• Journal of Powder Materials
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• v.27 no.4
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• pp.333-338
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• 2020

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu₃P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/㎠. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

• Restorative Dentistry and Endodontics
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• v.28 no.3
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• pp.209-221
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• 2003

The objectiveness of this study was to evaluate whether low-viscosity composite can bond effectively to dentin surface without bonding resin. The low-viscosity composites being 50wt% filler content were made by the inclusion of bonding resin of two self-etching systems(Cleafil SE Bond, Unifil Bond) varied with contents as 0, 10, 20, 30, 40, 50wt%. Exposed dentin surfaces of extracted 3rd molars are used. Dentin bond strengths were measured. The tests were carried out with a micro-shear device placed testing machine at a CHS of 1mm/min after a low-viscosity composite was filled into an iris cut from micro tygon tubing with internal diameter approximately 0.8mm and height of 1.0mm. 1 Flexural strength and modulus was increased with the addition of bonding resin. 2. Micro-shear bond strength to dentin was improved according to content of bonding resin irrespective of applying or not bonding resin in bonding procedure, and that of Clearfil SE Bond groups was higher than Unifil Bond. 3. There were no significant difference whether use of each bonding resin in bonding procedure for S-40, S-50, U-50(p＞0.05). 4. In SEM examination, resin was well infiltrated into dentin after primed with self-etching primer only for S-50 and U-50 in spite of the formation of thinner hybrid layer. Low viscosity composite including some functional monomer may be used as dentin bonding resin without an intermediary bonding agent. It makes a simplified bonding procedure and foresees the possibility of self-adhesive restorative material.

• Polymer(Korea)
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• v.35 no.5
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• pp.488-492
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• 2011

Three isocyanatopropyldimethoxysilylpolydimethylsiloxanes(IDMSi-PDMS) were synthesised from the reaction of isocyanatopropyltrimethoxysilane with monohydroxyl group termainated PDMS having different molecular weight($M_n$=5000, 10000, and 20000). Then PDMS modified polyurethane hybrid elastomer(PSMPH) were prepared from the reaction of IDMSi-PDMS with ${\alpha}$, ${\omega}$-hydroxyl group terminated polyurethane. PSMPH sealant was prepared by compounding PSMPH elastomer with additives such as plasticizer, adhesion promoter, crosslinking agent, vicosity increasing agent, inorganic filler, and catalyst at room temperature under nitrogen atmosphere. The methoxy group in the PSMPH sealant should be crosslinked with the hydroxyl group in the building stone or moisture by typical sol-gel reaction. The adhesive strength of the sealant having PDMS of $M_n$=5000 showed 40.28 kg of maxium load and 20.14 kg of break load. The shrinkage rate of the sealant having PDMS of $M_n$=20000 was 5.7% as the best result. Also, their skin over time, slump, oil content after 8 days under oil soaked paper and alkaline resistance characteristics show good results.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• Journal of Korean Society of Forest Science
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• v.60 no.1
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• pp.51-57
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• 1983

Properties and glue shear strength of each water soluble rues-phenol copolymer adhesive and phenolic resin adhesive were examined as a high temperature curing binder through the manufacture of plywood made of Kapur veneer. The former has different molar ratio and the latter was made from different catalyst method. The results are summarized as follows: 1) Specific gravities of air dried plywood manufactured from each adhesive ranged from 0.67 to 0.82 and their moisture contents met the K.S. standard 2) In dry and wet shear strength, adhesives with 60 percent of non volatile content showed higher values than those with 50 percent except phenolic resin. Urea-phenol copolymer resin with 20 percent of phenol content exhibited the highest, and that with 70 percent the lowest. Filling effect of wood flour on the bonding strength is great in urea-phenol copolymer resin with more than 50 percent of phenol content, especially significant in 50 percent of non volatile content including alkali catalyst phenolic resin. Alkali and acid catalyst methods were the highest among the adhesive manufacture methods. In wet strength, urea resin belongs to the lowest group. 3) In glue shear strength after boiling and drying test, no method for manufacturing phenolic formaldehyde resin adhesive was stronger than alkali and acid catalyst methods. Phenolic resin made from alkali catalyst method needs a wood flour filler to improve the bonding quality. Urea-phenol copolymer resin with 10 percent of phenol content showed the reasonable water resistance.

• Journal of the Korean Academy of Esthetic Dentistry
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• v.7 no.1
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• pp.18-26
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• 1998

The improvement of esthetic dentistry has been accelerated from the development of composite resin and dentin-enamel adhesive since 1980's. The indirect composite resin restorations have more accurate proximal contact point and occlusal form than direct restoration. And the side effect of resin shrinkage is minimal because the amount of composite used in oral cavity is limited in cement space. As a results, marginal leakage, hypersensitivity, secondary caries, and discoloration are significantly diminished. The first generation laboratory composite resin used in indirect resin restoration had been widespread in 1980's and the second generation laboratory composite resins were developed in 1990's. The second generation laboratory composite resins are called Ceramic Polymer. The physical properties of Ceramic Polymer are improved because of high content of inorganic filler, and the esthetics and biocompatibility are better than that of the first generation resin. So the application range using composite resin have been broadened. The purpose of this paper is to introduce Targis & Vectris system that is classified to second generation laboratory composite and to report several cases in which the system was utilized for restoration.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Journal of Conservation Science
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• v.36 no.6
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• pp.475-482
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• 2020

In this study, we synthesized rosin-based epoxy resin and manufactured two components adhesives and epoxy putty using this epoxy resin. This study manufactured main element of adhesives for enabling it to form epoxide group by letting epichlorohydrin react to maleic anhydride modified rosin, and used room temperature curing type triethylenetetramine for hardener. The ratio between main element and hardener of of manufactured adhesives was 100 : 20, and main element and hardener of filling material were manufactured as clay type by mixing them with filler. Manufactured undiluted adhesives and filling material showed very stable result in the adhesive strength (3.06 MPa) and ultraviolet irradiation, showing outstanding result comparing to existing restoration adhesives. And it is considered a material having reversibility as it was dissolved in organic solvents such as acetone and toluene after being hardened, which showed a result that solved part of possible problems caused by restoration. As a result of use and application of manufactured adhesives and filling material for actual wood crafts, they showed excellent results in workability, stability, removability etc., and this study confirmed that the material can be used for and applied to various fields.

• Journal of Dental Rehabilitation and Applied Science
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• v.21 no.1
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• pp.69-81
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• 2005

The objective of this study was to evaluate the toothbrush abrasion characteristics of class V restorations. Thirty extracted human premolars, which were collected from oral surgery clinics were used. We mounted five teeth in a metal ring mold of 50 mm in diameter and 15 mm in height using chemically cured acrylic resin. Class V cavities were prepared in lingual cervical root surfaces and restored using one of following restorative materials : Dentin Conditioner/Fuji II LC (Group FL), All Bond II/Z-250 (Group ZT), One-up Bond F/Palfigue Estelite (Group PE), F2000 Primer/Adhesive (Group FT), and Prime & Bond 2.1/Dyract AP (Group DR). They were stored under distilled water at $37^{\circ}C$ for seven days. The toothbrush abrasion test was conducted using a wear testing machine of pin-on disk type under a load of 1.5 N for 100,000 cycles. We have examined the bonded interfaces, the changes of surface roughness and color of abraded surfaces. From this experiment, the following results were obtained. 1. The change of surface roughness showed high degree: RMGIC>compomer>composite resin (p<0.05). 2. Because of the protrusion and missing of filler particles, SEM observation of abraded surfaces of RMGIC and compomers revealed the increase of surface roughness due to the selective removal of matrix resin. 3. The color change by toothbrush abrasion was affected in large part by the change of $L^*$ and $b^*$ of resin composites (p<0.05). 4. The color change by toothbrush abrasion was so small to detect by human eyes. 5. SEM observation of abraded surfaces revealed the interface bonding was the best in the FT group.

• Elastomers and Composites
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• v.52 no.2
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• pp.136-142
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• 2017

Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.