• Journal of Magnetics
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• v.22 no.2
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• pp.175-180
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• 2017

CoNi alloy films prepared from electrolytes with various concentrations of cobalt ions were studied in the paper. Influences of different cobalt ions concentrations on electrochemistry processes, components, microstructures, surface morphologies and magnetic properties of CoNi films were investigated. It was found that CoNi film plating was a kind of anomalous codeposition process. The percentage of cobalt content in CoNi films was higher than that of in the electrolyte. Moreover, with the rise of cobalt ions concentrations, the percentage of cobalt content in the samples increased gradually. CoNi films possessed crystal structures with four stronger diffraction peaks. However, CoNi films prepared from bath with higher cobalt ions possessed hcp structures which contributed to dendrite structures resulting in the increase of coercivity.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.71-75
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• 2022

In this research, Fe-Ni alloy films were electrodeposited on stainless steel (SS304 and SS430) and Ti plates to investigate the effects of surface conditions of cathode on deposits. The Ti plates were electropolished in 3 M H₂SO₄-methanol electrolytes at various conditions before electrodeposition, and unpolished Ti and the optimized specimen, polished at 10 V for 8 min, were used as cathode. The anomalous codeposition, the phenomenon which more active Fe is reduced preferentially, occurred on all substrate, however, there were differences in composition of all deposits. As the results of potential monitoring during electrodeposition, it was confirmed that the larger overpotential was applied to the deposition cell when using Ti cathode, leading to high Fe content of deposits from unpolished Ti due to increase in nucleation of Fe. Also, it was founded that the polished Ti can reduced deposition overpotential.

• Nuclear Engineering and Technology
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• v.52 no.9
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• pp.2025-2033
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• 2020

Signature-based safeguards (SBS) is being developed to assist tradition nuclear material accountancy methods in tracking material in pyroprocessing facilities. SBS involves identifying off-normal scenarios that would result in improper movement of material in a pyroprocessing facilities and determining associated sensor response signatures. SBS investigations are undertaken in the computational space utilizing an electrochemical transport code known as enhanced REFIN with anodic dissolution (ERAD) to calculate the affect of off-normal conditions in the electrorefiner (ER) on material movement. Work is undertaken to experimentally validate the predictions and assumptions made by ERAD for off-normal occurrences. These experiments were undertaken on a benchtop scale and involved operating an electrochemical cell at 10 separate current densities for constant current operations to deposit U and Gd at a W cathode. These experiments were then modeled using ERAD to compare calculated predictions versus analytical experimental results it was found. It was discovered both the experimental and calculated results reflect a trend of increased codeposition of U and Gd with increasing current density. ERAD was thus demonstrated to be useful for predicting trends from anomalous operation but will require further optimization to be utilized as a quantitative design tool.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.137-143
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• 2011

The internal stress and magnetic properties (coercivity and squareness) of Ni-Fe nano thin film synthesized by electrodeposition method were studied as a function of acidic chloride bath conditions (composition and temperature) and current density. Fe deposition patterns were different depending on the temperature of the solution, the stress of film decreased with increasing the solution temperature, and the depending on the amount of Fe deposition showed a parabolic shape. The grain size of film was inversely proportional to stress of thin film. The internal stress of thin film and magnetic properties were deeply relevant, and the stress of thin film had a relationship with bath conditions and grain size of the thin film surface.

• Journal of the Korean institute of surface engineering
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• v.29 no.3
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• pp.195-202
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• 1996

The composition, the microstructure and the magnetic properties(HC and Hk) of Fe-Co-Ni alloy electrodeposits were investigated according to the electrolysis conditions using sulfate bath paddle agitated. The current efficiency of the alloys electrodeposition was considerably low in the range of 16∼50%. The Fe content(wt.%) of the alloy increased from 20% to 57% with current density, while Ni content of them decreased in the range of 70∼24% respectively, and Co content was nearly constant. As a result, Fe/Ni ratio of the alloy increased from 0.3 to 2.0 showing the anomalous codeposition. The structure of the alloy changed from fcc to the mixed one of fcc+bcc with the increase of Fe/Ni ratio. The preferred orientation of the alloy with fcc and bcc structure were (220) and (110) respectively. The alloy with Fe/Ni ratio(0.3∼l.2) had the lowest coercivity of 0.4∼0.8 Oe.

• Journal of the Korean Electrochemical Society
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• v.8 no.3
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• pp.125-129
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• 2005

We have investigated the electrochemical factors affecting the magnetic properties of hard magnetic CoP nanowires and soft magnetic CoFe nanowires fabricated by ac electrodeposition into self-made AAO(anodic aluminum oxide) nano-templates. AAO template having nano scale pores of high aspect ratio has been prepared through 2-step anodizing of aluminum foil in sulfuric acid. Hard Magnetic properties of CoP nanowires were highly conditional on the applied ac potential which could be a decisive factor to make CoP nanowires made up of either pure hcp crystals or a mixture of hop crystals and fcc crystals. On the contrary to CoFe films, there was no anomalous codeposition in the electrodeposition of soft magnetic CoFe nanowires which exhibited their best saturation magnetization of 238 emu/g at the composition of $Co_{30}Fe_{70}$.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.