• 제목/요약/키워드: annealing ambient

검색결과 319건 처리시간 0.031초

RF 마그네트론 스퍼터를 이용한 ATO 박막의 열처리 효과 (The effects of annealing of the ATO films prepared by RF magnetron sputtering)

  • 박세용;이성욱;박미주;김영렬;홍병유
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.270-271
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    • 2008
  • Antimony (6 wt%) doped tin oxide (ATO) films to improve conductivity were deposited on 7059 coming glass by RF magnetron sputtering method for application to transparent electrodes. The ATO film was deposited at a working pressure of 5 mTorr and RF power of 175 W. We investigated the effects of the post-annealing temperature on structural, electrical and optical properties of the ATO films. The films were annealed at temperatures ranging from $300^{\circ}C$ to $600^{\circ}C$ in step of $100^{\circ}C$ using RTA equipment in vacuum ambient. X-ray diffraction (XRD) measurements showed the ATO films to be crystallized with a strong (101) preferred orientation as the annealing temperature increased. Electrical resistivity decreased significantly with annealing temperatures up to $600^{\circ}C$. ATO film annealed at temperature of $600^{\circ}C$ showed the lowest resistivity of $5.6\times10^{-3}\Omega$-cm. Optical transmittance increased significantly with annealing temperatures up to $600^{\circ}C$. The highest transmittance was 90.8 % in the visible range from 400 to 800 nm.

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Microstructure and Mechanical Properties of AA6061/AA5052/AA1050 Alloy Fabricated by Cold Roll-Bonding and Subsequently Annealed

  • Seong-Hee Lee;Sang-Hyeon Jo;Jae-Yeol Jeon
    • 한국재료학회지
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    • 제33권11호
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    • pp.439-446
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    • 2023
  • Changes in the microstructure and mechanical properties of as-roll-bonded AA6061/AA5052/AA1050 three-layered sheet with increasing annealing temperature were investigated in detail. The commercial AA6061, AA5052 and AA1050 sheets with 2 mm thickness were roll-bonded by multi-pass rolling at ambient temperature. The roll-bonded Al sheets were then annealed for 1 h at various temperatures from 200 to 400 ℃. The specimens annealed up to 250 ℃ showed a typical deformation structure where the grains are elongated in the rolling direction in all regions. However, after annealing at 300 ℃, while AA6061 and AA1050 regions still retained the deformation structure, but AA5052 region changed into complete recrystallization. For all the annealed materials, the fraction of high angle grain boundaries was lower than that of low angle grain boundaries. In addition, while the rolling texture of the {110}<112> and {123}<634> components strongly developed in the AA6061 and AA1050 regions, in the AA5052 region the recrystallization texture of the {100}<001> component developed. After annealing at 350 ℃ the recrystallization texture developed in all regions. The as-rolled material exhibited a relatively high tensile strength of 282 MPa and elongation of 18 %. However, the tensile strength decreased and the elongation increased gradually with the increase in annealing temperature. The changes in mechanical properties with increasing annealing temperature were compared with those of other three-layered Al sheets fabricated in previous studies.

Effect of Silica Content on the Dielectric Properties of Epoxy/Crystalline Silica Composites

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • 제13권6호
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    • pp.322-325
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    • 2012
  • Crystalline silica was synthesized by annealing amorphous silica at $1,300^{\circ}C$ or $1,400^{\circ}C$ for various times, and the crystallinity was estimated by X-ray diffraction (XRD) analysis. In order to prepare a low dielectric material, epoxy/crystalline silica composites were prepared, and the effect of silica content on the dielectric properties was studied under various functions of frequency and ambient temperature. The dielectric constant decreased with increasing crystalline silica content in the epoxy composites, and it also decreased with increasing frequency. At 120 Hz, the value of 5 wt% silica decreased by 0.25 compared to that of 40 wt% silica, and at 23 kHz, the value of 5 wt% silica decreased by 0.23 compared to that of 40 wt% silica. The value increased with increasing ambient temperature.

Comparative study on structural and luminescence properties of solution processed ZnO thin films

  • Park, Byung-Yoon;Choi, Sung-Ho;Hong, Chang-Seop;Ryu, Beyong-Hwan;Jung, Ha-Kyun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1433-1436
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    • 2009
  • Film morphology, crystallinity, and luminescence property of solution processed ZnO films have been studied. Fluorine addition and annealing ambient significantly change the defect-related emission band as well as the structural property. Using the overall emission behaviors, we can predict an optimized process condition for solution-based ZnO thin film.

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The Analysis of N Component in Thin Oxide Film Thermally Grown by $NH_3$ Oxidation

  • Kim, Young-Cho-;Kim, Chul-Ju-
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 1994년도 춘계 학술발표 강연 및 논문 개요집
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    • pp.165-166
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    • 1994
  • The depth profiles of the as-grown and the annealed NH$_3$ oxide film in NH$_3$(7.5%)/$N_2$ ambient at 45$0^{\circ}C$ are analized . This annealing in the ambient of mixed gases removes the small quantities of N component from the NH$_3$ oxide film. In AES analysis, the NH$_3$ oxidation shows the exact stoichiometry of SiO$_2$ and a sharp slop at SiO$_2$/Si interface.

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N$H_3$가 Si산화의 열유기 결함에 미치는 영향 (Effects of N$H_3$ on the Induced Defect in Si Oxidation)

  • 김영조;김철주
    • 한국재료학회지
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    • 제3권4호
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    • pp.403-409
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    • 1993
  • 본 논문에서는 Si(111)에 대한 건식산화와 어닐링에서 결함의 억제 또는 제거에 $NH_3$가 효과적임을 밝혔다. 산화방식은 건식산화(dry $O_2$ oxidation)및 $NH_3$산화($NH_3$ added in dry $O_2$oxidation)를 택하였고 $N_2$$NH_3N_2$분위기에서 어닐링 효과를 평가하였다. 건식산화에서는 발생되는 결함이 성장시간에 따라서 길이가 길어지며, $NH_3$산화에서는 결함이 발견되지 않았다. 또한 초기산화를 $NH_3$산화로 하고서 건식산화를 하였을 때 계면에서의 결함을 제거하는 효과가 있다. 건식산화 또는 $NH_3$산화를 한 후 이들 시료에 대하여 7.5% $NH_3N_2$분위로 어닐링하면OSF의 게터링(gettering)효과가 있었다. $NH_3$산화방식에서 7.5%$NH_3N_3$분위기로 어닐링했을때가 건식산화방식에 비하여 OSF의 길이가 20%정도 감소하였다. OSF의 모양은 pit형으로 (111)면에 대하여 (011)면 쪽으로 게터링이 일어났으며<110>방향으로 식각되는 성질이 있었다.

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텅스텐 폴리사이드 전극에 따른 게이트 산화막의 내압 특성 (Breakdown characteristics of gate oxide with tungsten polycide electrode)

  • 정회환;이종현;정관수
    • 전자공학회논문지A
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    • 제33A권12호
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    • pp.77-82
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    • 1996
  • The breakdown characteristics of metal-oxide-semiconductor(MOS) capacitors fabricated by Al, polysilicon, and tungsten polycide gate electrodes onto gate oxide was evaluated by time zero dielectric breakdwon (TZDB). The average breakdown field of the gate oxide with tungsten polycide electride was lower than that of the polysilicon electrode. The B model (1~8MV/cm) failure of the gate oxide with tungsten polycide electrode was increased with increasing annealing temperature in the dry $O_{2}$ ambient. This is attributed ot fluorine and tungsten diffusion from thungsten silicide film into the gate oxide, and stress increase of tungsten polcide after annealing treatment.

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Point-defect study from low-temperature photoluminescence of ZnSe layers through the post-annealing in various ambient

  • Lee, Sang-Youl;Hong, Kwang-Joon;Kim, Hae-Jeong
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.378-378
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    • 2010
  • The ZnSe epilayers were grown on the GaAs substrate by hot wall epitaxy. After the ZnSe epilayers treated in the vacuum-, Zn-, and Se-atmosphere, respectively, the defects of the epilayer were investigated by means of the low, temperature photoluminescence measurement. The dominant peaks at 2.7988 eV and 2.7937 eV obtained from the PL spectrum of the as-grown ZnSe epilayer were found to be consistent with the upper and the lower polariton peak of the exciton, $I_2$ ($D^{\circ}$, X), bounded to the neutral donor associated with the Se-vacancy. This donor-impurity binding energy was calculated to be 25.3 meV. The exciton peak, $I_l^d$, at 2.7812 eV was confirmed to be bound to the neutral acceptor corresponded with the Zn-vacancy.

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Co 및 Co/Ti 이중막에 의해 형성된 Co-실리사이드의 열적 불안정성 (Thermal instability of Co-silicides formed by Co and Co/Ti bilayer)

  • 장지근;엄우용;신철상;장호정
    • 전자공학회논문지A
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    • 제33A권11호
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    • pp.105-111
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    • 1996
  • We have invetigated the characteristics of thermal instability of Co-silicides annealed at 850$^{\circ}$C ~ 1000$^{\circ}$C for 10~90 minutes in a furance with N$_{2}$ ambient. In our experiments, Co-silicides and Co/Ti bilayer silicides were formed by depositing (Co, Ti) films on the clean Si substrates in an E-beam evaporator and performing the RTA annelaing. The sheet resistances of Co-silicides formed form Co exhibited the nearly constant value under the post-annealing time above 900$^{\circ}$C showing the increase of 30% and 60% under the conditions annealed at 900$^{\circ}$C and 1000$^{\circ}$C for 30minutes. On the other hand, there were no remarkable changes in the sheet resistance sof Co-silicides formed form Co/Ti bilayer under the post-annealing conditons below 1000$^{\circ}$C.

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PREFERRED ORIENTATION AND MICROSTRUCTURE OF MOD DERIVED SrBi$_{2x}$Ta$_2$O$_9$ THIN FILMS WITH Bi CONTENT x

  • Yeon, Dae-Joong;Park, Joo-Dong;Oh, Tae-Sung
    • 한국표면공학회지
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    • 제29권6호
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    • pp.621-627
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    • 1996
  • $SrBi_{2x}TaO_9$ ferroelectric thin films were prepared on platinized silicon substrates using MOD proces, and crystallization behavior of the films was investigated with variation of the annealing temperature and Bi content x. Crystalline phase of bismuth layered perovskite structure was formed even by baking the films at $800^{\circ}C$ for 5 minutes in air, and was not changed by annealing at temperatures raning from $700^{\circ}C$ to $900^{\circ}C$ for 1 hour in oxygen ambient. When $SrBi_{2x}TaO_9$ thin films ($0.8\lex\ie1.6$) were annealed at $800^{\circ}C$, Preferred orientation of the films along c-axis was observed with $x\ge1.2$. With increasing Bi content x, surface morphology of the films was changed from equiaxed grains to elongated grains.

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