Study on Anomalous Codeposition Phenomenon of CoNi Magnetic Films |
Yu, Yundan
(College of Materials Science and Engineering, China Jiliang University)
Wei, Guoying (College of Materials Science and Engineering, China Jiliang University) Ge, Hongliang (College of Materials Science and Engineering, China Jiliang University) Jiang, Li (College of Materials Science and Engineering, China Jiliang University) Sun, Lixia (College of Materials Science and Engineering, China Jiliang University) |
1 | J. Joseph and S. G. Singh, Mater. Lett. 52, 197 (2017). |
2 | R. Godbole and V. P. Godbole, Mat. Sci. Semicon. Proc. 63, 212 (2017). DOI |
3 | A. A. Bagade, V. V. Ganbavle, and S. V. Mohite, J. Colloid. Interf. Sci. 497, 181 (2017). DOI |
4 | M. S. E. Bana and S. S. Fouad, J. Alloys Compd. 705, 333 (2017). DOI |
5 | K. Duschek, M. Uhlemann, H. Schlorb, and K. Nielsch, Electrochem. Commun. 72, 153 (2016). DOI |
6 | E. Aubry and T. Liu, J. Magn. Mang. Mater. 422, 391 (2017). DOI |
7 | W. H. Lu, D. B. Sun, and H. Y. Yu, J. Alloys Compd. 546, 229 (2013). DOI |
8 | P. Zhong, J. Iron. Steel. Res. Int. 14, 292 (2007). DOI |
9 | E. Aubry, T. Liu, A. Billard, A. Dekens, and F. Perry, J. Magn. Magn. Mater. 422, 391 (2017). DOI |
10 | J. V. Arenas, R. H. Lara, and F. S. Sosa, Ref. Mod. Mater. Sci. Mater. Eng. 3, 86 (2017). |
11 | V. Solanki, O. I. Lebedev, and M. M. Seikh, J. Magn. Magn. Mater. 420, 39 (2016). DOI |
12 | D. Nie, C. J. Xu, H. Y. Chen, and Y. J. Wang, Mater. Lett. 131, 306 (2014). DOI |
13 | R. Y. Qin, X. J. Zhang, S. Q. Guo, and B. B. Sun, Surf. Coat. Technol. 360, 816 (2016). |
14 | Q. S. Chen, Z. Y. Zhou, and G. C. Guo, Electrochim. Acta. 113, 694 (2013). DOI |
15 | J. V. Aenas, L. A. Garcia, and M. Pritzker, Electrochim. Acta. 65, 234 (2012). DOI |
16 | Y. Li, Y. Tao, D. Ke, and Y. Ma, Appl. Surf. Sci. 357, 1714 (2015). DOI |
17 | A. Dolati, M. Sababi, E. Nouri, and M. Ghorbani, Mater. Chem. Phys. 102, 118 (2007). DOI |
18 | J. Y. Li, C. Ni, J. Y. Liu, and M. J. Jin, Mater. Chem. Phys. 148, 1202 (2014). DOI |
19 | C. S. Liu, F. H. Su, and J. Z. Liang, Surf. Coat. Technol. 292, 37 (2016). DOI |
20 | E. Gomez and E. Valles, Electroanal. Chem. 421, 157 (1997). DOI |
21 | H. Yan, J. Downes, and P. J. Boden, J. Electrochem. Soc. 143, 1577 (1996). DOI |
22 | L. Tian, J. Xu, and C. Qiang, Appl. Surf. Sci. 257, 4689 (2011). DOI |
23 | C. K. Chung and W. T. Chang, Thin Solid Films 517, 4800 (2009). DOI |
24 | K. M. Yin, J. H. Wei, J. R. Fu, B. N. Popov, and S. N. Popova, J. Appl. Electrochem. 25, 543 (1995). DOI |
25 | J. Vaes, J. Fransaer, and J. P. Celis, J. Electrochem. Soc. 147, 3718 (2000). DOI |
26 | M. Srivastava, V. E. Selvi, and K. S. Rajam, Surf. Coat. Technol. 201, 3051 (2006). DOI |
27 | L. P. Wang, Y. Gao, Q. J. Xue, and T. Xu, Appl. Surf. Sci. 242, 326 (2005). DOI |
28 | J. W. Sun, S. L. Wang, Z. W. Yan, and Y. H. Wen, Mater. Sci. Eng. 639, 456 (2015). DOI |