• Corrosion Science and Technology
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• v.7 no.5
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• pp.269-273
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• 2008

It is known that the fluoric resin has the most outstanding properties in the extremely acidic environment of high temperature. However, this resin is the thermal hardening type that needs long time heat treatments above $250^{\circ}C$. It's impossible to use in situ in the extremely acidic environment such as a huge FGD ductworks or industrial chemical tanks. Furthermore, even the natural hardening type fluoric coatings which can be hardened less than $120^{\circ}C$ can not be applied to the highly acidic environmental plants because of its chemical resistance. In this study, new fluoric coatings that has excellent thermal resistance, chemical resistance and corrosion resistance has been developed in order to solve above problems and to be applied to the large plant structures in the field. These newly developed coatings are organic and inorganic composite type that have fluoric rubber(100 wt%), fluoric resin(5~50 wt%), oxalates(5~30 wt%), inorganic fillers mixed with plate-type and bulk-type solids(20~150 wt%), hardeners(0.5~5 wt%), and hardening hasteners(0.1~3 wt%). The best chemical and physical properties of these coatings are acquired by variation of adhesive reinforcement agents, dispersants, leveling agents. Mixing ratios of plate-type and bulk-type inorganic fillers influence the thermal properties, abrasive resistance and chemical infiltration properties of coatings. The mixing control is also very important to have homogeneous surface and removing inner voids of coatings.

• Nuclear Engineering and Technology
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• v.55 no.12
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• pp.4317-4328
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• 2023

To ensure the measuring accuracy of the wall temperature, the outer wall temperature measurement values by using three kinds of thermocouple welding methods were analyzed and evaluated in the paper, including single-point flush-mounted in the wall groove method, single-point insert-mounted in the wall groove, and outer surface direct welding method, based on the application of a tube-in-tube condensing heat exchanger. And the impacts of silver, tin, and thermal resistance adhesive as filling materials on wall temperature measurement were also investigated, and the results were compared to that obtained without filling materials. The results showed that the wall temperatures measured by the three welding methods were lower than the theoretically calculated value. And the wall temperature measured by the outer surface direct welding method was lowest under the same experimental conditions. The wall temperatures measured by single-point flush-mounted and insert-mounted in the wall groove methods were also affected by different welding filling materials. It was found that the greater the thermal resistance of filling materials, the smaller the heat loss. By analyzing the reasons for the low measured value of wall temperature, a new wall temperature measurement method was developed to improve the accuracy of the current measurement method. Meanwhile, the outer wall temperature measurement experiments of vertical and horizontal heat transfer tubes were carried out to validate and calibrate the improved outer wall temperature measurement method. The results showed that the average outer wall temperature deviation measured by the improved wall temperature measurement method ranged from - 0.82% to +2.29% for vertical tubes and - 4.75% to - 1.44% for horizontal tubes, and the improved measurement method had good measurement accuracy.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2222-2227
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• 2007

Newly structured metal-supported solid oxide fuel cell was fabricated and characterized by impedance analysis and galvanodynamic experiment. Using a cermet adhesive, thin ceramic layer composed of anode(Ni/YSZ) and electrolyte(YSZ) was joined with STS430 metal support of which flow channel was fabricated. $La_{0.8}Sr_{0.2}Co_{0.4}Mn_{0.6}O_3$ perovskite oxide was used as cathode material. Single cell performance was increased and saturated at operating time to 300hours at 800$^{\circ}C$ because of cathode sintering effect. The sintering effect was reinvestigated by half cell test and exchange current density was measured as 0.005A/$cm^2$. Maximum power density of the cell was 0.09W/$cm^2$ at 800$^{\circ}C$. Numerical analysis was carried out to classify main factors influencing the single cell performances. Compared to experimental IV curve, simulated curve based on experimental parameters such as exchange current density was in good agreement.

• Applied Chemistry for Engineering
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• v.5 no.5
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• pp.851-856
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• 1994

Compatibility and viscoelasticity in non-solvent type pressure sensitive adhesive of styrene-isoprene-styreno(SIS) block copolymer with tackifier resin were investigated. In the isoprene phase of SIS block copolymer, it was found that it's compatibility with $C^5$ petroleum resin was good, but that with Coumarone-indents resin was not so good. The magnitudes of peel strength, tack, and holding power were as follows : $C^5$ petroleum resin>rosin ester resin>coumarone-indene resin. The tackifier resin with good compatibility in rubber phase was also effective. However, with plateau modulus value of $1{\times}10^6-3{\times}10^6dyn/cm^2$, the effect of pressure sensitive adhesives was excellent.

• Transactions on Electrical and Electronic Materials
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• v.8 no.2
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• pp.89-92
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• 2007

$CuInSe_2$ thin film were prepared in order to clarify optimum conditions for growth of the thin film depending upon process, and then by changing a number of deposition conditions and heat treatment conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were deposited in the named order. Among them, Cu and In were deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1:1, while the annealing temperature having an effect on the quality of the thin film was changed from $200\;^{\circ}C$ to $350\;^{\circ}C$ at intervals of $50\;^{\circ}C$.

• Transactions on Electrical and Electronic Materials
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• v.14 no.1
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• pp.20-23
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• 2013

When applying superconducting wire to power machines, an investigation needs to be carried out on the characteristics of wire phase changes in connection with the insulating layer. This study examined trends in the increase of the wire's resistance and the characteristics of its recovery from quenching by a current-applied cycle at temperatures of 90 K, 180 K, and 250 K. The procedure was conducted based on the thickness and presence (or absence) of the insulating wire layers. To achieve this, YBCO thin-film wires with the same critical temperatures were prepared with copper and stainless steel stabilizing layers. At levels (-one, three, and five-), with superior performance, polyimide pressure-sensitive adhesive tape was attached to the wires at a very low temperature. The eight prepared test samples were wound around the linear frames. The wire's voltage and current created from the phase change characteristics were measured at the wire's prescribed temperature, using the four-point probe method. The wire's resistance and recovery characteristics were examined for each cycle at temperatures of 90 K, 180 K, and 250 K.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.86-90
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• 2008

$CuInSe_2$ thin film were prepared in order to clarify optimum conditions for growth of the thin film depending upon process, and then by changing a number of deposition conditions and heat treatment conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were deposited in the named order. Among them, Cu and In were deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1:1, while the annealing temperature having an effect on the quality of the thin film was changed from $200^{\circ}C$ to $350^{\circ}C$ at intervals of $50^{\circ}C$.

• Current Photovoltaic Research
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• v.4 no.2
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• Elastomers and Composites
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• v.35 no.4
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• pp.296-302
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• 2000

The surfaces of injection and pressure-molded sheets of poly(ethylene-covulylacetate)(EVA) foams used for shoe mid-sole were treated with low temperature plasma to improve adhesion with a water-based polyurethane adhesives. Several experimental variables were considered, such as radio frequency power, treating time, type of gas. gas flow, and distance between electrode and sample. The modificated surface by plasma treatment were characterized using contact angle meter, scanning electron microscopy(SEM), universal testing machine(UTM). Adhesion was tested by T-peel tests of treated EVA foams/polyurethane adhesive joints. The treatment in the low temperature plasma produced a noticeable decrease in contact angle. The peel strength of EVA foams treated with plasma was increased with plasma treating time, and gas flow.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.