• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.270-271
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• 2008

Antimony (6 wt%) doped tin oxide (ATO) films to improve conductivity were deposited on 7059 coming glass by RF magnetron sputtering method for application to transparent electrodes. The ATO film was deposited at a working pressure of 5 mTorr and RF power of 175 W. We investigated the effects of the post-annealing temperature on structural, electrical and optical properties of the ATO films. The films were annealed at temperatures ranging from $300^{\circ}C$ to $600^{\circ}C$ in step of $100^{\circ}C$ using RTA equipment in vacuum ambient. X-ray diffraction (XRD) measurements showed the ATO films to be crystallized with a strong (101) preferred orientation as the annealing temperature increased. Electrical resistivity decreased significantly with annealing temperatures up to $600^{\circ}C$. ATO film annealed at temperature of $600^{\circ}C$ showed the lowest resistivity of $5.6\times10^{-3}\Omega$-cm. Optical transmittance increased significantly with annealing temperatures up to $600^{\circ}C$. The highest transmittance was 90.8 % in the visible range from 400 to 800 nm.

• Korean Journal of Materials Research
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• v.33 no.11
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• pp.439-446
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• 2023

Changes in the microstructure and mechanical properties of as-roll-bonded AA6061/AA5052/AA1050 three-layered sheet with increasing annealing temperature were investigated in detail. The commercial AA6061, AA5052 and AA1050 sheets with 2 mm thickness were roll-bonded by multi-pass rolling at ambient temperature. The roll-bonded Al sheets were then annealed for 1 h at various temperatures from 200 to 400 ℃. The specimens annealed up to 250 ℃ showed a typical deformation structure where the grains are elongated in the rolling direction in all regions. However, after annealing at 300 ℃, while AA6061 and AA1050 regions still retained the deformation structure, but AA5052 region changed into complete recrystallization. For all the annealed materials, the fraction of high angle grain boundaries was lower than that of low angle grain boundaries. In addition, while the rolling texture of the {110}<112> and {123}<634> components strongly developed in the AA6061 and AA1050 regions, in the AA5052 region the recrystallization texture of the {100}<001> component developed. After annealing at 350 ℃ the recrystallization texture developed in all regions. The as-rolled material exhibited a relatively high tensile strength of 282 MPa and elongation of 18 %. However, the tensile strength decreased and the elongation increased gradually with the increase in annealing temperature. The changes in mechanical properties with increasing annealing temperature were compared with those of other three-layered Al sheets fabricated in previous studies.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.322-325
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• 2012

Crystalline silica was synthesized by annealing amorphous silica at $1,300^{\circ}C$ or $1,400^{\circ}C$ for various times, and the crystallinity was estimated by X-ray diffraction (XRD) analysis. In order to prepare a low dielectric material, epoxy/crystalline silica composites were prepared, and the effect of silica content on the dielectric properties was studied under various functions of frequency and ambient temperature. The dielectric constant decreased with increasing crystalline silica content in the epoxy composites, and it also decreased with increasing frequency. At 120 Hz, the value of 5 wt% silica decreased by 0.25 compared to that of 40 wt% silica, and at 23 kHz, the value of 5 wt% silica decreased by 0.23 compared to that of 40 wt% silica. The value increased with increasing ambient temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1433-1436
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• 2009

Film morphology, crystallinity, and luminescence property of solution processed ZnO films have been studied. Fluorine addition and annealing ambient significantly change the defect-related emission band as well as the structural property. Using the overall emission behaviors, we can predict an optimized process condition for solution-based ZnO thin film.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.05a
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• pp.165-166
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• 1994

The depth profiles of the as-grown and the annealed NH$_3$ oxide film in NH$_3$(7.5%)/$N_2$ ambient at 45$0^{\circ}C$ are analized . This annealing in the ambient of mixed gases removes the small quantities of N component from the NH$_3$ oxide film. In AES analysis, the NH$_3$ oxidation shows the exact stoichiometry of SiO$_2$ and a sharp slop at SiO$_2$/Si interface.

• Korean Journal of Materials Research
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• v.3 no.4
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• pp.403-409
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• 1993

In this paper, an $NH_3$, added during dry oxidation and annealing m Si( 111) is clarified effect ive to suppress or remove defects. Annealing effects in $N_2$ and $NH_3/N_2$ ambient are estimated with dry $O_2$ and $NH_4$ oxidation($NH_3$ added in dry $O_2$ oxidation) method. C;em'rated defects in dry $O_2$ oxidation are lengthened according to oxidation time. but any defects in $NH_3$ oxidation are not found. Dry oxidation, after $NH_3$ oxidation as an initial oxidation. lias the defect -removing effect at the interface of Si -$SiO_2$. After dry or $NH_3$. oxidation. the annealmg 7.5% $NH_3/N_2$ ambient brings out gettering effect of OSF. The annealing in 7.5% $NH_3/N_2$ ambient for NI L oxidation method decreaSE,s $NH_3$ length of OSF about 20 % compared with dry oxidation method. Tlw feature of OSF is pit type, the gettering is directed to (011) plane for (111) plane. and OSFs are etched following to 110) directIon.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.77-82
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• 1996

The breakdown characteristics of metal-oxide-semiconductor(MOS) capacitors fabricated by Al, polysilicon, and tungsten polycide gate electrodes onto gate oxide was evaluated by time zero dielectric breakdwon (TZDB). The average breakdown field of the gate oxide with tungsten polycide electride was lower than that of the polysilicon electrode. The B model (1~8MV/cm) failure of the gate oxide with tungsten polycide electrode was increased with increasing annealing temperature in the dry $O_{2}$ ambient. This is attributed ot fluorine and tungsten diffusion from thungsten silicide film into the gate oxide, and stress increase of tungsten polcide after annealing treatment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.378-378
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• 2010

The ZnSe epilayers were grown on the GaAs substrate by hot wall epitaxy. After the ZnSe epilayers treated in the vacuum-, Zn-, and Se-atmosphere, respectively, the defects of the epilayer were investigated by means of the low, temperature photoluminescence measurement. The dominant peaks at 2.7988 eV and 2.7937 eV obtained from the PL spectrum of the as-grown ZnSe epilayer were found to be consistent with the upper and the lower polariton peak of the exciton, $I_2$ ($D^{\circ}$, X), bounded to the neutral donor associated with the Se-vacancy. This donor-impurity binding energy was calculated to be 25.3 meV. The exciton peak, $I_l^d$, at 2.7812 eV was confirmed to be bound to the neutral acceptor corresponded with the Zn-vacancy.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.11
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• pp.105-111
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• 1996

We have invetigated the characteristics of thermal instability of Co-silicides annealed at 850$^{\circ}$C ~ 1000$^{\circ}$C for 10~90 minutes in a furance with N$_{2}$ ambient. In our experiments, Co-silicides and Co/Ti bilayer silicides were formed by depositing (Co, Ti) films on the clean Si substrates in an E-beam evaporator and performing the RTA annelaing. The sheet resistances of Co-silicides formed form Co exhibited the nearly constant value under the post-annealing time above 900$^{\circ}$C showing the increase of 30% and 60% under the conditions annealed at 900$^{\circ}$C and 1000$^{\circ}$C for 30minutes. On the other hand, there were no remarkable changes in the sheet resistance sof Co-silicides formed form Co/Ti bilayer under the post-annealing conditons below 1000$^{\circ}$C.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.621-627
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• 1996

$SrBi_{2x}TaO_9$ ferroelectric thin films were prepared on platinized silicon substrates using MOD proces, and crystallization behavior of the films was investigated with variation of the annealing temperature and Bi content x. Crystalline phase of bismuth layered perovskite structure was formed even by baking the films at $800^{\circ}C$ for 5 minutes in air, and was not changed by annealing at temperatures raning from $700^{\circ}C$ to $900^{\circ}C$ for 1 hour in oxygen ambient. When $SrBi_{2x}TaO_9$ thin films ($0.8\lex\ie1.6$) were annealed at $800^{\circ}C$, Preferred orientation of the films along c-axis was observed with $x\ge1.2$. With increasing Bi content x, surface morphology of the films was changed from equiaxed grains to elongated grains.