Highly Thermal Conductive Alumina Plate/Epoxy Composite for Electronic Packaging |
Jeong, Un Seong
(Korea Institute of Ceramic Engineering & Technology)
Lee, Yoon Joo (Korea Institute of Ceramic Engineering & Technology) Shin, Dong Geun (Korea Institute of Ceramic Engineering & Technology) Lim, Hyung Mi (Korea Institute of Ceramic Engineering & Technology) Mun, So Youn (Korea Institute of Ceramic Engineering & Technology) Kwon, Woo Teck (Korea Institute of Ceramic Engineering & Technology) Kim, Soo Ryong (Korea Institute of Ceramic Engineering & Technology) Kim, Young Hee (Korea Institute of Ceramic Engineering & Technology) Shim, Kwang Bo (Department of Materials Science & Engineering, Hanyang University) |
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