• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.336.2-336.2
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• 2014

Indium Tin Oxide (ITO) thin films are used as the Transparent Conducting Oxide (TCO), such as flat panel display, transparent electrodes, solar cell, touch screen, and various optical devices. ZnO has attracted attention as alternative materials to ITO film due to its resource availability, low cost, and good transmittance at the visible region. Recently, very thin film deposition is important. In order to minimize the damage caused by bending. However, ZnO thin film such as Ga-doped ZnO(GZO) has poor sheet resistance characteristics. To solve this problem, By adding the conductive metal on films can decrease the sheet resistance and increase the mobility of the films. In this study, We analyzed the electrical and optical characteristics of GZO/Ag/GZO (GAG) films by change in Ag and GZO thickness.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.496-502
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• 1999

Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5$\mu\textrm{m}$ at room temperature as a reference. The deposition of film was optimized to ensure the adhesion by process parameters of substrate heating temperature at $100~300^{\circ}C$, sputter etching time at -300V for 10~30min, bias voltage of -100~-500V, and existence of Cr interlayer film of $500\AA$. The critical $load L_{c}$ /, defined as the minimum load at which initial damage occurs, was the highest up to 29N at bias voltage of -500V by scratch test. AFM surface image and AES depth profile were investigated to analyze the interface. The effect of bias voltage in sputtering was to improve the surface roughness and remove the oxide on Alloy42.

• Fisheries and Aquatic Sciences
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• v.12 no.1
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• pp.49-53
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• 2009

We conducted a histological analysis to investigate the influence of nutritional changes on melano-macrophages (MMs) accumulation in the kidney of sub-adult rock bream (Oplegnathus fasciatus). Four experimental groups were established (initial control, control, fed and starved), and fed commercial feed amounting to 1-3% of their body weight for 2 weeks prior to initiation of experiments. Kidney MMs with dark brown pigment were randomly observed in the kidneys of starved fish, increasing rapidly after 4 weeks, while deposition levels remained low throughout the experiment in the control and fed groups. These results suggest that catabolic tissue breakdown is a major factor contributing to the formation of pigments within MMs. Results also suggest that the degree of MMs deposition in the kidney can be used as alternative indicators in identifying starvation in wild and cultured rock bream.

• Carbon letters
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• v.13 no.1
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• pp.44-47
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• 2012

We analyzed the effect of etchants for metal catalysts in terms of the characteristics of resulting graphene films, such as sheet resistance, hall mobility, transmittance, and carrier concentration. We found the residue of $FeCl_3$ etchant degraded the sheet resistance and mobility of graphene films. The residue was identified as an iron oxide containing a small amount of Cl through elemental analysis using X-ray photoelectron spectroscopy. To remove this residue, we provide an alternative etching solution by introducing acidic etching solutions and their combinations ($HNO_3$, HCl, $FeCl_3$ + HCl, and $FeCl_3+HNO_3$). The combination of $FeCl_3$ and acidic solutions (HCl and $HNO_3$) resulted in more enhanced electrical properties than pure etchants, which is attributed to the elimination of left over etching residue, and a small amount of amorphous carbon debris after the etching process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.142-142
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• 2007

Micro thermoelectric generator has been attractive for the alternative power source to operate the wireless sensor node. In this paper, we designed the column-type micro thermoelectric device and their device characteristics were measured. n-type Bi2Te3 and p-type BiSbTe3 thermoelectric thin films were grown on (001) GaAs substrates by metal organic chemical vapour deposition (MOCVD) and they were pattemed. The height of thermoelectric film were controlled by the deposition time, temperature and MO-x gas pressure. Seebeck coefficient was measured at room temperature and hole concentration and electrical resistivity of thermoelectric film were also characterized.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Progress in Superconductivity and Cryogenics
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• v.6 no.4
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• pp.9-12
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• 2004

We report a successful fabrication of high-$J_C$ $NdBa_2Cu_3O_{7-{\delta}}$ (NdBCO) films on (100) $SrTiO_3$ substrates by pulsed laser deposition (PLD) in high oxygen pressures ranging from 400 to 800 mTorr. Fabricated NdBCO films exhibited only c-axis orientation, good out-of-plane and in-plane textures, and also excellent superconducting properties, including critical temperature ($T_C$) and critical current density ($J_C$) of above 90 K and the highest of $3.1MA/cm^2$ at 77 K in self-field, implying that NdBCO is a perspective alternative to YBCO for coated conductor. In low oxygen pressures ranging from 100 to 200 mTorr, however, the films showed a-, c-mixed orientation and degraded $T_{C,zero}$ values due to the formation of $Nd_{1+x}Ba_{2-x}Cu_3O_{7-{\delta}}$-type solid solutions with an excessive substitution of $Nd^{3+}$ ions for the $Ba^{2+}$ sites.

• Journal of Wetlands Research
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• v.23 no.1
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• pp.85-93
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• 2021

Sewage separation which often involves installing a new pipe to separate wastewater flow from stormwater runoff flow can be costly and depends highly on its feasibility in a site. To be able to develop a potentially more economical alternative that can also lessen major road traffic disturbance during this process, a different approach where a smaller sewage separator pipe is installed inside an existing combined sewer pipe was investigated. A small-scale of a box sewer and the proposed sewage separator pipe was constructed in the laboratory to observe and compare the deposition of solids and other solid-associated major pollutants at different flow rates. In addition, three-dimensional flow simulations considering five different scenarios were conducted using Ansys Fluent to observe the effect of the proposed sewage separator pipe to the hydraulic flow if installed inside the combined sewer pipe. Results revealed that the deposition of TSS, TCOD, TN, and TP were reduced by at least 60% when the wastewater was conveyed by the sewage separator pipe instead of the combined sewer pipe. Moreover, the flow simulations conducted showed that there was little to no major disturbance in hydraulic flow and velocity distribution when the sewage separator was installed inside a straight pipe and even at pipe transitions such as intersections, turns, and drop in elevation. Considering the pipe dimensions and the results of the study, the proposed approach can be promising in terms of reduction in pollutant deposition without a major effect on the hydraulic flow. Further investigation and cost-analysis should be done in the future to support these preliminary findings and help alleviate the problems caused by combined sewer overflows by introducing an alternative approach.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.338-343
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• 2010

As an alternative to the W plug used in MOSFETs, a Cu plug with a NiSi contact using Ta / TaN as a diffusion barrier is currently being considered. Conventionally, Ni was first deposited and then NiSi was formed, followed by the barrier and Cu deposition. In this study, Ti was employed as a barrier material and simultaneous formation of the NiSi contact and Cu plug / Ti barrier was attempted. Cu(100 nm) / Ti / Ni(20 nm) with varying Ti thicknesses were deposited on a Si substrate and annealed at $4000^{\circ}C$ for 30 min. For comparison, Cu/Ti/NiSi thin films were also formed by the conventional method. Optical Microscopy (OM), Scanning Probe Microscopy (SPM), X-Ray Diffractometry (XRD), and Auger Electron Microscopy (AES) analysis were performed to characterize the inter-diffusion properties. For a Ti interlayer thicker than 50 nm, the NiSi formation was incomplete, although Cu diffusion was inhibited by the Ti barrier. For a Ti thickness of 20 nm and less, an almost stoichiometric NiSi contact along with the Cu plug and Ti barrier layers was formed. The results were comparable to that formed by the conventional method and showed that this alternative process has potential as a formation process for the Cu plug/Ti barrier/NiSi contact system.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.196.1-196.1
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• 2016

TCO(Transparent Conducting Oxide) on flat glass is used in thin-film photovoltaic cell, flat-panel display. Nowadays, Corning(R) Willow Glass(R), known as flexible substrate, has attracted much attention due to its many advantages such as reliable roll-to-roll glass processing, high-quality flexible electronic devices, high temperature process. Also, it can be an alternative to flexible polymer substrates which have their poor stability and degradation of electrical and optical qualities. For application on willow glass, the flexibility, electrical, optical properties can be greatly influenced by the TCO thin film thickness due to the inherent characterization of thin film in nanoscale. It can be expected that while thick TCO layer causes poor transparency, its sheet resistance become low. Also, rarely reports were focusing on the influence of flexible properties by varying TCO thickness on flexible glass. Therefore, it is very important to optimize TCO thickness on flexible Willow glass. In this study, Ti-ZnO thin films, with different thickness varied from 0 nm to 50 nm, were deposited on the flexible willow glass by atomic layer deposition (ALD). The flexible, electrical and optical properties were investigated, respectively. Also, these properties of Ti-doped ZnO thin films were compared with un-doped ZnO thin film. Based on the results, when Ti-ZnO thin films thickness increased, resistivity decreased and then saturated; transmittance decreased. The Figure of Merit (FoM) and flexibility was the highest when Ti-ZnO thickness was 40nm. The flexible, electrical and optical properties of Ti-ZnO thin films were better than ZnO thin film at the same thickness.