• Title/Summary/Keyword: adhesive resistance

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Pressure Sensitive Adhesion Performances of SIS/SBS based UV-curable Pressure Sensitive Adhesives using Thiol-ene Reaction (Thiol-ene 반응을 이용한 UV경화형 SIS/SBS계 점착제의 점착물성)

  • Lim, Dong-Hyuk;Do, Hyun-Sung;Kim, Hyun-Joong;Yoon, Goan-Hee;Bang, Jung-Suk
    • Journal of Adhesion and Interface
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    • v.6 no.3
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    • pp.19-25
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    • 2005
  • Synthetic rubber based pressure-sensitive adhesives (PSAs) usually containing SIS or SBS block copolymer, tackifier, plasticizer, and other additives are now widely used on various applications. As these PSAs are physically crosslinked and can be applied without the use of solvent, they are thermally processable and environmentally friendly. However these PSAs cannot be used in high temperature applications and in applications where solvent and chemical resistance properties are required. We developed the PSA adding UV curable system, such as thiol-ene system, to increase adhesion properties at elevated temperature. The adhesion properties such as probe tack, peel strength, shear adhesion failure temperature (SAFT) were evaluated. The probe tack test was conducted with varying probe materials and coating thickness of PSAs. Using the contact angle, the surface property of the cured PSAs was also observed.

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Development of BGA Interconnection Process Using Solderable Anisotropic Conductive Adhesives (Solderable 이방성 도전성 접착제를 이용한 BGA 접합공정 개발)

  • Yim, Byung-Seung;Lee, Jeong Il;Oh, Seung Hoon;Chae, Jong-Yi;Hwang, Min Sub;Kim, Jong-Min
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.4
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    • pp.10-15
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    • 2016
  • In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

Physical and Mechanical Properties of Panels Fabricated with Particle and Fiber by Composition Types (구성형태(構成形態)에 따른 파티클과 파이버로 제조(製造)한 패널의 물리적 및 기계적 성질)

  • Yoon, Hyoung-Un;Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.20 no.2
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    • pp.9-22
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    • 1992
  • The aim of this research was to investigate physical and mechanical properties of various composition panels, each fabricated with a ratio of fiber to particle of 2 to 10. Type A consisted of fiber-faces and particle-core in layered-mat system. Type B consisted of fiberboard-faces on particleboard-core. Type C consisted of fibers and particles in mixed-mat system. The results obtained from tests of bending strength, internal bond, screw holding strength and stability were as follows: 1. The bending strength and internal bonding of both the Type A panel and the Type B panel were higher than those of the Type C panel and three-layered particle board. 2. The mechanical properties of the Type C panel showed the lowest values of all composition methods. It seems that the different compression ratios of the particle and fiber interrupted the densification of the fibers when hot pressed. 3. The dimensional stability of layered-mat system panels consising of fiber-faces and particle-core was better the than control particleboard. 4. In composition methods of particle and fiber, layered-composition method was more resonable than mixed-composition. The Type B panel had the highest mechanical properties of all the composition types. 5. The Type A panel was considered the ideal composition method because of its resistance to delamination between the particle-layer and the fiber-layer and because of its lower adhesive content and more effective manufa cturing process.

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Retentive strength of different intracanal posts in restorations of anterior primary teeth: an in vitro study

  • Memarpour, Mahtab;Shafiei, Fereshteh;Abbaszadeh, Maryam
    • Restorative Dentistry and Endodontics
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    • v.38 no.4
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    • pp.215-221
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    • 2013
  • Objectives: To determine the retentive strength and failure mode of undercut composite post, glass fiber post and polyethylene fiber post luted with flowable composite resin and resin-cement. Materials and Methods: Coronal parts of 120 primary canine teeth were sectioned and specimens were treated endodontically. The teeth were randomly divided into 6 groups (n = 20). Prepared root canals received intracanal retainers with a short composite post, undercut composite post, glass fiber post luted with flowable resin or resin-cement, and polyethylene fiber post luted with flowable resin or resin-cement. After crown reconstruction, samples were tested for retentive strength and failure mode. Statistical analysis was done with one-way ANOVA and Tukey tests (p < 0.05). Results: There were statistically significant differences between groups (p = 0.001). Mean bond strength in the undercut group was significantly greater than in the short composite post (p = 0.030), and the glass fiber post (p = 0.001) and the polyethylene fiber post group luted with resin-cement (p = 0.008). However, the differences between the undercut group and the groups with flowable composite as the luting agent were not significant (p = 0.068, p = 0.557). Adhesive failure was more frequent in the fiber post groups. Conclusions: Although the composite post with undercutting showed the greatest resistance to dislodgement, fiber posts cemented with flowable composite resin provided acceptable results in terms of retentive strength and fracture mode.

Synthesis and Properties of Polyurethane Dispersion Containing Monomeric Diol (Monomeric Diol에 따른 수분산 폴리우레탄의 합성 및 특성)

  • Shin, Sang-Hoon;Jeong, Boo-Young;Chung, Il Doo;Jo, Nam-Ju;Cheon, Jung-Mi;Chun, Jae-Hwan
    • Journal of Adhesion and Interface
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    • v.11 no.3
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    • pp.100-105
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    • 2010
  • In this study, polyurethane dispersion was prepared by polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylolpropionic acid (DMPA), and monomeric diol. The effect of various monomeric diol, polyol/monomeric diol molar ratio and DMPA contents on the properties of polyurethane dispersion were investigated. As the molecular weight of monomeric diol and monomeric diol molar ratio increased, $T_g$ gradually increased. And when DMPA contents increased, also $T_g$ gradually increased. In the results of mechanical properties, when the molecular weight of monomeric diol, monomeric diol molar ratio of polyol/monomeric diol and DMPA contents increased, tensile strength was increased. Finally, optimum peel strength obtained when polyol/monomeric diol ratio was 8 : 2.

Tape-Type Liquid Leakage Film Sensor (액체누설 감지용 테이프형 필름센서)

  • Yu, D.K.;Kim, K.S.;Yub, H.K.;Han, G.H.;Jin, D.J.;Kim, J.H.;Han, S.H.;Cho, G.S.
    • Journal of the Korean Vacuum Society
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    • v.20 no.2
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    • pp.146-154
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    • 2011
  • The adhesive-tape of a liquid leak film sensor including the alarm system is developed. The sensing film is composed of three layers such as base film layer, conductive line layer, and protection film layer. The thickness of film is 300~500 um, the width is 3.55 cm, and the unit length is 200 m. On the conductive line layer, three conducting lines and one resistive line are formulated by the electronic printing method with a conducting ink of silver-nano size. When a liquid leaks for the electricity to be conducted between the conductive line and the resistive line, the position of leakage is monitored by measuring the voltage varied according to the change of resistance between two lines. The error range of sensing position of 200 m film sensor is ${\pm}1m$.

Effect of Talc Content on the Physical Properties of the Epoxy Resins in Conservation Treatment of Stone Monument (석조문화재 보존처리용 에폭시수지 물성에 미치는 탈크 함량의 영향)

  • Kim, Da-Ram;Do, Jin-Young
    • Journal of Conservation Science
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    • v.25 no.1
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    • pp.77-86
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    • 2009
  • The physical properties of the epoxy resins were studied with an addition of filler content and the application of artificial weathering test. When talc as a filler was added to the epoxy resin (L-30), the water resistance seemed to be increased because of the results of the reducing of water absorption rate and the increasing of contact angle. Although the adhesive strength of epoxy resins was not affected by the increasing amount of talc, its compressive strength was reduced. The physical properties of the epoxy resins had different trends according to the site environments. The artificial weathering test with the change of temperature and humidity showed that the changes of water absorption rate and colour differences of the epoxy resins containing talc were lower than the pure epoxy resin itself. However, the contact angle was higher. The artificial weathering test with ultraviolet irradiations showed the opposite result; the damage of epoxy resins was increased with the increasing of talc content. These mean the site environment of the stone monuments should be considered to determine the content of talc added to increase the durability of epoxy resin.

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Formulation of Optimal Design Parameters and Failure Map for Metallic Sandwich Plates with Inner Dimpled Shell Structure Subject to Bending Moment (굽힘 하중을 받는 딤플형 내부구조 금속 샌드위치 판재의 최적설계변수의 수식화 및 파손선도)

  • Seong Dae-Yong;Jung Chang-Gyun;Yoon Seok-Joon;Ahn Dong-Gyu;Yang Dong-Yol
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.8 s.185
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    • pp.127-136
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    • 2006
  • Metallic sandwich plates with inner dimpled shell subject to 3-point bending have been analyzed and then optimized for minimum weight. Inner dimpled shells can be easily fabricated by press or roll with high precision and bonded with same material skin sheets by resistance welding or adhesive bonding. Metallic sandwich plates with inner dimpled shell structure can be optimally designed for minimum weight subject to prescribed combination of bending and transverse shear loads. Fundamental findings for lightweight design are presented through constrained optimization. Failure responses of sandwich plates are predicted and formulated with an assumption of narrow sandwich beam theory. Failure is attributed to four kinds of mechanisms: face yielding, face buckling, dimple buckling and dimple collapse. Optimized shape of inner dimpled shell structure is a hemispherical shell to minimize weight without failure. It is demonstrated that bending stiffness of sandwich plate is 2 or 3 times larger than solid plates with the same strength. Failure mode boundaries and iso-strength lines dependent upon the geometry and yield strain of the material are plotted with respect to geometric parameters on the failure map. Because optimal parameters of maximum strength for given material weight can be selected from the map, analytic solutions for maximum strength are expressed as a function of only material property and proposed strength. These optimal parameters match well with numerical optimal parameters.

Improved Coating of PEDOT : PSS onto CVD Graphene by the Addition of PVA (PVA의 첨가에 의한 CVD 그래핀상 PEDOT : PSS의 코팅성 향상)

  • Park, Min Ui;Shin, Chaeyeon;Kim, Hyeji;Kim, Seung Yeon;Choi, Young Ju;Chung, Dae-won
    • Applied Chemistry for Engineering
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    • v.29 no.6
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    • pp.734-739
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    • 2018
  • We successfully coated poly(3,4-ethylenedioxythiophene) : poly(styrene sulfonate) (PEDOT : PSS) on CVD graphene by adding poly(vinyl alcohol) (PVA) to PEDOT : PSS. Extensive studies on the wettability of coating solutions and electrical properties of formed films led us to conclude that PVA with 89% of the degree of saponification and the molecular weight of less than $100,000gmol^{-1}$ produced optimum results. Furthermore, the optimum content of PVA was found to be 5% of PEDOT : PSS by the solid weight. The film coated by PEDOT : PSS with PVA on CVD graphene displayed a conspicuous improvement in the surface roughness, adhesive property, bending durability and stability in resistance at $160^{\circ}C$, compared to those of using CVD graphene films.

Enhancing Adhesion between Polyphenylene Sulfide Fabric and Polytetrafluoroethylene Film for Thermally Stable Air Filtration Membrane (열안정 공기 여과막용 폴리페닐렌 설파이드 원단과 폴리테트라플루오로에틸렌 필름 사이의 접착력 향상)

  • Jin Uk Kim;Hye Jeong Son;Sang Hoon Kang;Chang Soo Lee
    • Membrane Journal
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    • v.33 no.4
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    • pp.201-210
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    • 2023
  • Dust filter membranes play a crucial role in human life and various industries, as they contribute to several important aspects of human health, safety, and environmental protection. This study presents the development of a polysulfone@polyphenylene sulfide/polytetrafluoroethylene (PSf@PPS/ePTFE) composite dust filter membrane with excellent thermal stability and adhesion properties for high-temperature conditions. FT-IR analysis confirms successful impregnation of PSf adhesive onto PPS fabric and interaction with ePTFE support. FE-SEM images reveal improved fiber interconnection and adhesion with increased PSf concentration. PSf@PPS/ePTFE-5 exhibits the most suitable porous structure. The composite membrane demonstrates exceptional thermal stability up to 400℃. Peel resistance tests show sufficient adhesion for dust filtration, ensuring reliable performance under tough, high-temperature conditions without compromising air permeability. This membrane offers promising potential for industrial applications. Further optimizations and applications can be explored.