Characteristics of TaN by Atomic Layer Deposition as a Copper Diffusion Barrier |
Na, Kyoung-Il
(Dept. of Electronics Eng., Kyungpook Univ.)
Hur, Won-Nyung (Dept. of Electronics Eng., Kyungpook Univ.) Boo, Sung-Eun (Comtecs Corp.) Lee, Jung-Hee (Dept. of Electronics Eng., Kyungpook Univ.) |
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