• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.64-64
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• 2009

As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of $CuSO_4$ solution during electric copper plating process. Comparing the intensity variations of the RGB data and optical spectroscopy data, strong correlation between two in-situ sensors have shown.

• 대한기계학회논문집B
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• 제20권7호
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2004년도 동계학술대회 논문집
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• pp.99-99
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• 2004

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.190-192
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• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• Journal of Advanced Marine Engineering and Technology
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• 제27권2호
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• pp.229-237
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• 2003

The flow and heat transfer characteristics at the surface of two-dimensional protruding heated blocks using confined impingement multiple slot jets were computationally investigated Numerical predictions were made for round-edged nozzles at several nozzle-to-target plate spacings and jet-to-jet distances, with turbulent jet Reynolds numbers ranging from 2000 to 7800. The commercial finite-volume code FLUENT was used to solve the heat transfer characteristics and flow fields using a RNG $\textsc{k}-\varepsilon$ model. The computed heat transfer characteristics at the surface of heated blocks were in good qualitative agreement with previous experimental data The results of heat transfer characteristics on the surface of protruding heated blocks are important considerations in electronics Packaging design.

• Design & Manufacturing
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• 제1권1호
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• pp.33-37
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• 2007

In recent, the demand of high-productivity injection mold increases because of the growth of international packaging market. The increase of productivity leads to the large-sized injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the existing machine and device is studied in advanced countries actively. In this study, as the preliminary research of stack mold development, the stack mold which has 2 Level ${\times}4$ Cavity is designed and manufactured. Besides, the motion and structural analysis are executed to verify the stability of developed stack mold.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.71-71
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• 2009

Recently several LCD TV makers including Samsung, LG and Sony actively have released LED LCD TV models on market. LED LCD TV is just which applied LED BLUs so that its color contrast ratio fairly enhance up to 1 million:1 and its thickness minimize to a few mm. Even this aspect seems somewhat to be each panel maker's strategies for prior market occupations on whole TV market. Without regard to the reasons, we do obviously meet a new era of technically advanced LCD TV. However we have still lots of problems or issues which we must overcome technically including LED chip/packaging process, secondary optics treatment, heat managements and cost reduction issues. Here I would like to forecast market volume and trend of LED LCD TV first and then discuss above almost of technical issues and suggest their possible solutions. Even these solutions looks better technologies and if they may increase production cost significantly, we will not prefer to choice that technology since lower cost policy can open the market. Finally I'm trying to suggest how well LED, as future light source, can apply to future LCD TV technologies.

• 산업경영시스템학회지
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• 제28권3호
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• pp.1-9
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• 2005

We developed the logical methods to analyze economic impacts of standardization and cleared up effects of performing KS in micro and macro aspects. This study is performed through analysing foreign studies and results from surveys. The advanced methods performing standardization as a form of 'Korean industrial standards' are suggested here, which are based on results of this study. The major consequences of this study are followings. The micro economic impact is that each company gets 604.5 millions won a year through performing KS A and F(discount rate 4.5%) and 1.46 trillions won is the macro economic impact through performing total KS A and F, which comes to 0.245% of GDP.