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http://dx.doi.org/10.6117/kmeps.2022.29.2.107

Development of Solvent-Free Type for UV-Curable Silver Paste  

Jang, Min Yong (Department of Nanotechnology Engineering, Pukyong National University)
Nam, Hyun Jin (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
Nam, Su Yong (Department of Nanotechnology Engineering, Pukyong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.2, 2022 , pp. 107-112 More about this Journal
Abstract
In this study, a silver paste capable of UV curing without using any solvent was developed. The viscosity and viscoelasticity of the silver paste developed as a solvent-free type were measured. And after printing the pattern by screen printing, an electrode coating film was formed by UV curing. Conductivity, pencil hardness, and adhesive force of the formed electrode coating film were evaluated. Finally, the curing characteristics of the electrode coating film were evaluated by TGA and FT-IR. Summarizing these results, in terms of conductivity, adhesion, and curing characteristics, it was found that Paste (4), that is, silver paste obtained by mixing 1.2 ㎛ spherical silver powder and 50 nm silver powder at 72:8% had the best physical properties.
Keywords
Silver paste; UV-curing; Solvent-free; Conductivity; Adhesive;
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