• 한국재료학회지
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• 제19권6호
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• pp.319-324
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• 2009

The deposition behavior and structural and magnetic properties of electroless Co-B and Co-Fe-B deposits, as well as the amorphous ribbon substrates, were investigated. These Co-based alloy deposits exhibited characteristic polycrystalline structures and surface morphology and magnetic properties that were dependent on the type of amorphous substrates. The catalytic activity sequence of the amorphous ribbon electrodes for anodic oxidation of DMAB was estimated from the current density-potential curve in the anodic partial electrolytic bath that did not contain the metal ions. Both the deposition rate and potential in the initial region were obtained in order of the catalytic activity, depending on the alloy compositions of the substrates. The deposition rate linearly varied against the deposition time. The initial deposition potential may have also determined the structural and magnetic properties of the deposit based on the thickness of ${\mu}m$ order. Furthermore, a basic study of the electroless deposition processes on an amorphous ribbon substrate has been carried out in connection with the structural and magnetic properties of the deposits.

• 한국표면공학회지
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• 제13권3호
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• pp.146-154
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• 1980

The effects of various electrodeposition conditions (deposition temperature and cathode current density) on preferred orientation and microhardness of electrodeposited Ni-Sn and Sn-Zn alloys were studied. At deposition temperatures from 25$^{\circ}$ to 95$^{\circ}C$ and constant cathode current density of 270 and 530 A/$m^2$ Ni-Sn and Sn-Zn were codeposited in chloride-fluoride acid and stannate-cyanide alkaline electrolyte bath respectively. Ni-Sn alloy deposited at temperatures from 25$^{\circ}$ to 35$^{\circ}C$ was composed of single phase of $Ni_3Sn_4$ with 73 wt.% Sn and the one deposited at temperatures from 45$^{\circ}$ to 95$^{\circ}C$ was made of multiphase mixture of NiSn, $Ni_3Sn_2$ and $Ni_3Sn_4$ with nearly equiatomic composition (65.5 wt.% Sn). The random orientation of thermody-namically metastable NiSn phase (hexagonal structure) predominated at deposition temperature range 25$^{\circ}$-45$^{\circ}C$, and the strong (110) preferred orientation was found at 65$^{\circ}$-85$^{\circ}C$ and then disappeared again at 95$^{\circ}C$. The microhardness of Ni-Sn deposits increased with deposition temperature up to 85$^{\circ}C$, and then decreased at constant cathode current density. The preferred orientation and the maximum microhardness were discussed in terms of lattice contractile stress which result from desorption of hydrogen atom absorbed in deposit lattice. The Sn content of Sn-Zn alloy deposits increased with deposition temperature up to 75$^{\circ}C$, and then decreased at constant cathode current density of 530 A/$m^2$. It also decreased with cathode current density up to 530 A/$m^2$, and then increased at constant deposition temperature of 25$^{\circ}C$. Sn-Zn alloy deposits were composed of two-phase mixture of ${beta}$-Sn and Zn. The preferred orientations of ${beta}$-Sn (tetragonal structure) changed with deposition temperature. The microhardness of Sn-Zn deposits decreased with deposition temperature. It also increased with cathode density up to 530 A/$m^2$, and then decreased at constant deposition temperature of 25$^{\circ}C$. The microhardness of Sn-Zn deposits was observed to be determinded more by the Sn content than by the preferred orientation.

• 한국표면공학회지
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• 제46권6호
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• pp.248-257
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• 2013

It is generally recognized that thin Pd-Cu alloy films fabricated by sputtering show a wide range of microstructures and properties, both of which are highly dependent on the sputtering conditions. In view of this, the present study aims to investigate the relationship between the performance of hydrogen separation membranes and the microstructure of Pd alloy films depending on sputtering deposition conditions such as substrate temperature, working pressure, and DC power. We fabricated thin and dense Pd-Cu alloy membranes by the micro-polishing of porous Ni support, an advanced Pd-Cu sputtered multi-deposition under the conditions of high substrate temperature / low working pressure / high DC power, and a followed by Cu-reflow heat-treatment. The result of a hydrogen permeation test indicated that the selectivity for $H_2/N_2$ was infinite because of the void-free and dense surface of the Pd alloy membranes, and the hydrogen permeability was 10.5 $ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ for a 6 ${\mu}m$ membrane thickness.

• 마이크로전자및패키징학회지
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• 제14권2호
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• pp.49-57
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• 2007

본 연구에서는 Au 와 Sn을 rf-magnetron sputter를 이용하여 다층막(multilayer)과 동시증착(Co-sputter)방법으로 스퍼터링하여 기판위에 AuSn 솔더를 형성하였고, 솔더의 조성제어와 특성 분석을 통해 Sn rich AuSn 솔더의 형성 기술에 대하여 연구하였다. AuSn 솔더를 형성하기 앞서 Au와 Sn에 대하여 단일 금속 증착을 하였다. 이를 토대로 AuSn솔더를 증착하기 위한 실험 조건을 확보하였다. 증착변수로는 기판의 온도, rf 전력과 두께 비를 이용하였다. 다층막의 경우, 고온의 기판에서 솔더 합금의 표면거칠기와 조성이 보다 정확하게 제어되었다. 이에 비해 동시증착 솔더는 기판의 온도에 의한 조성의 변화가 거의 없었으나, rf전력에 의해서 조성이 보다 쉽게 제어할 수 있었다. 여기에 더해, 동시 증착 솔더 박막의 대부분은 증착동안에 금속간 화합물로 변화한 것을 알 수 있었다. 화합물의 종류는 XRD로 분석하였다. 형성된 솔더 박막을 플럭스를 이용하지 않고 리드프레임에 접합하여 접합강도를 측정하였다. 다층형의 경우 Au 10wt%의 조건에서 최대 $33(N/mm^2)$ 전단응력을 나타내었으며, 동시증착형은 Au 5wt%에서 $460(N/mm^2)$ 전단응력을 나타내었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.194.1-194.1
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• 2016

The present study investigated the effect of zincate treatment time on the dissolution behavior and the deposition of copper by immersion process and electroplating process on AZ31 Mg alloy substrate in a copper pyrophosphate bath. Without zincate pretreatment, the AZ31 Mg substrate quickly dissolved in the copper pyrophosphate solution although an external cathodic current was applied. The copper layers deposited on non-zincate treated AZ31 Mg alloy substrate by both immersion and electroplating processes showed very porous structure and very poor adhesion. With increasing zincate treatment time up to 2 min, the dissolution of AZ31 substrate in pyrophosphate solution rapidly decreased and the deposited copper layer was less porous and exhibited stronger adhesion. The immersion of AZ31 Mg sample in zincate solution for 5 min was found as a critical time for producing a non-porous and adherent electrodeposited copper layer on AZ31 Mg alloy. The optimum zincating time can be determined by observing the open circuit potential (OCP) of AZ31 Mg alloy samples in a copper pyrophosphate electroplating bath. The OCP reached a stable value of about -0.10 V (vs. SCE) after 5 min of immersion in the copper pyrophosphate electroplating solution.

• 한국레이저가공학회지
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• 제18권3호
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• pp.1-5
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• 2015

A 3D printer based on laser powder deposition (LPD), also known as DED (direct energy deposition), has been developed for fabricating metal parts. The printer uses a ytterbium fiber laser (1070nm, 1kW) and is equipped with an Ar purge chamber, a three-dimensional translation stage and a powder feeding system composed of a powder chamber and delivery nozzles. To demonstrate the performance of the printer, a tapered cylinder of 320mm in height has been fabricated successfully using Ti-6Al-4V powders. The process parameters including the laser output power, the scan speed, and the powder feeding rate have been optimized. A 3D printed test specimen shows mechanical properties (yield strength, ultimate tensile strength, and elongation) exceeding the criteria to employed in a variety of Ti alloy applications.

• 한국분말재료학회지
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• 제27권3호
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• pp.219-225
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• 2020

The directed energy deposition (DED) process of metal 3D printing technologies has been treated as an effective method for welding, repairing, and even 3-dimensional building of machinery parts. In this study, stainless steel 316L (STS316L) and Inconel 625 (IN625) alloy powders are additively manufactured using the DED process, and the microstructure of the fabricated STS316L/IN625 sample is investigated. In particular, there are no secondary phases in the interface between STS316L and the IN625 alloy. The EDS and Vickers hardness results clearly show compositionally and mechanically transient layers a few tens of micrometers in thickness. Interestingly, several cracks are only observed in the STS 316L rather than in the IN625 alloy near the interface. In addition, small-sized voids 200-400 nm in diameter that look like trapped pores are present in both materials. The cracks present near the interface are formed by tensile stress in STS316L caused by the difference in the CTE (coefficient of thermal expansion) between the two materials during the DED process. These results can provide fundamental information for the fabrication of machinery parts that require joining of two materials, such as valves.

• KIEE International Transactions on Electrophysics and Applications
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• 제3C권1호
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• pp.23-27
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• 2003

Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, in-ter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of tar-get configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate tar-gets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.

• 한국분말재료학회지
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• 제29권4호
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• pp.309-313
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• 2022

In this study, additive manufacturing of a functionally graded material (FGM) as an alternative to joining dissimilar metals is investigated using directed energy deposition (DED). FGM consists of five different layers, which are mixtures of austenitic stainless steel (type 316 L) and low-alloy steel (LAS, ferritic steel) at ratios of 100:0 (A layer), 75:25 (B layer), 50:50 (C layer), 25:75 (D layer), and 0:100 (E layer), respectively, in each deposition layer. The FGM samples are successfully fabricated without cracks or delamination using the DED method, and specimens are characterized using optical and scanning electron microscopy to monitor their microstructures. In layers C and D of the sample, the tensile strength is determined to be very high owing to the formation of ferrite and martensite structures. However, the elongation is high in layers A and B, which contain a large fraction of austenite.

• Transactions on Electrical and Electronic Materials
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• 제5권4호
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• pp.153-157
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• 2004

ITO thin films were deposited on PET and soda-lime glass substrates by a dc reactive magnetron sputtering of In-Sn alloy metal target without substrate heater and post-deposition thermal treatment. The dependency of rf-bias voltage and substrate power during deposition processing was investigated to control the electrical and optical properties of ITO films. The range of rf bias voltage is from 0 to -80 V and the substrate power is applied from 10 to 50 W. The minimum resistivity of ITO film is 5.4${\times}$10$^{-4}$ $\Omega$cm at 50 W power and rf-bias voltage of -20 V. The best transmittance of ITO films at 550 nm wavelength is 91 % in the substrate power of 30 W and rf-bias voltage of -80 V.