• 멤브레인
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• 제26권5호
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• pp.372-380
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• 2016

본 연구에서는 입자크기가 다른 3가지 ${\alpha}$-알루미나 분체로부터 주입성형법과 소결법을 혼용하여 튜브형 ${\alpha}$-알루미나 지지체를 제조하여 초기 ${\alpha}$-알루미나 분체의 입자크기와 소결 온도가 지지체의 기공구조와 기체투과 특성에 미치는 영향을 고찰하였다. 평균입경이 0.2, 0.5, $1.7{\mu}m$인 ${\alpha}$-알루미나 분체를 사용했을 시 제조된 ${\alpha}$-알루미나 지지체는 각각 약 80, 130, 200 nm의 평균 기공경을 가졌으며 평균 기공경은 소결 온도 보다는 초기 알루미나 분체의 입자크기에 의존하였다. 모든 시편에서 소결 온도가 증가할수록 지지체의 부피 밀도는 증가하였고 겉보기 기공률은 감소하였다. He, $N_2$, $O_2$, $CO_2$에 대하여 $30^{\circ}C$에서 단일기체 투과 특성을 평가한 결과, 기체 투과도는 기공경 제곱에 비례하여 증가하였고 기공률이 증가함에 따라서 직선적으로 증가하였다. 이를 토대로 제조된 ${\alpha}$-알루미나 지지체의 기체 투과는 점성유동(viscous flow)에 의하여 이루어지며, ${\alpha}$-알루미나 지지체의 기체 투과 특성은 초기 ${\alpha}$-알루미나 분체의 입자크기와 소결온도를 제어함으로써 조절될 수 있음을 확인할 수 있었다.

• 한국세라믹학회지
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• 제32권5호
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• pp.594-600
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• 1995

Spherical alumina gel powders were produced by hydrolysis of aluminum sec-butoxide (Al(sec-OC4H9)3) in a n-octanol/acetonitrile mixed solvent. The enlargement of particle size was induced by increasing HPC (hydroypropylcellulose) concentration (0.005, 0.1, and 0.05 g/ι) and emulsion-state aging time (10 min and 360 min). Mean particle sizes of dried alumina gel powders increased from 1.4 ${\mu}{\textrm}{m}$ to 3.5${\mu}{\textrm}{m}$ at 10-min emulsion-state aging time and from 1.9${\mu}{\textrm}{m}$ to 4.1${\mu}{\textrm}{m}$ at 360-min emulsion-state aging time as HPC concentration increased from 0.005 g/ι to 0.05 g/ι. At the same HPC concentration, particle size of dried alumina gel powder increased with increasing of emulsion-state aging time from 10 min to 360 min. The increase in the average particle size of dried alumina gel powder with increase in HPC concentration was interpreted as the enlargement of particles from alkoxide emulsions unprotected by HPC. The produced dried gel powder calcined at 115$0^{\circ}C$ for one hour transformed to $\alpha$-alumina.

• 마이크로전자및패키징학회지
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• 제6권1호
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• pp.11-21
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• 1999

For microelectronic packaging application, the crystallizable glass powder in CaO-$A1_2O_3-SiO_2-B_2O_3$system was mixed with various amounts of alumina inclusions (\approx 4 $\mu \textrm{m}$), and its sintering behavior, crystallization behavior, and dielectric constant were examined in terms of vol% of alumina and the reaction between the alumina and the glass. Sintering of the CASB glass powder alone at $900^{\circ}C$ resulted in full densification (99.5%). Sintering of alumina-filled composite at $900^{\circ}C$ also resulted in a substantial denslfication higher than 97% of theoretical density, In this case, the maximum volume percent of alumina should be less than 40%. XRD analysis revealed that there was a partial dissolution of alumina into the glass. This alumina dissolution, however, did not show the particle growth and shape accommodation. Therefore, the sintering of both the pure glans and the alumina-filled composite was mainly achieved by the viscous flow and the redistribution of the glass. Alumina dissolution accelerated the crystallization initiation time at $1000^{\circ}C$ and hindered the densification of the glass. Dielectric constants of both the alumina-filled glass and the glass-ceramic composites were increased with increasing alumina content and followed rule of mixture. In case of the glass-ceramic matrix composites showed relatively lower dielectric constant than the glass matrix composite. Furthermore, as alumina content increased, crystallization behavior of the glass was changed due to the reaction between the glass and the alumina. As alumina reacted with the glass matrix, the major crystallized phase was shifted from wollastonite to gehlenite. In this system, alumina dissolution strongly depended on the particle size: When the particle size of alumina was increased to 15 $\mu\textrm{m}$, no sign of dissolution was observed and the major crystallized phase was wollastonite.

• Transactions on Electrical and Electronic Materials
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• 제16권6호
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• pp.351-354
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• 2015

In this study, alumina plates 9~25 μm in size were used as thermal fillers, and epoxy resin was used as a polymer matrix. Oriented alumina plate/epoxy composites were prepared using a rolling method. The effect of ordering alumina plates increased with alumina plate size. The thermal conductivity and flexural strength of the composites were investigated. The horizontal thermal conductivity of the oriented composite was significantly higher than the vertical thermal conductivity. The horizontal thermal conductivity of the 75 wt% alumina content was 8.78 W/mk, although the vertical thermal conductivity was 1.04 W/mk. Ordering of the alumina plate using a rolling method significantly improved the thermal conductivity in the horizontal direction. The flexural strengths of the ordered alumina/epoxy composites prepared at different curing temperatures were measured.

• 분석과학
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• 제24권2호
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• pp.61-68
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• 2011

알루미나에 니켈을 코팅하는 효율을 높이기 위하여 졸-겔법을 이용하여 비결정성 알루미나를 제조한 후, 음향화학법을 이용하여 니켈을 알루미나에 코팅하여 미립자를 제조하였다. 니켈을 코팅한 알루미나 미립자는 여러 가지 소성온도($500^{\circ}C$, $1,000^{\circ}C$), 니켈용액의 농도(0.01 M~0.2 M), 초음파반응시간 (30 min, 2 h)의 조건에서 제조하였다. 제조한 미분체는 X-Ray Diffractometer (XRD), Scanning Electron Microscope (SEM), Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES), Particle Size Analyzer (PSA)로 특성을 분석하였다. 니켈용액의 농도가 진해짐에 따라 그리고 초음파반응시간이 길수록 니켈의 코팅량이 증가하였다. 알루미나에 니켈을 코팅하는데 있어 $1000^{\circ}C$의 소성온도, 0.1 M의 니켈용액의 농도, 2시간의 초음파에 반응하였을 때 알루미나에 니켈이 가장 많이 코팅되었다. 그리고 평균입자의 크기는 835.9~986.7 nm였다.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제30회 추계학술대회
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• pp.263-268
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• 1999

Langasite, a new piezoelectric material was polished by CMP(chemical mechanical polishing). To enhance the polishing rate, alumina abrasives were added to commercial ILD1300 slurry which contains silica abrasive. The effect of added alumina 0 the silica slurry on the polishing rate and damage of langasite was investigated, Experimental results show that the polishing rate and roughness increases with increasing added alumina particle size, Crystallinity of the langasite is also lowered by alumina addition.

• 한국분무공학회지
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• 제19권4호
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• pp.174-181
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• 2014

This study investigates the effects of nanoparticle size and temperature on the thermal conductivity enhancement of water-based alumina ($Al_2O_3$) nanofluids, using the centrifuging method and relative centrifugal forces of differing magnitude to produce nanofluids of three different particles without involving any dispersants or surfactants. We determined the coupling dependency in thermal conductivity enhancement relative to nanoparticle size and temperature of the alumina nanofluids and also experimentally showed that the effect of temperature on thermal conductivity is strongly dependent on nanoparticle size. Also, our experimental data presented that the effective medium theory models such as the Maxwell model and Hasselman and Johnson model are not sufficient to explain the thermal conductivity of nanofluids since they cannot account for the temperature- and size-dependent nature of water-based alumina nanofluids.

• 한국재료학회지
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• 제23권4호
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• pp.250-254
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• 2013

In order to increase the toughness of ZTA(zirconia toughened alumina) ceramics, the present study focused on rearrangement and densification of particles according to the particle size of the parent material. When rough alumina was used for production of ZTA, densification behavior was observed in the specimen sintered at a temperature over $1550^{\circ}C$. However, it was found that the densification behavior was occurred in the specimen sintered at $1450^{\circ}C$ when fine alumina powder was used. High relative density exceeding 98% was obtained when fine alumina powder was mixed with 15 wt% of 3Y-TZP and sintered at $1600^{\circ}C$. Also, a hardness of 1820.2 Hv was obtained when a specimen containing 10 wt% of 3Y-TZP was sintered at $1600^{\circ}C$. In the case of 3Y-TZP containing rough alumina powder that had been sintered the hardness value was around 1720.3 Hv. It was predicted that an improved toughening effect in ZTA could be achieved by using finer alumina powder as the parent material.

• Transactions on Electrical and Electronic Materials
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• 제16권6호
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• pp.338-341
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• 2015

Epoxy/micro-sized alumina composite was prepared, and the effects of alumina content on the dielectric properties were investigated in order to develop an insulation material for gas-insulated switchgears (GIS). Nano-sized alumina (average particle size: 30 nm) was also incorporated into the epoxy/micro-sized alumina composite. Dielectric tests were carried out in ASTM D 150, and capacitance (Cp) and dielectric loss (tanδ) were measured. The dielectric constant increased with increasing alumina content in the epoxy/micro-alumina system and the epoxy/micro-alumina/nano-alumina system. As 1,3-diglycidyl glyceryl ether (DGE) content increased, the dielectric constant decreased and dielectric loss increased. This ocurred as a result of the weak electric field enhancement due to homogeneous dispersion of micro- and nano-sized alumina particles in an epoxy composite.

• 한국세라믹학회지
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• 제38권9호
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• pp.799-805
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• 2001

상용 알루미나 분말(0.5${\mu}$m, 3${\mu}$m)을 die-press법을 이용하여 1120$^{\circ}$C에서 2시간 1차 소결하여 다공성 전성형체를 제조하고 1100$^{\circ}$C에서 4시간 $La_2O_3-Al_2O_3-SiO_2$계 유리를 용융 침투시켜 치밀한 유리-알루미나 복합체를 제조하였다. 알루미나 입도가 유리-알루미나 복합체의 충진율, 미세조직, 젖음성, 기공률 및 크기, 기계적 특성에 미치는 영향을 조사하였다. 입도 범위가 0.1∼48${\mu}$m로 넓고 bimodal size 입도 분포를 가지면서 random orientation을 가진 3${\mu}$m 알루미나가 분산된 복합체가 최적의 기계적 특성 및 충진률이 관찰되었으며 강도와 인성값은 각각 519MPa, $4.5MPa{\cdot}m^{1/2}$이었다.