• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Tribology and Lubricants
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• v.22 no.5
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• pp.243-251
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• 2006

Molecular dynamics simulations of nanoimprint lithography NIL) are performed in order to investigate effects of process parameters, such as stamp shape, imprinting temperature and adhesive energy, on nanoimprint lithography process and pattern transfer. The simulation model consists of an amorphous $SiO_{2}$ stamp with line pattern, an amorphous poly-(methylmethacrylate) (PMMA) film and an Si substrate under periodic boundary condition in horizontal direction to represent a real NIL process imprinting long line patterns. The pattern transfer behavior and its related phenomena are investigated by analyzing polymer deformation characteristics, stress distribution and imprinting force. In addition, their dependency on the process parameters are also discussed by varying stamp pattern shapes, adhesive energy between stamp and polymer film, and imprinting temperature. Simulation results indicate that triangular pattern has advantages of low imprinting force, small elastic recovery after separation, and low pattern failure. Adhesive energy between surface is found to be critical to successful pattern transfer without pattern failure. Finally, high imprinting temperature above glass transition temperature reduces the imprinting force.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.2
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• pp.142-148
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• 2012

This study presents the assessment results of adhesive properties on the interface between a silicon wafer and nano-scale polymer thin film pattern through UAFM images by using the contact resonance frequency of the cantilever. For the experiment, we varied surface treatment processes for the silicon wafer and fabricated a 300nm polymer thin film pattern through lithography. Images from the optical microscope were used to compare the produced test specimens for adhesive condition and the critical load value from the nano scratch test was used to verify the adhesive condition of the nano pattern. Each test specimen resulted in a $1{\mu}m{\times}1{\mu}m$ surface image and subsurface adhesive image. Adhesive condition was evaluated by image contrast differences on the interface according to the changing amplitudes and phases of contact resonance frequency.

• Restorative Dentistry and Endodontics
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• v.24 no.2
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• pp.381-391
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• 1999

A new 5th generation adhesive system(ONE-STEP) has been supplied which operators can apply to conditioned tooth surfaces by one simplified step. The purpose of this study was to determine whether different methods of adhesive application and various air drying duration after applying adhesive affect the shear bond strength of composite resin to dentin, and to evaluate the adhesive pattern of composite resin and dentin under SEM. Seventy-seven extracted human molar teeth were cleaned and mounted in palstic test tubes. The occlusal dentin surfaces were exposed with Diamond Wheel Saw and smoothed with Lapping and Polishing Machine (South Bay Technology Co., U.S.A.). Teeth were randomly divided into 7 groups (n=11), In experimental A group, adhesive was applied to dentin with agitation for 20 sec. In experimental N-A group, adhesive were continuously applied to dentin for 20 sec. Also control and experimental 1, 2, 3, 4 groups were dried for 10, 0, 5, 20, 30 seconds after applying adhesive, respectively, Adhesives were light cured for 10 sec. A gelatin capsule 5mm in diameter was filled with Aelitefil$^{TM}$ composite resin, placed on the treated dentin surface and light cured for 40 see, from three sides, All specimens were stored in distilled water at room temperature for 24 hours. The shear bond strengths were measured using a universal testing machine(AGS-1000 4D, Japan) at a crosshead speed of 5mm/min. An one-way ANOVA and LSD test were used for statistical analysis of the data. For SEM evaluation, seven specimens were made and sectioned. Representive postfracture and seven specimens were mounted on brass stubs, sputter-coated with gold and observed under SEM. The results were as follows : 1. The shear bond strength of experimental A group which adhesive were applied to dentin with agitation was higher than that of experimental N-A group (continuous application), and there was significant difference between two groups (p<0.01). 2. The interface between composite and dentin according to different application methods showed close adaptation in experimental A group and showed tinny gap in experimental N-A group. 3. The shear bond strength accoding to various air drying duration was the lowest value(7.57${\pm}$2.60 MPa) in experimental 1 group, so there was significant difference between experimental 1 group and other four groups (p<0.05). But there was no significant difference of shear bond strength between four groups (p>0.05). 4. The interface between composite and dentin according to various air drying duration showed close adaptation in control group and tinny gap in experimental 3 and 4 groups. But experimental 1 and 2 groups showed $30{\mu}$ and 6 - $10{\mu}m$ thick gaps, respectively.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.64-72
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• 1994

Zinc Phosphate Cement hand been used for about more than 100 years in luting of cast gold inlay. But many scientists had been trying to develop the new form of luting agent because the ZPC hand shown the lack of adhesiveness on the tooth structure and the toxicity to the pulp tissue. Recently many researches about the surface treatment of the cast body are being done to increase the adhesion of cement to it. The conventional Class I gold inlays were fabricated in the 20 permanent molars. After the internal surface of the cast body was sandblasted with $Al_2O_3$ particles and was tin-plated, the inlays were cemented with adhesive cement [G I cement and resin cement(Super-Bond & $Panavia_{EX}$)] and the evaluation on the adhesion pattern, adhesive strength and the fracture pattern of the adhesive cast gold inlay was compared to that of the cast gold inlay cemented conventionally with ZPC. The results were as follows : 1. The surface roughness of the cast body was increased significantly after sandblasting with the $Al_2O_3$ particles and the tin oxide layer, which was consisted of round particles, came into being. 2. The bond strength was in the order of Super-Bond, ZPC, Fuji I, $Panavia_{EX}$ group. The group cemented with Super-Bond showed statistically greater strength than the other groups(p<0.05). 3. The group cemented with ZPC was fallen apart by principal adhesion failure and that with Fuji I was by complete adhesion failure. But the group with Super-Bond showed pricncipal cohesive failure pattern and in the group with $Panavia_{EX}$, complete cohesive fracture pattern was shown and small protion of tooth structure was fractured out with cast body and the fractured surface showed the figure just as the enamel prism. 4. Various gaps were shown at the pulpal side regardless of little gap at the side walls of the cavity in all groups. Only the Super-Bond was attached to the tooth structure and the other cements were detached from both the tooth and the cast body.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.413-414
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• 2010

• Restorative Dentistry and Endodontics
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• v.12 no.1
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• pp.95-105
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• 1986

For the purpose of obtaining a basic data in selecting a suitable material with clinical care, this study was designed to measure the shear stress and to examine the fracture pattern of various dentin bonding restorative materials using 43 extracted bicuspids. The following results were obtained. 1. In dentin, Silux/Scotchbond group showed the highest value ($34.5{\pm}14.7kg/cm^2$) and Fuji Ionomer Type II group and Heliosit/Dentin-Adhesit group showed almost same bond strength in the next place. Durafill/Dentin-Adhesive group showed an infinitesimal value. ($3.1{\pm}1.4kg/cm^2$) 2. Every group showed no difference in bond strength between upper and lower teeth. Between buccal and lingual surfaces. Fuji Ionomer Type II and Durafill/Dentin-Adhesive groups showed too. But, in Silux/Scotchbond and Heliosit/Dentin-Adhesit groups, it was shown that the bond strength in lingual was stronger than in buccal. 3. There was resin fracture with cohesive fracture of bonding agent in Enamel group. In dentin, adhesive-cohesive fracture and adhesive fracture were shown. 4. The stronger bond strength was, the more frequently cohesive fracture occurred. Dentin-Adhesit group showed specific shining appearance as if varnish became hard.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.59-68
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• 2012

As one of the eletronic device industries has been developed by using a recent printing method, the consumption of Ag paste has been on the rise as well. The printing method has simple processes in comparison with other methods. Also it enables to be large-scaled and to lower price ranges. If UV curing system would be applied to the printing method, energy consumption and dangerousness from curing system can be minimized in a short period of time so that its method can be more eco-friendly. This study conducted an experiment in order to make UV curing Ag paste which is feasible to implement micro patterns with different dispersing agents. The purpose of the study is to analysis the suitable printability for micro pattern and to test dispersibility, hardening properties, conductivity and adhesive stength by measuring viscosity, TI(thixotropy index), G', G", $tan{\delta}$(G"/G') after making paste. We have experimented with four dispersing agents. After We did an analysis of characteristic of rheology, conductivity and adhesive stength, etc, We confirmed that the paste added FP 3060 has excellent dispersibility, conductivity and adhesive stength. If the paste has excellent dispersibility, we will expect that micro pattern is made by that.

• Journal of Korea Multimedia Society
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• v.12 no.7
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• pp.971-978
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• 2009

The paper is a phase controlled loop antenna for multi-media devices. We developed a phase control loop pattern arrangement methods for loop antenna in mobile devices like as a cell phone and PCS, WCDMA. In the loop antenna pattern, arrange close adhesive the loop antenna pattern $180^\circ$ cycle in wave length, the radiated electro-magnetic wave from close adhesive loop pattern become to coherent wave than the phase controlled loop antenna has high efficiency and high radiation gain. To acquire a wide band width on phase controlled loop antenna, we arrange a multiple phase controlled loop pattern that has a different length each other. Different length for each other loop pattern cause a different frequency that we can acquire a wide band width for loop antenna from close adhesive phase control. In experiment, we designed a CDMA850 mobile multi-media antenna in 20mm$\times$20mm area thickness 0.4mm, the radiation efficiency is over 60% and radiation gain is over 0dBi.

• The korean journal of orthodontics
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• v.34 no.4 s.105
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• pp.333-342
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• 2004

The purpose of this study was to evaluate the clinical effectiveness of a plasma arc light and light emitting diode (LED), compared with shear bond strength and the failure pattern of brackets bonded with visible light in direct bonding. Brackets were bonded with Transbond XT to 60 human premolars embedded in the resin blocks according to different light-curing methods. Then, the shear bond strength of each group was measured using a universal testing machine (Instron) and the adhesive failure pattern after debonding was visually examined by light microscope. The results were as follows: 1. The shear bond strength showed no significant difference between the visible light and light emitting diode, but the plasma arc light exhibited a significantly lower shear bond strength compared with the visible light and light emitting diode. 2. In the visible light and light emitting diode, adhesive failure patterns were similar. Bond failure occurred more frequently at the enamel-adhesive interface. 3. The bonding failure of brackets bonded with plasma arc light occurred more frequently at the bracket-adhesive interface. The results of this study suggest that plasma arc light, light emitting diode and visible light are all clinically useful in the direct bonding of orthodontic brackets.