• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.84-84
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• 2010

We present an in-situ study of the interaction of a bimetallic Rh50Pd50 bulk crystal with O2, CO, and NO using ambient pressure x-ray photoelectron spectroscopy and compare it to results for 10 nm nanoparticles with the same overall composition. The surface of the bulk crystal has less Rh present under both oxidizing and reducing conditions than the nanoparticles under identical conditions. Segregation and oxidation/reduction proceeds quicker and at lower temperature for nanoparticles than for the bulk crystal. The near surface of the Rh50Pd50 bulk crystal after high temperature vacuum annealing is ca. 9% Rh measured by XPS. Heating in 0.1 Torr O2 to $350^{\circ}C$ increases the Rh surface composition to ca. 40%. The surface can then be reduced by heating in H2 at $150^{\circ}C$, leading to a reduced surface of 30% Rh. Titration of CO from this Rh-rich surface proceeds at a much lower pressure than on the Rh-deficient starting surface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.558-561
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• 2001

Vanadium oxide ($VO_x$) thin films are very good candidate material for uncooled infrared (IR) detectors due to their high temperature coefficient of resistance (TCR) at room temperature. But, the deposition of $VO_x$ thin films showing good electrical properties is very difficult in micro bolometer fabrication process using sacrificial layer removal because of its low process temperature and thickness of thin films less than $1000{\AA}$. This paper presents a new fabrication process of $VO_x$ thin films having high TCR and low resistance. Through sandwich structure of $VO_{x}(100{\AA})/V(80{\AA})/VO_{x}(500{\AA})$ by sputter method and post-annealing at oxygen ambient, we have achieved high TCR more than $-2%/^{\circ}C$ and low resistance less than $10K\Omega$ at room temperature.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.160-160
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• 2011

In the present work, $TiO_2$ fiilms supported by porous silica gel with high surface area synthesized by atomic layer deposition(ALD). Porous structure of silica substrate could be maintained even after deposit large amount of $TiO_2$ (500 cycles of ALD process), suggesting the differential growth mode of $TiO_2$ on top surface and inside the pore. All the $TiO_2$-covered silica samples showed improved MB adsorption abilities, comparing to bare one. In addition, when silica surface was covered with $TiO_2$ films, MB adsorption capacity was almost fully recovered by re-annealing process (500$^{\circ}C$, for 1 hr, in ambient pressure), whereas MB adsorption capacity of bare silica was decreased after re-heaing process. FT-IR study demonstrated that $TiO_2$ film could prevent deposition of surface-bound intermediate species during thermal decomposition of adsorbed MB molecules. Photocatalytic activity of $TiO_2$/silica sample was also investigated.

• 센서학회지
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• 제13권3호
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• pp.195-198
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• 2004

For a diffusion barrier against copper, tantalum nitride films have been deposited on $SiO_{2}$ by atomic layer deposition (ALD), using PEMAT(Pentakis(ethylmethylamino)tantalum) and $NH_{3}$ as precursors, Ar as purging gas. The deposition rate of TaN at substrate temperature $250^{\circ}C$ was about $0.67{\AA}$ per one cycle. The stability of TaN films as a Cu diffsion barrier was tested by thermal annealing for 30 minutes in $N_{2}$ ambient and characterized through XRD, sheet resistance, and C-V measurement(Cu($1000{\AA}$)/TaN($50{\AA}$)/$SiO_{2}$($2000{\AA}$)/Si capacitor fabricated), which prove the TaN film maintains the barrier properties Cu below $400^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.27-30
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• 2002

Boron Phosphide films were deposited on the glass substrate at the low temperature, $550^{\circ}C$, $480^{\circ}C$, by the reaction of $B_{2}H_{6}$, with $PH_{3}$ using CVD. The reactant gas rates were 50 cc/min and 20 cc/min for $B_{2}H_{6}$, 50 cc/min and 40 cc/min for $PH_{3}$ and $1.5\ell$/min for $N_{2}$ carrier gas. The films were annealed for 1hour, 3hours in $N_{2}$ ambient at $550^{\circ}C$ and $400^{\circ}C$. The deposition rate was $1000{\AA}$/min and the refractive index of film was 2.6. From results of XRD measurement the films have the preferred orientation of (1 0 1). For as deposited the film, the data of VIS spectrophotometer show 75.49%, 76.71% for 1hr-annealed and 86.4% for 3hrs-annealed. From AFM datas the surface condition of obtained films are was shown $73{\AA}$, $88.9{\AA}$ and $220{\AA}$ for as-deposited, for 1hr-annealed and for 3hr annealed, respectively.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.61-64
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• 2011

In order to grow the crystalline solar cells industry continuously, development of alternate low-cost manufacturing processes is required. Plasma doping system is the technique for introducing dopants into semiconductor wafers in CMOS devices. In photovoltaics, plasma doping system could be an interesting alternative to thermal furnace diffusion processes. In this paper, plasma doping system was applied for phosphorus doping in crystalline solar cells. The Plasma doping was carried out in 1~4 KV bias voltages for four minutes. For removing surface damage and formation of pn junction, annealing steps were carried out in the range of $800{\sim}900^{\circ}C$ with $O_2$ ambient using thermal furnace. The junction depth in about $0.35{\sim}0.6{\mu}m$ range have been achieved and the doping profiles were very similar to emitter by thermal diffusion. So, It could be confirmed that plasma doping technique can be used for emitter formation in crystalline solar cells.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.451-451
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• 2011

적외선 소자의 재료로 쓰이는 액상 에피 성장법(Liquid phase epitaxy: LPE)으로 성장된 HgCdTe (MCT)박막의 Hg 분위기 열처리에 따른 구조적 변화를 고 분해능 투과 전자 현미경으로 관찰하였다. 일반적으로 LPE방법으로 성장된 MCT박막은 성장 방법의 특성상 Te 과다 영역의 성장용액이 사용되므로 상온 냉각 과정에서 박막 내 국부적인 Te 석출물을 형성 시킬 가능성이 높다. 또한, 성장 과정시 높은 Hg 증기압으로 인해 Hg-vacancy가 존재하므로 품질을 저하시키는 요인이 된다. 따라서, 본 실험에서는 Hg-vacancy와 국부적인 Te 석출물의 제거를 위해 Hg 분위기 열처리 공정을 실시하여 박막의 결정성 변화 및 국부적인 조성 변화를 관찰하였다. 실험결과, 열처리에 따른 Hg의 박막 내 공급으로 인한 이차상의 형성 등이 관찰 되었으며 부피 팽창으로 인해 격자의 변형이 관찰 되었다. 이는 투과 전자 현미경의 고 분해능 이미지 와 Gaussian mask filtering 기법으로 보여진 격자 줄무늬상 (lattice fringe)으로 확인 하였다. 또한, 열처리에 따른 국부적인 조성 편기의 해소는 high angle annular dark field scanning TEM(HAADF-STEM)을 이용하여 관찰 하였다.

• 한국재료학회지
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• 제24권3호
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• pp.140-144
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• 2014

The contact mechanism of devices is usually researched at electrode contacts. However, the contact between a dielectric and channel at the MOS structure is more important. The graphene was used as a channel material, and the thin film transistor with MOS structure was prepared to observe the contact mechanism. The graphene was obtained on Cu foil by the thermal decomposition method with $H_2$ and $CH_4$ mixed gases at an ambient annealing temperature of $1000^{\circ}C$ during the deposition for 30 min, and was then transferred onto a $SiO_2/Si$ substrate. The graphene was doped in a nitrogen acidic solution. The chemical properties of graphene were investigated to research the effect of nitric atoms doping. The sheet resistance of graphene decreased after nitrogen acidic doping, and the sheet resistance decreased with an increase in the doping times because of the increment of negative charge carriers. The nitric-atom-doped graphene showed the Ohmic contact at the curve of the drain current and drain voltage, in spite of the Schottky contact of grapnene without doping.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 ICEIC The International Conference on Electronics Informations and Communications
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• pp.343-347
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• 2004

High oxidation temperature of SiC shows a tendency of carbide formation at the interface which results in poor MOSFET transfer characteristics. Thus we developed oxidation processes in order to get low interface charge densities. N-type 6H-SiC MOS capacitors were fabricated by different oxidation processes: dry, wet, and dry­reoxidation. Gate oxidation and Ar anneal temperature was $1150^{\circ}C.$ Ar annealing was performed after gate oxidation for 30 minutes. Dry-reoxidation condition was $950^{\circ}C,$ H2O ambient for 2 hours. Gate oxide thickness of dry, wet and dry-reoxidation samples were 38.0 nm, 38.7 nm, 38.5 nm, respectively. Mo was adopted for gate electrode. To investigate quality of these gate oxide films, high frequency C- V measurement, gate oxide leakage current, and interface trapped charge densities (Dit) were measured. The interface trapped charge densities (Dit) measured by conductance method was about $4\times10^{10}[cm^{-1}eV^{-1}]$ for dry and wet oxidation, the lowest ever reported, and $1\times10^{11}[cm^{-1}eV^{-1}]$ for dry-reoxidation

• 전기학회논문지
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• 제59권7호
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• pp.1255-1258
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• 2010

In this paper, the $CoSi_2$ thin films with thicknesses of about $5{\mu}m$ were deposited on n-type silicon (111) substrates by RF magnetron sputtering method using a $CoSi_2$ target (99.99%). The flow rate of argon of 50 sccm, substrate temperature of $100^{\circ}C$, RF power of 60 watts, deposition time of 30 minutes, and the vacuum of $1\times10^{-6}$ Torr. The annealing treatments of the $CoSi_2$ thin film were performed from 500, 700 and $900^{\circ}C$ for 1h in air ambient by an electric furnace. In order to investigate the $CoSi_2$ thin film X-ray diffraction patterns were measured using the X-ray diffractometer (XRD). The structure of the thin films were investigated by using scanning the electron microscope (SEM) were used for review. The surface morphology of the thin films was measured with a atomic force microscopy (AFM). Temperature dependence of sheet resistivity and property of Hall effect was measured in the $CoSi_2$ thin film.