• Journal of Conservation Science
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• v.35 no.6
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• pp.681-688
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• 2019

In this study, the characteristics of natural and synthetic adhesives used in woodcraft were evaluated. The pattern of deterioration of wood and adhesives according to changes in temperature and humidity were compared. For materials, one type of anlmal glue, three kinds of polyvinyl acetate adhesives, one type of epoxy adhesive and one type of zelkova wood were selected. Characteristics of physical and chemical characteristics, weather resistance and drying speed assessment were carried out. The adhesion characteristic evaluation showed that the adhesion strength of anlmal glue and one type of polyvinyl acetate adhesive were 6.54 N/㎟ and 7.01 N/㎟, pH meter of anlmal glue and polyvinyl acetate adhesives was pH 7.03 and pH 3.32-3.59 which were range of available as an adhesive. According to the test results of weather resistance, epoxy adhesives had the highest decreasing value in adhesion strength after deterioration. In the reversible test of the adhesive, it was found to be highly reversible in NaOH, a soluble solvent excluding epoxy, but attention is required when using the wood since it may show discoloration during processing.

• Journal of the korean academy of Pediatric Dentistry
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• v.33 no.4
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• pp.661-672
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• 2006

This study was performed to compare the shear bond strength of AQ Bond $Plus^{TM}$ with AQ $Bond^{TM}$ and Single $Bond^{TM}$. Also by observing the fractured interface under scanning electro-microscope, the fracture pattern and the quality of hybrid layer were analyzed. The possibility of clinical application of all-in-one system which has an advantage to reduce chair time for children with difficult behavior pattern was evaluated, The results obtained are as follows ; 1. There was no significant difference between AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$ in shear bond strength and Single Bond showed the highest bond strength with statistical significant difference (p<0.05). 2. Adhesive fracture pattern was mainly observed in both enamel/dentin in AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$ group while Single Bond group showed equal numbers for cohesive and adhesive pattern. 3. Under scanning electro-microscope, resin tags observed in AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$ were very weak and tangled while strong and thick tags were shown with many lateral branches in Single Bond. Careful case selection and accurate clinical application is recommended when using AQ $Bond^{TM}$ and AQ Bond $Plus^{TM}$considering the result showing its weaker strength than Single $Bond^{TM}$.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.2
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• pp.336-354
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• 1998

Traditionally, many kinds of mechanical bonding techniques were used for bonding resins to the surface of the metal alloys. If there is a seperation between resin and metal junction by stress accumulation and temperature change of oral cavity, the cracks or crazing may occur, accompanied by failure of resin bonding to metal. This study was designed to compare the shear bond strength of the type IV gold alloy and Cr-Co alloy surfaces treated with various methods and thermocycling. Universal Instron (Model 1000) and scanning electron microscope (JEOL, Japan) was used to record the shear bond strength of 5 groups. Forty specimens were made for each group ; group 1 was treated with sandblasting only, group 2 was coated with V-primer after sandblasting, group 3 was coated with Metal primer, group 4 wase coated with MR Bond and group 5 was coated with silane. After treated with various methods, thermocycling was done for half of the each group. The surfaces of failed pattern were observed with SEM. The results were as follows : 1. Shear bond strength of the group 1 was lower than that of another groups in type IV gold alloys and bond strength of the group 1, 2 were lower than that of group 3, 4, 5 in Cr-Co alloys. 2. Shear bond strength of the gold alloy with resin was higher than that of Cr-Co alloy when specimens were coated with V-primer. 3. Shear bond strength of the Co-Cr alloys with resin was higher than that of gold alloys when specimens were coated with Metal primer. 4. The bond strength of all specimens did not decreased significantly after thermocycling. 5. Adhesive failures were found in group 1 and Cr-Co alloy in group 2, but adhesive and cohesive failures were found in another groups.

• The Journal of the Convergence on Culture Technology
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• v.8 no.5
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• pp.749-754
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• 2022

High adhesion and water resistance of the skin surface are required for wearable and skin-attachable electronic patches in various medical applications. In this study, we report a stretchable electronic patch that mimics the drainable structure pattern of the hexagonal channels of frog's pads and the sucker of an octopus based on carbon-based conductive polymer composite materials. The hexagonal channel structure that mimics the pads of frogs drains water and improves adhesion through crack arresting effect, and the suction structure that mimics an octopus sucker shows high adhesion on wet surfaces. In addition, the high-adhesive electronic patch has excellent adhesion to various surfaces such as silicone wafer (max. 4.06 N/cm²) and skin replica surface (max. 1.84 N/cm²) in dry and wet conditions. The high skin-adhesive electronic patch made of a polymer composite material based on a polymer matrix and carbon particles can reliably detect electrocardiogram (ECG) in dry and humid environments. The proposed electronic patch presents potential applications for wearable and skin-attachable electronic devices for detecting various biosignals.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.107-112
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• 2022

In this study, a silver paste capable of UV curing without using any solvent was developed. The viscosity and viscoelasticity of the silver paste developed as a solvent-free type were measured. And after printing the pattern by screen printing, an electrode coating film was formed by UV curing. Conductivity, pencil hardness, and adhesive force of the formed electrode coating film were evaluated. Finally, the curing characteristics of the electrode coating film were evaluated by TGA and FT-IR. Summarizing these results, in terms of conductivity, adhesion, and curing characteristics, it was found that Paste (4), that is, silver paste obtained by mixing 1.2 ㎛ spherical silver powder and 50 nm silver powder at 72:8% had the best physical properties.

• The korean journal of orthodontics
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• v.32 no.4 s.93
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• pp.293-300
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• 2002

The purpose of this study was to evaluate the clinical effectiveness of hydrophilic primer, which claim to retain adequate bond strength on moistened enamel resulting from moisture or saliva contamination, by comparing the shear bond strength and adhesive failure patterns of brackets bonded using hydrophilic primer and conventional hydrophobic primer. Brackets were bonded to human premolars embedded in metal cylinders utilizing light cured adhesive, primed with either a hydrophilic primer(Transbond fm primer) or a conventional hydrophobic primer(Transbond XT primer). Each sample was exposed to varying degrees of artificial saliva contamination during the priming process. The shear bond strength was measured using a universal testing machine, and the adhesive failure patterns after debonding were visually examined by strereomicroscope and assessed using the adhesive remnant index(ARI). The results were as follows 1. In dry conditions, no significant differences in shear bond strength between Transbond W and Transbond XT primers were found. 2. Transbond MIP primer exhibited a significantly higher shear bond strength than Transbond XT primer in saliva-contaminated conditions, regardless of the degree of contamination. 3. When contaminated with one coat of saliva, Transbond MIP primer did not exhibit significant differences in shear bond strength compared to the dry condition. When contaminated with two coats of saliva, Transbond MIP primer exhibited a singnificantly lower shear bond strength compared to the dry condition. 4. The adhesive remnant index of the adhesive failure pattern had a tendency to decrease, as the degree of saliva contamination increased. Bracket-adhesive interface failure was observed in more than half of the saliva contaminated samples utilizing Transbond MIP primer, whereas the bond failure sites of the Transbond XT primer samples occurred almost exclusively at the adhesive-enamel interface in saliva-contaminated conditions. The results of this study suggest that in cases where moisture control is difficult, Transbond MIP primer is an effective alternative to conventional hydrophobic primers.

• Journal of Dental Rehabilitation and Applied Science
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• v.35 no.2
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• pp.72-80
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• 2019

Purpose: The purpose of this study is to compare and analyze the shear bond strength and fracture pattern in different enamel tooth surface treatments for resin splinting materials. Materials and Methods: G-FIX and LightFix were used as tooth splinting materials. Twenty bovine mandibular incisors were used for the preparation of the specimens. The exposed enamel surface was separated into four parts. Each tooth was treated with 37% phosphoric acid, 37% phosphoric acid + adhesive resin, 37% phosphoric acid + G-premio bond, and G-premio bond for each fraction. Shear bond strength was measured using a universal testing machine. After measuring the shear bond strength, the fractured surface of the specimen was magnified with a microscope to observe the fracture pattern. Two-way ANOVA was used to verify the interaction between the material and the surface treatment method. One-way ANOVA was used for comparison between the surface treatment methods of each material and post-hoc test was conducted with Scheffe's test. An independent t-test was conducted to compare shear bond strengths between materials in each surface treatment method. All statistics were conducted at 95% significance level. Results: G-FIX, a tooth splinting resin, showed similar shear bonding strength when additional adhesive resins were used when material was applied after only acid etching, and LightFix showed the highest shear bonding strength when additional adhesive resins were used after the acid etching. In addition, both G-FIX and LightFix showed the lowest shear bond strength when only self-etching adhesive was applied without additional acid etching. Verification of interactions observed interconnection between resins and surface treatment methods. Most of the mixed failure was observed in all counties. Conclusion: When using G-FIX and LightFix, which are tooth-splinting materials, it is considered that sufficient adhesion will be achieved even after applying only acid etching as instructed by the manufacturer.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.8
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• pp.2061-2068
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• 1993

Condition monitoring technology is of great importance for the maintenance of complex machinery in view of its early monitoring of the abnormal condition and the protection against failure. Several methods have been used for the detection of failure of journal bearings, one of the main elements of mechanical system. The methods most frequently used are vibration and temperature monitoring, but these are unable to monitor the wear conditions exactly. In this study, an ultrasonic measument method, one of the non-destructive testing methods, was introduced as the monitoring technology. Furtermore a pattem recognition method was applied to analyze the ultrasonic signal. The monitoring system using the pattern recognition method is composed of digital signal processing units and uses Hamming net algorithm for the recognition of ultrasonic waves. From the journal bearing wear test, the occurrence of adhesive wear of the white metal in rubbing contact with the shaft was exactly detected by this system, and the wear status of the journal bearing was monitored by measuring the wear thickness.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.1-12
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• 2012

In this experiment, we have manufactured thermal-curable silver pastes for direct printing. And to enhance conductivity, printability, adhesion and hardness during polymer direct-gravure prints, we have manufactured Ag pastes by adding variety of filter contents. Then we have investigated characteristics of rheology in paste according to the gravure printability and the properties of printed conductive patterns. Depending on a variety of Ag powder, there was a big difference in sharpness of printed pattern. And also by the use of carbon, there was a big difference in amount of solvent used, conductivity and in hardness. We could improve doctoring and the sharpness of a pattern by adding Ag paste in carbon particle, but as we have used nano-sized particle, there was an increase in the amount of solvent used and also we have found out that it gives a bad effect as adhesive and hardness becomes weaker. Even though Ag particle has the same spherical shape, the surface treatments could differ from one another. And by the appropriate choice and with the suitable combination of Ag powder, excellent printability and conductivity could be obtained.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.