• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• 보존과학연구
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• s.32
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• pp.61-74
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• 2011

This study examines the removal effects of solvents which were applied on three adhesives and three filling materials for ceramics. The chosen materials are Cemedine C, Loctite$^{(R)}$ 401$^{TM}$, Araldite Rapid Type, plaster of paris, CDKI 520A+B, Araldit$^{(R)}$ SV427-2+HV427-1. For the first examination, each different materials were soaked into different solvents, and then the soften level were compared by compressive pressure. The result of the first exam showed that Cemedine C was dissolved easily in acetone. Furthermore Araldite, CDK and SV427 were soften efficiently by Dichloromethan, Tetrahydrofuran and DMX(Dichloromethan+Methanol+Xylene). However, Loctite and plaster were not able to make sample for the first test. Therefore, the second test carried on only. The second examination, chosen effective solvents from the first test were applied with two different methods; soaking and saturated atmosphere. Almost every sample could removed by soaking method in ten minutes, and saturated atmosphere method needs 24 hours for the safety.

• Journal of Environmental Science International
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• v.30 no.12
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• pp.1041-1051
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• 2021

The purpose of this study was to identify for extenders, adhesives, colorants, and fungicides suitable for the production of high-quality film-coated seeds of Chinese cabbage. In addition, the effect of various additives used for film coating on the germination of coated seeds and seedling vigor was investigated to establish appropriate treatment conditions for film coating efficiency. The germination rate and germination speed in Chinese cabbage film-coated seeds did not differ significantly depending on the type and concentration of the extender, while the use of Talc resulted in superior granulation capacity and adhesion of the seed coat in comparison to Zeolite. There was no significant difference in the germination rate depending on the type of adhesive used for film coating of Chinese cabbage seeds, but the germination rate was slightly slower in the film-coated seeds using carboxymethyl cellulose as an adhesive. On the other hand, the seeds coated with a film using 1% PVA as an adhesive not only maintained hardness enough to withstand external pressure, but also showed a high germination rate. In addition, the suitable disinfectant for film coating was venoram, and the treatment concentration was good at 250 mg·L^-1. The type of colorant used in the film-coated seeds of Chinese cabbage did not significantly affect the germination rate, germination speed, and seedling vigor. The seeds film-coated using the liquid colorant were superior in appearance to the seeds film-coated with the solid colorant, which implies the possibility of reduction in the manufacturing costs by using the water-soluble paints as colorants for film-coated seeds.

• Journal of the Korean Applied Science and Technology
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• v.22 no.3
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• pp.289-297
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• 2005

In order to improve resistant properties of water-borne acrylic pressure sensitive adhesives(PSAs) for automobiles, this study was carried out. Removable PSAs for automobiles were synthesized by emulsion polymerization of monomers, n-butyl acrylate(BA), n-butyl methacrylate(BMA), acrylonitrile(AN), acrylic acid(AA) and 2-hydroxyethyl methacrylate(2-HEMA), and AA and 2-HEMA could act as functional monomers for crosslink. Emulsion polymerization was carried out in a semi-batch type reactor. Water resistance, heat resistance, acid resistance, alkali resistance and smoke resistance were examined. As a result, water resistance increased with the amount of BMA, however, the effect of BMA content on the water resistance was insignificant at a range of over 14 wt%. The water resistance also increased with the amount of functional monomers, AA and 2-HEMA. The prepared PSAs satisfied all the standard for automobiles except heat resistance. However, the heat resistance comes nearly up to the standard. Also, acid resistance, alkali resistance and smoke resistance of the prepared PSAs satisfied with the standard.

• Applied Chemistry for Engineering
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• v.7 no.1
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• pp.194-202
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• 1996

Hot melt adhesive based on the polyamide resin was studied to improve the conventional hot melt adhesives such as ethylene-vinyl acetate which have inherent problems against creep and heat resistance. It was found that the terpolymer of nylons6, nylon66, and nylon12 or the nylon blend instead of nylon homopolymer was suitable base resin for hot melt adhesives, since the disruption of regularity in the polymer chains reduced the crystallinity, resulting in lower melting point and melt viscosity. Also, the rheological properties of the polyamide based hot melt adhesive could be controlled by the incorporation of terpene resin, butyl benzyl phthalate, and paraffin wax. The results of melt viscosities and tensile properties of adhesive itself indicated that the optimum adhesion properties could be obtained through the blending of CM831/843P resins with weight ratio 75/25~50/50. The adhesion between steel and steel was tested by using lap shear geometry. It was found that the surface roughness of steel affected the adhesion strength.

• Polymer(Korea)
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• v.33 no.1
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• pp.45-51
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• 2009

Water soluble adhesive was polymerized from butyl acrylate (BA), methyl methacrylate (MMA) and one of various functional monomers such as acrylic acid (AA), 2-hydroxylethyl methacrylate (2-HEMA), glycidyl methacrylic acid (GMA) and acrylamide (AAm). The amount of the functional monomers was 1$\sim$5 wt%/monomer. In order to improve the adhesive power, a substrate was treated using atmospheric flat plasma method. The adhesive power was improved by the addition of the functional monomers with an order of AA> 2-HEMA> GMA> AAm. The holding power of the adhesives, which is related with the thermal properties of the adhesives, increased with the amount of the functional monomers. The effectiveness in improving the holding power has an order of AA > AAm > GMA > 2-HEMA. By treating a substrate with atmospheric flat plasma method, the adhesives containing each of AA, 2-HEMA, GMA and AAm showed the increases of the final adhesion strength by 9.1, 9.4, 9.4, and 1.8%, respectively. In conclusion, the mechanical properties such as adhesive power and holding power could be controlled by introducing.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.63-67
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• 2017

In this study, We developed a simple and low cost capacitive pressure mapping sensor and microcontroller-base lock-in amplifier array. We developed capacitive type pressure mapping sensor by forming the electrode and adhesives on plastic films using only the printing process, and the finishing the process by bonding the two films. Lock-in amplifier array was based on a general purpose microcontroller and had only a charge amplifier as analog circuits. In this study, a $10{\times}10$ capacitive type pressure mapping sensor and lock-in amplifier array was fabricated and its characteristics were analyzed.

• Journal of the Korean Wood Science and Technology
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• v.45 no.1
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• pp.126-138
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• 2017

This study was conducted to investigate the potential of chicken feather (CF), which is a by-product in poultry industry, as a raw material of wood adhesives. For the purpose, adhesive resins were formulated with NaOH- and $H_2SO_4$-hydrolyzed CF as well as crosslinkers, and then the properties and water resistance of the adhesive resins against hot water were measured. CF was made of mainly keratin-type protein, and no or very low content of heavy metals was detected. Hydrolysis rate of CF increased as NaOH concentration in hydrolysis solutions increased. However, in order to minimize the loss of adhesive property of protein itself by the severe hydrolysis of CF and to seek its proper hydrolysis conditions, NaOH concentrations in hydrolysis solution determined to adjust to 5%, 7.5% and 10%. In the NaOH-hydrolyzed CF, $H_2SO_4$-hydrolyzed CF as a hardener and crosslinker were added to formulate CF-based adhesive resins. Solid content of the resins ranged from 28.3% to 44.8% depending on hydrolysis conditions and type of crosslinker. Viscosity of the resins at $25^{\circ}C$ was very high. However, when the temperature of the resins was increased to $50^{\circ}C$, the viscosity decreased greatly and thus the resins could be applied as a sprayable resin. Retention rate measured to evaluate the water resistance of adhesive resins was the highest in the cured resin formulated with 5% NaOH-hydrolyzed CF and 5% $H_2SO_4$-hydrolyzed CF of 10% based on the solid weight as a hardener. Retention rate depending on crosslinkers added into adhesive resins was the highest phenol-formaldehyde (PF) followed by melamine-urea-formaldehyde (MUF) and formalin. The retention rate of CF-based adhesives formulated with 5% NaOH-hydrolyzed CF, PF and $H_2SO_4$-hydrolyzed CF of 10% and over did not differ statistically from that of commercial MUF resins. All of CF-based adhesives formulated with PF as a crosslinker and one with 5% NaOH-hydrolyzed CF of 55%, 5% $H_2SO_4$-hydrolyzed CF of 15%, and MUF of 30% on the basis of solid weight could be substituted for commercial urea-formaldehyde resins, From the results, CF can be used as a raw material of wood adhesives if hydrolyzed in proper conditions.

• Journal of the Korean Wood Science and Technology
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• v.38 no.4
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• pp.323-332
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• 2010

Petroleum-based adhesive resins have extensively been used for the production of wood panels. However, it is necessary to develop environmentally friendly adhesive resins due to the increase of manufacturing cost and the environmental issue, such as the emission of volatile organic compounds, of the pertroleum-based adhesive resins. This study was conducted to formulate environmentally friendly adhesive resins using by rapeseed flour (RSF), which is the by-product of bio-diesel produced from rapeseed, for replacing petroleum-based adhesives with them. To formulate RSF-based adhesive resins, RSF was hydrolyzed in de-ionized water, 1% and 3% sodium hydroxide solutions. As a crosslinking agent, PF prepolymers were prepared with 1.8, 2.1 and 2.4 mol formaldehyde and 1 mol phenol (1.8-, 2.1- and 2.4-PF), and then mixed with RSF hydrolyzates to complete the formulation of RSF-based adhesive resins. The RSF-based adhesive resins were applied to fabricate 3-ply plywood panels. The solid content of RSF-based adhesive resins were ranged from 26.08% to 36.12% depending on the hydrolysis condition of RSF and PF prepolymer type with a high viscosity. The tensile shear strength and wood failure of plywood fabricated with RSF-based adhesive resins exceeded a minimum requirement of KS standard for ordinary plywood regardless of the hydrolysis condition of RSF and PF prepolymer type. Formaldehyde emissions of the plywood panels fabricated with 1.8-PF and RSF hydrolyzates were lower than that of E0 specified in the KS standard. Based on the results, RSF might be used as a raw material of environmentally friendly adhesives for the production of plywood panels, but further researches - the increase of solid content of RSF-based adhesives for reducing press time and the microscopic observation of plywood specimen for identifying the relationship between tensile shear strength and the penetration of adhesives into wood structure - are required to commercialize the RSF-based adhesives.

• Applied Chemistry for Engineering
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• v.5 no.5
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• pp.851-856
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• 1994

Compatibility and viscoelasticity in non-solvent type pressure sensitive adhesive of styrene-isoprene-styreno(SIS) block copolymer with tackifier resin were investigated. In the isoprene phase of SIS block copolymer, it was found that it's compatibility with $C^5$ petroleum resin was good, but that with Coumarone-indents resin was not so good. The magnitudes of peel strength, tack, and holding power were as follows : $C^5$ petroleum resin>rosin ester resin>coumarone-indene resin. The tackifier resin with good compatibility in rubber phase was also effective. However, with plateau modulus value of $1{\times}10^6-3{\times}10^6dyn/cm^2$, the effect of pressure sensitive adhesives was excellent.