• 대한치과기공학회지
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• 제22권1호
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• pp.39-47
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• 2000

This study is the know the difference bond strength according to painting method of Opaque porcelain. Among Porcelain powder for Porcelain, Noritake powder, Bonding agent 1 class and metal are selected as Base metal alloy. And painting method of Opaque porcelain is divided by 4 groups : PG, WG, NG and DG. Also it is to manufacture 24 sheets of Specimen by 6 each every method and to measure Crack-initiation Strength of Metal-porcelain and it is to observe it by Scanning electron microscope. I come to get a conclusion as follows. 1. As for Debonding strength of every experiment groups, it showed that WS group which executed Wash bake had highest value, 44.25MPa and NG group which used Normal powder had value, 42.11MPa and DG group which used Bonding agent had value, 35.88MPa and PG group which used Paste opaque had value, 35.39MPa. 2. In four painting methods of Opaque porcelain, PG group, WG group, NG group and DG group, there is no significant difference statistically in Crack-initiation Strength. 3. As a result of observing fracture surface with Scanning electron microscope, it was showde that PG group remained a lot of particle of porcelain on the surface of metal than WG group, NG group and DG group.

• 한국분말재료학회지
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• 제1권1호
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• pp.42-51
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• 1994

6061Al-SiCP metal matrix composite materials(MMCs) were fabricated by injecting SiCP particles directly into the atomized spray. The main attraction of this technique is the rapid fabrication of semi-finished, composite products in a combined atomization, particulate injection(10 $\mu\textrm{m}$, 40 $\mu\textrm{m}$, SiCP) and deposition operation. Conclusions obtained are as follows; The microstructure of the unreinforced spray formed 6061Al alloy consisted of relatively fine(50 $\mu\textrm{m}$) equiaxed grains. By comparision, the microstructure of the I/M materials was segregated and consisted of relatively coarse(150 $\mu\textrm{m}$) grains. The probability of clustering of SiCP particles in co-sprayed metal matrix composites increased it ceramic particle size(SiCP) was reduced and the volume fraction was held constant. Analysis of overspray powders collected from the spray atomization and deposition experiments indicated that morphology of powders were nearly spherical and degree of powders sphercity was deviated due to composite with SiCp particles. Interfacial bonding between matrix and ceramics was improved by heat treatment and addition of alloying elements(Mg). Maximum hardness values [Hv: 165 kg/mm2 for Al-10 $\mu\textrm{m}$ SiCp Hv--159 kg/mm2 for Al-40 $\mu\textrm{m}$SiCp] were obtained through the solution heat treatment at $530^{\circ}C$ for 2 hrs and aging at $178^{\circ}C$, and there by the resistance were improved.

• Journal of Welding and Joining
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• 제22권4호
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• pp.35-42
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• 2004

Contact tips are required to have a higher resistance to wear and thus to have an extended life time under the advanced GMAW welding process. Several requirements have been specified and employed by domestic industries for selecting their tips for such a purpose. However no attempt has been made to justify their requirements based on the experimental data of wear resistance or life time of contact tips. In this study, five different contact tips with three different compositions were employed for actual GMA welding up to 4 hours and were evaluated their wear resistance by measuring in every one hour the area of enlarged hole at the exit side. Experimental results clearly showed that the Cr-containing tips strengthened by precipitation hardening have much better resistance to wear than those made by work hardening. It was further noticed that Cr is an excellent alloying element for improving the wear resistance of contact tips only when it is in an properly aged condition. Initial hardness may play some role in the early stage of wear but not in the later stage of welding because the microstructure of tip changes significantly by the prolonged exposure to welding arc heat. Based on these results, critical review has been made on the current requirements employed by domestic industries. Of importance is that a new guideline has been confirmed to be more reasonable.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• 대한치과보철학회지
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• 제24권1호
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• pp.85-90
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• 1986

The purpose of this study was to compare the tensile bond strength of Comspan and Panavia as a luting materials between electrochemically etched Ni-Cr-Be alloy castings and acid etchea human tooth enamel. Tensile bond strength was evaluated using an Instron testing machine at a crosshead speed of 2mm/min. The following conclusions can be drawn frfm this study ; 1. The tensile bond strength of etched-metal resin-bonded specimen was $179.0{\pm}42.5kg/cm^2$ in case of Comspan and $169.6{\pm}41.4kg/cm^2$ in case of Panavia. 2. The tensile bond strength was not significantly different between Comspan, using with bonding agent, and Panavia, using without bonding agent.

• Journal of Magnetics
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• 제14권1호
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• pp.42-46
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• 2009

The measurement of external magnetic field orientation using Giant Magneto Impedance (GMI) sensors has been performed. A soft magnetic alloy of $Co_{30}Fe_{34}Ni_{36}$ was electroplated on a Si wafer with a CoFeNi seed layer. V-shaped microwire patterns were formed using a conventional photolithography process. An external magnetic field was generated by a rectangular AlNiCo permanent magnet. The reference direction was defined as the external magnetic field direction oriented in the middle of 2 GMI devices. As the orientation of the magnetic field deviated from the reference direction, variation in the field component along each device introduced voltage changes. It was found that, by taking the voltage difference between the left and right arms of the Vshaped device, the nonlinearity of each device could be significantly reduced. The fabricated angle sensor had a linear range of approximately $70^{\circ}$ and an overall sensitivity of approximately 10 mV.

• 한국주조공학회지
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• 제19권5호
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• pp.403-409
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• 1999

Mg-Zn-Zr ternary alloys containing 6wt% Zn and (0, 0.4, 0.6)wt% Zr, which is added for grain refinement, can be cast into complex shape by squeeze casting. The influence of Zn and Zr as additional elements on microstructure and mechanical characteristics is investigated by OM, SEM, WDX, XRD and microvickers hardness measurement. The microstructure of Mg-Zn-Zr alloys consists of primary ${\alpha}-Mg$ and MgZn eutectic compound between dendrites. The grain size is decreased from $136{\mu}m$ to $97\;{\mu}m$ by Zr addition, resulting in that the hardness is increased from 42Hv to 59Hv. Furthermore, the grain size is changed to $83{\beta}$ and the hardness is increased to 65Hv by additional infiltration pressure. These results indicate that the Zr addition and additional infiltration pressure are effective for grain refinement acting as an important factor to increase the hardness. The increment in hardness by the Zr addition is slightly larger than that by the additional infiltration pressure.

• 자원리싸이클링
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• 제7권3호
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• pp.42-51
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• 1998

알루미늄이나 마그네슘과 같은 경량금속은 스크랩 용해과정에서 수분과의 반응으로 수소농도가 증가하게 되며, 재활용을 위해서는 추가적인 합금성분의 첨가 및 탈 수소 공정이 필요하다. 본 연구에서는 경량금속 스크랩 용해공정에 사용되는 정련로에 대하여 배플의 유무 및 임펠러를 사용한 기계적 교반이 탈 가스 거동에 미치는 영향에 대하여 조사하였다. 수 모델 실험을 통해 유동현상의 관찰, 균일 혼합시간 및 탈 가스 속도를 측정하였고, 반응용기 내 난류 유동장에 대한 수치해석을 통해 기계적 교반을 실시하는 정련로에 대한 혼합 및 탈가스 거동을 정량화 하였다.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 하계학술발표대회 논문집
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• pp.346-351
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• 2006

When metallic alloys are reacted to hydrogen, heat transfer of storage tank effects hydrogen storage rate and capacity. If pulsating heat pipe are used to improve heat transfer efficiency, production of hydrogen storage tank can be more simple and economical. Experiment of heat pipe was conducted by varying working fluids and heat flux. According to supply heat flux, test indicate that R-22 and R-l42b were found lower temperature difference between evaporator and condenser than R-134a and Ethanol. Thermal resistances of R-22 and R-142b were also lower than others. Using R-142b as a working fluid, heat pipe type hydrogen storage tank is tested in absorption and desorption processes.