeng (College of Physics and Electronics Engineering, Shanxi University) Zhang, Wenmei (College of Physics and Electronics Engineering, Shanxi University) |
1 | Y.P. Zhang, "Finite-Difference Time-Domain Analysis of Integrated Ceramic Ball Grid Array Package Antenna for Highly Integrated Wireless Transceivers," IEEE Trans. Antennas Propag., vol. 52, no. 2, Feb. 2004, pp. 435-442. DOI ScienceOn |
2 | Y.P. Zhang, "Novel Antenna-in-Package Design in LTCC for Single-Chip RF Transceivers," IEEE Trans. Antennas Propag., vol. 56, no. 7, 2008, pp. 2079-2088. |
3 | Y.P. Zhang, "Integration of Microstrip Antenna on Cavity-Down Ceramic Ball Grid Array Package," Electron. Lett., vol. 38, no. 22, 2002, pp. 1307-1308. DOI ScienceOn |
4 | S.H. Wi et al., "Package-Level Integrated LTCC Antenna for RF Package Application," IEEE Trans. Adv. Packag., vol. 30, no. 1, Feb. 2007, pp. 132-141. DOI |
5 | S.H. Wi et al., "Package-Level Integrated Antennas Based on LTCC Technology," IEEE Trans. Antennas Propag., vol. 54, no. 8, 2006, pp. 2190-2197. |
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