• 한국전기전자재료학회논문지
• /
• 제19권4호
• /
• pp.334-338
• /
• 2006

Poly silicon TFT requires high quality dielectric film; conventional method of growing silicon dioxide needs highly hazardous chemicals such as silane. We have grown high quality dielectric film of silicon dioxide using non-hazardous chemical such as TFOS and ozone as reaction gases by APCVD. The films grown were characterized through C-V curves of MOS structures. Conventional APCVD requires high temperature processing where as in the process of current study, we developed a low temperature process. Interface trap density was substantially decreased in the silicon surface coated with the silicon dioxide film after annealing in nitrogen ambient. The interface with such low trap density could be used for poly silicon TFT fabrication with cheaper cost and potentially less hazards.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.331-331
• /
• 2008

Transparent conductive oxide (TCO) are necessary as front electrode or anti-reflecting coating for increasing efficiency of LED and Photodiode. In this paper, aluminum-doped Zinc oxide films(AZO) were prepared by RF magnetron sputtering on Si substrate at room temperature with application of substrate bias from -60 to 60 V. Then annealed at temperature of 200, 300 and $400^{\circ}C$ for 1hr in $H_2$ ambient. Structural and electrical property of AZO thin films were investigated.

• 한국표면공학회지
• /
• 제38권1호
• /
• pp.28-36
• /
• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.

• 한국전기전자재료학회논문지
• /
• 제11권12호
• /
• pp.1091-1098
• /
• 1998

Thermal stability of the electroless deposited Cu thin film was investigated. Cu/TaN/Si multilayer was fabricated by electroless-depositing Cu thin layer on TaN diffusion barrier layer which was deposited by MOCVD on the Si substrate, and was annealed in $H_2$ ambient to investigate the microstructure of Cu film with a post heat-treatment. Cu thin film with good adhesion was successfully deposited on the surface of the TaN film by electroless deposition with a proper activation treatment and solution control. Microstructural property of the electroless-deposited Cu layer was improved by a post-annealing in the reduced atmosphere of $H_2$ gas up to $600^{\circ}C$. Thermal stability of Cu/TaN/Si system was maintained up to $600^{\circ}C$ annealing temperature, but the intermediate compounds of Cu-Si were formed above $650^{\circ}C$ because Cu element passed through the TaN layer. On the other hand, thermal stability of the Cu/TaN/Si system in Ar ambient was maintained below $550^{\circ}C$ annealing temperature due to the minimal impurity of $O_2$ in Ar gas.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1996년도 재료학회 춘계학술발표회
• /
• pp.23-23
• /
• 1996

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
• /
• pp.131.2-131
• /
• 1998

• 전자공학회논문지A
• /
• 제30A권7호
• /
• pp.47-59
• /
• 1993

16M DRAM 용 Al/Si contact 의 열적안정성을 개선하기 위하여 "stuffed" TiN/Ti diffusion barrier를 사용하였다. Diffusion barrier 로서의 특성을 개선하기 위한 Al 증착전 TiN/Ti barrier metal의 열처리 과정중 barrier metal의 두께, 열처리온도, 분위기 등을 변화시켰다. 질소분위기하에서 450도에서 TiN(900A)/Ti(300A) 박막을 열처리 하여 "stuffed" barrier metal을 형성 시켰을 경우 Al 원자의 TiN층으로의 확산의 600도에서 후속열처리한 경우 일어났으나, 700도까지도 Al-spike를 관찰할 수 없었다. 그러나 "stuffed" barrier metal을 550도에서 형성한 경우에는 600도의 후속열처리온도에서 Al이 Si 기판으로 침투했음을 관찰하였다. 박막의 두께를 얇게한 경우, 600도의 후속 열처리에서 Al-spike가 형성되었음을 확인하였다.

• Current Photovoltaic Research
• /
• 제1권2호
• /
• pp.82-89
• /
• 2013

$Cu_2ZnSnS_4$ thin film have been fabricated by rapid thermal annealing of dc-sputtered metal precursor with Cu/ZnSn/Cu stack in sulfur ambient. A CZTS film with a good uniformity was formed at $560^{\circ}C$ in 6 min. $Cu_2SnS_3$ and $Cu_3SnS_4$ secondary phases were present at $540^{\circ}C$ and a trace amount of $Cu_2SnS_3$ secondary phase was present at $560^{\circ}C$. Single-phase large-grained CZTS film with rough surface was formed at $560^{\circ}C$. Solar cell with best efficiency of 4.7% ($V_{oc}=632mV$, $j_{sc}=15.8mA/cm^2$, FF = 47.13%) for an area of $0.44cm^2$ was obtained for the CZTS absorber grown at $560^{\circ}C$ for 6 min. The existence of second phase at lower-temperature annealing and rough surface at higher-temperature annealing caused the degradation of cell performance. Also poor back contact by void formation deteriorated cell performance. The fill factor was below 0.5; it should be increased by minimizing voids at the CZTS/Mo interface. Our results suggest that CZTS absorbers can be grown by rapid thermal annealing of metallic precursors in sulfur ambient for short process times ranging in minutes.

• 한국재료학회지
• /
• 제31권6호
• /
• pp.320-324
• /
• 2021

Effects of growth variables and post-growth annealing on the optical, structural and electrical properties of magnetron-sputtered Ga_0.04Mg_0.10Zn_0.86O films are characterized in detail. It is observed that films grown from pure oxygen plasma showed high resistivity, ~10² Ω·cm, whereas films grown in Ar plasma showed much lower resistivity, 2.0 × 10^-2 ~ 1.0 × 10^-1 Ω·cm. Post-growth annealing significantly improved the electrical resistivity, to 4.3 ~ 9.0 × 10^-3 Ω·cm for the vacuum annealed samples and to 1.3 ~ 3.0 × 10^-3 Ω·cm for the films annealed in Zn vapor. It is proposed that these phenomena may be attributed to the improved crystalline quality and to changes in the defect chemistry. It is suggested that growth within oxygen environments leads to suppression of oxygen vacancy (Vo) donors and formation of Zn vacancy (V_Zn) acceptors, resulting in highly resistive films. After annealing treatment, the activation of Ga donors is enhanced, Vo donors are annihilated, and crystalline quality is improved, increasing the electron mobility and the concentration. After annealing in Zn vapor, Zn interstitial donors are introduced, further increasing the electron concentration.

• 전기학회논문지P
• /
• 제64권3호
• /
• pp.182-186
• /
• 2015

We investigated that effects of annealing ambient on the characteristics of functional nano thin film synthesized on glass substrate. The functional nano thin films were annealed by using rapid thermal annealing (RTA) equipment in vacuum, oxygen and nitrogen ambient, respectively. The hardness of the functional nano thin films were measured by a standard hardness testing method (ASTM D3363) such as a H-9H, F, HB and B-6B pencil (Mitsubishi, Japan). Also, the adhesion of the functional nano thin films were measured by a standard adhesion testing method (ASTM D3359) using scotch tape (3M, Korea). The contact angle of the functional nano thin films was measured by a contact angle analyzer (Phoenix 300 Touch, S.E.O.). The optical property of functional nano thin films was measured via UV-visible spectroscopy (S-3100, Scinco).